NXP USA Inc. PMBFJ177,215

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Description

Specification

Processor

Manufacturer	NXP USA Inc.
Part Status	Not For New Designs
Mounting Type	Surface Mount
Package / Case	TO-236-3, SC-59, SOT-23-3
Surface Mount	YES
Transistor Element Material	SILICON
Operating Temperature	150°C TJ
Packaging	Tape & Reel (TR)
Published	1997
Peak Reflow Temperature (Cel)	260
Factory Lead Time	8 Weeks
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	3
ECCN Code	EAR99
Terminal Finish	Tin (Sn)
HTS Code	8541.21.00.95
Terminal Position	DUAL
Terminal Form	GULL WING
JESD-609 Code	e3
Time@Peak Reflow Temperature-Max (s)	40
Input Capacitance (Ciss) (Max) @ Vds	8pF @ 10V VGS
Drain-source On Resistance-Max	300Ohm
JESD-30 Code	R-PDSO-G3
Qualification Status	Not Qualified
Configuration	SINGLE
Operating Mode	DEPLETION MODE
Power - Max	300mW
FET Type	P-Channel
Transistor Application	SWITCHING
Base Part Number	MBFJ177
Pin Count	3
DS Breakdown Voltage-Min	30V
FET Technology	JUNCTION
Power Dissipation-Max (Abs)	0.3W
Current - Drain (Idss) @ Vds (Vgs=0)	1.5mA @ 15V
Voltage - Cutoff (VGS off) @ Id	800mV @ 10nA
Voltage - Breakdown (V(BR)GSS)	30V
Resistance - RDS(On)	300Ohm
RoHS Status	ROHS3 Compliant

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