Infineon Technologies SI4435DY

SKU: SI4435DY-11

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Manufacturer Part :
SI4435DY
Manufacturer :
Infineon Technologies
Package :
8-SOIC (0.154, 3.90mm Width)
RoHS :
Non-RoHS Compliant
SI4435DY Datasheet :
SI4435DY

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Description

Specification

Processor

Manufacturer

Infineon Technologies

Terminal Position

DUAL

Surface Mount

YES

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

8A Tc

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

Power Dissipation (Max)

2.5W Ta

Packaging

Tube

Published

1999

Operating Temperature

-55°C~150°C TJ

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

8

ECCN Code

EAR99

Additional Feature

ULTRA LOW RESISTANCE

HTS Code

8541.29.00.95

Package / Case

8-SOIC (0.154, 3.90mm Width)

Mounting Type

Surface Mount

Input Capacitance (Ciss) (Max) @ Vds

2320pF @ 15V

Gate Charge (Qg) (Max) @ Vgs

60nC @ 10V

JESD-30 Code

R-PDSO-G8

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

FET Type

P-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

20m Ω @ 8A, 10V

Vgs(th) (Max) @ Id

1V @ 250μA

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Terminal Form

GULL WING

Drain to Source Voltage (Vdss)

30V

Vgs (Max)

±20V

JEDEC-95 Code

MS-012AA

Drain Current-Max (Abs) (ID)

8A

Drain-source On Resistance-Max

0.02Ohm

Pulsed Drain Current-Max (IDM)

50A

DS Breakdown Voltage-Min

30V

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

RoHS Status

Non-RoHS Compliant

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