NXP USA Inc. BSR56,215

SKU: BSR56,215-9

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Manufacturer Part :
BSR56,215
Manufacturer :
NXP USA Inc.
Package :
TO-236-3, SC-59, SOT-23-3
RoHS :
ROHS3 Compliant
BSR56,215 Datasheet :
BSR56,215

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Description

Specification

Processor

Manufacturer

NXP USA Inc.

Time@Peak Reflow Temperature-Max (s)

40

Surface Mount

YES

Transistor Element Material

SILICON

Number of Elements

1

Operating Temperature

150°C TJ

Packaging

Tape & Reel (TR)

Published

1997

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

JESD-609 Code

e3

Number of Terminations

3

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

HTS Code

8541.21.00.95

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Package / Case

TO-236-3, SC-59, SOT-23-3

Mounting Type

Surface Mount

DS Breakdown Voltage-Min

40V

FET Technology

JUNCTION

Qualification Status

Not Qualified

Configuration

SINGLE

Operating Mode

DEPLETION MODE

Power - Max

250mW

FET Type

N-Channel

Transistor Application

SWITCHING

Drain-source On Resistance-Max

25Ohm

Pin Count

3

Base Part Number

BSR56

Power Dissipation-Max (Abs)

0.3W

Feedback Cap-Max (Crss)

5 pF

Current - Drain (Idss) @ Vds (Vgs=0)

50mA @ 15V

Voltage - Cutoff (VGS off) @ Id

4V @ 0.5nA

Voltage - Breakdown (V(BR)GSS)

40V

Resistance - RDS(On)

25Ohm

Current Drain (Id) - Max

20mA

JESD-30 Code

R-PDSO-G3

RoHS Status

ROHS3 Compliant

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