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| Manufacturer |
Toshiba |
|---|---|
| Mount |
Screw |
| Number of Pins |
3 |
| Max Operating Temperature |
175 °C |
| Min Operating Temperature |
-65 °C |
| Element Configuration |
Single |
| Continuous Drain Current (ID) |
3.5 A |
| Gate to Source Voltage (Vgs) |
-5 V |
| Radiation Hardening |
No |
In stock
| Manufacturer |
Fairchild |
|---|---|
| Mounting Type |
Through Hole |
| Package / Case |
TO-226-3, TO-92-3 (TO-226AA) |
| Supplier Device Package |
TO-92-3 |
| Mfr |
Fairchild Semiconductor |
| Package |
Bulk |
| Product Status |
Active |
| Operating Temperature |
-55°C ~ 150°C (TJ) |
| Power - Max |
625 mW |
| FET Type |
N-Channel |
| Current - Drain (Idss) @ Vds (Vgs=0) |
500 mA @ 15 V |
| Voltage - Cutoff (VGS off) @ Id |
4.5 V @ 1 µA |
| Voltage - Breakdown (V(BR)GSS) |
25 V |
| Resistance - RDS(On) |
3 Ohms |
In stock
| Manufacturer |
Fairchild |
|---|---|
| Mounting Type |
Through Hole |
| Supplier Device Package |
TO-92-3 |
| Mfr |
Fairchild Semiconductor |
| Package |
Bulk |
| Product Status |
Active |
| Operating Temperature |
-55°C ~ 150°C (TJ) |
| Power - Max |
625 mW |
| FET Type |
N-Channel |
| Current - Drain (Idss) @ Vds (Vgs=0) |
5 mA @ 15 V |
| Voltage - Cutoff (VGS off) @ Id |
1 V @ 1 µA |
| Voltage - Breakdown (V(BR)GSS) |
35 V |
| Resistance - RDS(On) |
50 Ohms |
In stock
| Manufacturer |
Linearin |
|---|---|
| Package / Case |
SOT-23-3 |
| Mounting Style |
SMD/SMT |
| Drain-Source Current at Vgs=0 |
3 mA |
| Gate-Source Cutoff Voltage |
2.5 V |
| Maximum Operating Temperature |
+ 150 C |
| Minimum Operating Temperature |
– 55 C |
| Pd - Power Dissipation |
350 mW |
| Transistor Polarity |
N-Channel |
| Vgs - Gate-Source Breakdown Voltage |
30 V |
| Technology |
Si |
| Configuration |
Single |
In stock
| Manufacturer |
Linearin |
|---|---|
| Package / Case |
SOT-23-3 |
| Mounting Style |
SMD/SMT |
| Drain-Source Current at Vgs=0 |
6.5 mA |
| Gate-Source Cutoff Voltage |
– 2 V |
| Id - Continuous Drain Current |
2 mA |
| Maximum Operating Temperature |
+ 150 C |
| Minimum Operating Temperature |
– 55 C |
| Pd - Power Dissipation |
400 mW |
| Transistor Polarity |
N-Channel |
| Vds - Drain-Source Breakdown Voltage |
40 V |
| Vgs - Gate-Source Breakdown Voltage |
– 40 V |
| Technology |
Si |
| Configuration |
Single |
In stock
| Manufacturer |
Linearin |
|---|---|
| Package / Case |
TO-71-6 |
| Mounting Style |
Through Hole |
| Drain-Source Current at Vgs=0 |
6.5 mA |
| Gate-Source Cutoff Voltage |
6 mV |
| Id - Continuous Drain Current |
2 mA |
| Maximum Operating Temperature |
+ 150 C |
| Minimum Operating Temperature |
– 55 C |
| Pd - Power Dissipation |
400 mW |
| Transistor Polarity |
N-Channel |
| Vds - Drain-Source Breakdown Voltage |
40 V |
| Vgs - Gate-Source Breakdown Voltage |
– 40 V |
| Series |
LSK389 |
| Technology |
Si |
| Configuration |
Dual |
In stock
| Manufacturer |
Linearin |
|---|---|
| Package / Case |
SOT-23-6 |
| Mounting Style |
SMD/SMT |
| Drain-Source Current at Vgs=0 |
5 mA |
| Gate-Source Cutoff Voltage |
8 mV |
| Id - Continuous Drain Current |
2 mA |
| Maximum Operating Temperature |
+ 150 C |
| Minimum Operating Temperature |
– 55 C |
| Pd - Power Dissipation |
500 mW |
| Transistor Polarity |
N-Channel |
| Vds - Drain-Source Breakdown Voltage |
60 V |
| Vgs - Gate-Source Breakdown Voltage |
– 60 V |
| Technology |
Si |
| Configuration |
Dual |
In stock
| Manufacturer |
Microchip |
|---|---|
| Mfr |
Microchip Technology |
| Contact Plating |
Tin |
| Mounting Type |
Surface Mount |
| Package / Case |
TO-18-3 |
| Surface Mount |
YES |
| Supplier Device Package |
3-UB (3.09×2.45) |
| Number of Terminals |
3 |
| Transistor Element Material |
SILICON |
| Mounting Style |
Through Hole |
| Base Product Number |
2N4858 |
| Base/Housing Material |
Polyamide 46 |
| Body Orientation |
Straight |
| Brand |
Microchip Technology |
| Factory Pack Quantity:Factory Pack Quantity |
1 |
| Ihs Manufacturer |
MICROSEMI CORP |
| Pbfree Code |
No |
| Contact Material |
Phosphor Bronze |
| Mounting |
Surface Mount |
| Operating Temperature-Max |
175 °C |
| Package |
Bulk |
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED |
| Package Description |
SMALL OUTLINE, R-CDSO-N3 |
| Package Shape |
RECTANGULAR |
| Package Style |
SMALL OUTLINE |
| Part Life Cycle Code |
Active |
| Product Status |
Active |
| Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Risk Rank |
5.09 |
| Rohs Code |
No |
| Termination Method |
Solder |
| Operating Temperature |
-40 to 105 °C |
| JESD-609 Code |
e0 |
| Manufacturer Part Number |
2N4858UB |
| ECCN Code |
EAR99 |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| HTS Code |
8541.21.00.95 |
| Subcategory |
Transistors |
| Pitch |
2.5400 mm |
| Technology |
Si |
| Terminal Position |
DUAL |
| Terminal Form |
NO LEAD |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Reach Compliance Code |
compliant |
| Pin Count |
3 |
| JESD-30 Code |
R-CDSO-N3 |
| Qualification Status |
Not Qualified |
| Contact Gender |
Socket |
| Housing Color |
Red |
| Number of Elements |
1 |
| Type |
JFET |
| Terminal Finish |
TIN LEAD |
| Power - Max |
360 mW |
| FET Type |
N-Channel |
| Input Capacitance (Ciss) (Max) @ Vds |
18pF @ 10V (VGS) |
| Drain to Source Voltage (Vdss) |
40 V |
| Polarity/Channel Type |
N-CHANNEL |
| Product Type |
JFETs |
| Drain-source On Resistance-Max |
60 Ω |
| DS Breakdown Voltage-Min |
40 V |
| FET Technology |
JUNCTION |
| Feedback Cap-Max (Crss) |
8 pF |
| Current - Drain (Idss) @ Vds (Vgs=0) |
8 mA @ 15 V |
| Voltage - Cutoff (VGS off) @ Id |
4 V @ 500 pA |
| Voltage - Breakdown (V(BR)GSS) |
40 V |
| Resistance - RDS(On) |
60 Ohms |
| Product Category |
JFET |
| Product Length |
19.8 mm |
In stock
| Manufacturer |
Microchip |
|---|---|
| Package Body Material |
METAL |
| Manufacturer Part Number |
2N5114 |
| Ihs Manufacturer |
MICROSEMI CORP |
| Factory Pack Quantity:Factory Pack Quantity |
1 |
| Brand |
Microchip Technology |
| Base Product Number |
2N5114 |
| Transistor Element Material |
SILICON |
| Package |
Bulk |
| Number of Terminals |
3 |
| Supplier Device Package |
TO-18 (TO-206AA) |
| Number of Pins |
3 |
| Surface Mount |
NO |
| Package / Case |
TO-18-3 |
| Mounting Type |
Through Hole |
| Operating Temperature-Max |
200 °C |
| Type |
JFET |
| Mounting Style |
Through Hole |
| Package Description |
TO-18, 3 PIN |
| Package Shape |
ROUND |
| Package Style |
CYLINDRICAL |
| Part Life Cycle Code |
Active |
| Part Package Code |
BCY |
| Product Status |
Active |
| Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Risk Rank |
5.08 |
| Rohs Code |
No |
| Operating Temperature |
-65°C ~ 200°C (TJ) |
| Packaging |
Bulk |
| Series |
Military, MIL-PRF-19500 |
| JESD-609 Code |
e0 |
| Pbfree Code |
No |
| ECCN Code |
EAR99 |
| Mfr |
Microchip Technology |
| Mount |
Through Hole |
| Power - Max |
500 mW |
| Pin Count |
3 |
| Operating Mode |
DEPLETION MODE |
| Element Configuration |
Single |
| Configuration |
SINGLE |
| Number of Elements |
1 |
| Qualification Status |
Not Qualified |
| JESD-30 Code |
O-MBCY-W3 |
| Reach Compliance Code |
unknown |
| Max Operating Temperature |
200 °C |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Terminal Form |
WIRE |
| Terminal Position |
BOTTOM |
| Technology |
Si |
| Subcategory |
Transistors |
| HTS Code |
8541.21.00.95 |
| FET Type |
P-Channel |
| FET Technology |
JUNCTION |
| Terminal Finish |
TIN LEAD |
| Drain-source On Resistance-Max |
75 Ω |
| Min Operating Temperature |
-65 °C |
| Drain to Source Voltage (Vdss) |
30 V |
| Polarity/Channel Type |
P-CHANNEL |
| Product Type |
JFETs |
| JEDEC-95 Code |
TO-206AA |
| Gate to Source Voltage (Vgs) |
30 V |
| Input Capacitance (Ciss) (Max) @ Vds |
25pF @ 15V |
| Resistance - RDS(On) |
75 Ohms |
| DS Breakdown Voltage-Min |
30 V |
| Power Dissipation-Max (Abs) |
0.5 W |
| Feedback Cap-Max (Crss) |
7 pF |
| Current - Drain (Idss) @ Vds (Vgs=0) |
90 mA @ 18 V |
| Voltage - Cutoff (VGS off) @ Id |
10 V @ 1 nA |
| Voltage - Breakdown (V(BR)GSS) |
30 V |
| Product Category |
JFET |
In stock
| Manufacturer |
Qorvo |
|---|---|
| Package / Case |
TO-247-4 |
| Mounting Style |
Through Hole |
| Id - Continuous Drain Current |
28 A |
| Maximum Operating Temperature |
+ 175 C |
| Minimum Operating Temperature |
– 55 C |
| Pd - Power Dissipation |
155 W |
| Rds On - Drain-Source Resistance |
74 mOhms |
| Transistor Polarity |
N-Channel |
| Vds - Drain-Source Breakdown Voltage |
750 V |
| Series |
UJ4C |
| Technology |
SiC |
| Configuration |
Single |
In stock
| Manufacturer |
Qorvo |
|---|---|
| Package / Case |
D2PAK-7L |
| Mounting Style |
SMD/SMT |
| Id - Continuous Drain Current |
72 A |
| Maximum Operating Temperature |
+ 175 C |
| Minimum Operating Temperature |
– 55 C |
| Pd - Power Dissipation |
259 W |
| Rds On - Drain-Source Resistance |
18 mOhms |
| Transistor Polarity |
N-Channel |
| Vds - Drain-Source Breakdown Voltage |
750 V |
| Technology |
SiC |
In stock
| Manufacturer |
Texas Instruments |
|---|---|
| Package Style |
CYLINDRICAL |
| Number of Terminals |
3 |
| Transistor Element Material |
SILICON |
| Ihs Manufacturer |
MICROSEMI CORP |
| Manufacturer Part Number |
2N4860 |
| Operating Temperature-Max |
200 °C |
| Package Body Material |
METAL |
| Package Description |
TO-18, 3 PIN |
| ECCN Code |
EAR99 |
| Surface Mount |
NO |
| Part Life Cycle Code |
Active |
| Part Package Code |
BCY |
| Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Risk Rank |
5.05 |
| Rohs Code |
No |
| JESD-609 Code |
e0 |
| Pbfree Code |
No |
| Package Shape |
ROUND |
| Terminal Finish |
TIN LEAD |
| Number of Elements |
1 |
| Configuration |
SINGLE |
| Terminal Form |
WIRE |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Reach Compliance Code |
unknown |
| Pin Count |
3 |
| Reference Standard |
MIL-19500/385 |
| JESD-30 Code |
O-MBCY-W3 |
| Qualification Status |
Not Qualified |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
BOTTOM |
| Operating Mode |
DEPLETION MODE |
| Polarity/Channel Type |
N-CHANNEL |
| JEDEC-95 Code |
TO-206AA |
| Drain-source On Resistance-Max |
40 Ω |
| DS Breakdown Voltage-Min |
30 V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
1.8 W |
| Feedback Cap-Max (Crss) |
8 pF |
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