NXP USA Inc. BFR30,215

SKU: BFR30,215-9

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Manufacturer Part :
BFR30,215
Manufacturer :
NXP USA Inc.
Package :
TO-236-3, SC-59, SOT-23-3
RoHS :
ROHS3 Compliant
BFR30,215 Datasheet :

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Description

Specification

Processor

Manufacturer

NXP USA Inc.

Peak Reflow Temperature (Cel)

260

Package / Case

TO-236-3, SC-59, SOT-23-3

Surface Mount

YES

Transistor Element Material

SILICON

Number of Elements

1

Operating Temperature

150°C TJ

Packaging

Tape & Reel (TR)

JESD-609 Code

e3

Part Status

Obsolete

Published

1997

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

HTS Code

8541.21.00.95

Terminal Position

DUAL

Terminal Form

GULL WING

Mounting Type

Surface Mount

Factory Lead Time

8 Weeks

Input Capacitance (Ciss) (Max) @ Vds

4pF @ 10V

Drain to Source Voltage (Vdss)

25V

JESD-30 Code

R-PDSO-G3

Qualification Status

Not Qualified

Configuration

SINGLE

Operating Mode

DEPLETION MODE

Power - Max

250mW

FET Type

N-Channel

Transistor Application

AMPLIFIER

Base Part Number

BFR30

Time@Peak Reflow Temperature-Max (s)

40

DS Breakdown Voltage-Min

25V

FET Technology

JUNCTION

Power Dissipation-Max (Abs)

0.3W

Feedback Cap-Max (Crss)

1.5 pF

Current - Drain (Idss) @ Vds (Vgs=0)

4mA @ 10V

Voltage - Cutoff (VGS off) @ Id

5V @ 0.5nA

Current Drain (Id) - Max

10mA

Pin Count

3

RoHS Status

ROHS3 Compliant

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