ON Semiconductor FDB52N20TM

SKU: FDB52N20TM-11

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Manufacturer Part :
FDB52N20TM
Manufacturer :
ON Semiconductor
Package :
RoHS :
ROHS3 Compliant
FDB52N20TM Datasheet :

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Description

Specification

Processor

Manufacturer

ON Semiconductor

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Weight

1.31247g

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2005

Series

UniFET™

JESD-609 Code

e3

Pbfree Code

yes

Power Dissipation

357W

Part Status

Active

Number of Terminations

2

ECCN Code

EAR99

Resistance

49mOhm

Voltage - Rated DC

200V

Terminal Form

GULL WING

Current Rating

52A

JESD-30 Code

R-PSSO-G2

Number of Elements

1

Number of Channels

1

Power Dissipation-Max

357W Tc

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Contact Plating

Tin

Factory Lead Time

6 Weeks

Continuous Drain Current (ID)

52A

Turn On Delay Time

53 ns

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

49m Ω @ 26A, 10V

Vgs(th) (Max) @ Id

5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2900pF @ 25V

Current - Continuous Drain (Id) @ 25°C

52A Tc

Gate Charge (Qg) (Max) @ Vgs

63nC @ 10V

Rise Time

160ns

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±30V

Fall Time (Typ)

150 ns

Turn-Off Delay Time

48 ns

Threshold Voltage

5V

Gate to Source Voltage (Vgs)

30V

Case Connection

DRAIN

Drain to Source Breakdown Voltage

200V

Pulsed Drain Current-Max (IDM)

208A

Avalanche Energy Rating (Eas)

2520 mJ

Max Junction Temperature (Tj)

150°C

Nominal Vgs

5 V

Height

5.08mm

Length

9.98mm

Width

10.16mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

FET Type

N-Channel

Lead Free

Lead Free

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