Showing 85–96 of 538 results
Comchip Technology KBPC1506-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Surface Mount |
| Mounting Type |
QC Terminal |
| Package / Case |
4-Square, KBPC |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Bulk |
| Published |
2011 |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
SOLDER LUG |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| JESD-30 Code |
R-XUFM-D4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 600V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 7.5A |
| Case Connection |
ISOLATED |
| Output Current-Max |
15A |
| Current - Average Rectified (Io) |
15A |
| Number of Phases |
1 |
| Voltage - Peak Reverse (Max) |
600V |
| Breakdown Voltage-Min |
600V |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC1510-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Surface Mount |
| Mounting Type |
QC Terminal |
| Package / Case |
4-Square, KBPC |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Bulk |
| Published |
2001 |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
SOLDER LUG |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| JESD-30 Code |
R-XUFM-D4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 800V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 7.5A |
| Case Connection |
ISOLATED |
| Output Current-Max |
15A |
| Current - Average Rectified (Io) |
15A |
| Number of Phases |
1 |
| Voltage - Peak Reverse (Max) |
1kV |
| Breakdown Voltage-Min |
1000V |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC2501-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Surface Mount |
| Mounting Type |
QC Terminal |
| Package / Case |
4-Square, KBPC |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Bulk |
| Published |
2011 |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
SOLDER LUG |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| JESD-30 Code |
R-XUFM-D4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 100V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 12.5A |
| Case Connection |
ISOLATED |
| Output Current-Max |
25A |
| Current - Average Rectified (Io) |
25A |
| Number of Phases |
1 |
| Voltage - Peak Reverse (Max) |
100V |
| Breakdown Voltage-Min |
100V |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC2502-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Surface Mount |
| Mounting Type |
QC Terminal |
| Package / Case |
4-Square, KBPC |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Bulk |
| Published |
2011 |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
SOLDER LUG |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| JESD-30 Code |
R-XUFM-D4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 200V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 12.5A |
| Case Connection |
ISOLATED |
| Output Current-Max |
25A |
| Current - Average Rectified (Io) |
25A |
| Number of Phases |
1 |
| Voltage - Peak Reverse (Max) |
200V |
| Breakdown Voltage-Min |
200V |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC2504-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Surface Mount |
| Mounting Type |
QC Terminal |
| Package / Case |
4-Square, KBPC |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Bulk |
| Published |
2011 |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
SOLDER LUG |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| JESD-30 Code |
R-XUFM-D4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 400V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 12.5A |
| Case Connection |
ISOLATED |
| Output Current-Max |
25A |
| Current - Average Rectified (Io) |
25A |
| Number of Phases |
1 |
| Voltage - Peak Reverse (Max) |
400V |
| Breakdown Voltage-Min |
400V |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC2506-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Surface Mount |
| Mounting Type |
QC Terminal |
| Package / Case |
4-Square, KBPC |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Bulk |
| Published |
2011 |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
SOLDER LUG |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| JESD-30 Code |
R-XUFM-D4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 600V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 12.5A |
| Case Connection |
ISOLATED |
| Output Current-Max |
25A |
| Current - Average Rectified (Io) |
25A |
| Number of Phases |
1 |
| Voltage - Peak Reverse (Max) |
600V |
| Breakdown Voltage-Min |
600V |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC2508W-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Through Hole |
| Mounting Type |
Through Hole |
| Package / Case |
4-Square, KBPC-W |
| Diode Element Material |
SILICON |
| Operating Temperature |
-55°C~150°C TJ |
| Packaging |
Bulk |
| Published |
2013 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
WIRE |
| Peak Reflow Temperature (Cel) |
260 |
| Time@Peak Reflow Temperature-Max (s) |
30 |
| JESD-30 Code |
S-XUFM-W4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 800V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 12.5A |
| Case Connection |
ISOLATED |
| Output Current-Max |
25A |
| Current - Average Rectified (Io) |
25A |
| Number of Phases |
1 |
| Non-rep Pk Forward Current-Max |
400A |
| Voltage - Peak Reverse (Max) |
800V |
| Breakdown Voltage-Min |
800V |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC3501-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Surface Mount |
| Mounting Type |
QC Terminal |
| Package / Case |
4-Square, KBPC |
| Diode Element Material |
SILICON |
| Operating Temperature |
-55°C~150°C TJ |
| Packaging |
Bulk |
| Published |
2011 |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
SOLDER LUG |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| JESD-30 Code |
R-XUFM-D4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 100V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 17.5A |
| Case Connection |
ISOLATED |
| Output Current-Max |
35A |
| Current - Average Rectified (Io) |
35A |
| Number of Phases |
1 |
| Non-rep Pk Forward Current-Max |
400A |
| Voltage - Peak Reverse (Max) |
100V |
| Breakdown Voltage-Min |
100V |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC3504-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Surface Mount |
| Mounting Type |
QC Terminal |
| Package / Case |
4-Square, KBPC |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Bulk |
| Published |
2011 |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
SOLDER LUG |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| JESD-30 Code |
R-XUFM-D4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 400V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 17.5A |
| Case Connection |
ISOLATED |
| Output Current-Max |
35A |
| Current - Average Rectified (Io) |
35A |
| Number of Phases |
1 |
| Voltage - Peak Reverse (Max) |
400V |
| Breakdown Voltage-Min |
400V |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC3504W-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Through Hole |
| Mounting Type |
Through Hole |
| Package / Case |
4-Square, KBPC-W |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Tray |
| Published |
2013 |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
WIRE |
| Peak Reflow Temperature (Cel) |
260 |
| JESD-30 Code |
S-XUFM-W4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 400V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 17.5A |
| Case Connection |
ISOLATED |
| Output Current-Max |
35A |
| Current - Average Rectified (Io) |
35A |
| Number of Phases |
1 |
| Voltage - Peak Reverse (Max) |
400V |
| Breakdown Voltage-Min |
400V |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC3510W-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Mounting Type |
Through Hole |
| Package / Case |
4-Square, KBPC-W |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Tray |
| Published |
2004 |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
WIRE |
| Peak Reflow Temperature (Cel) |
260 |
| Mount |
Through Hole |
| Factory Lead Time |
12 Weeks |
| Output Current-Max |
35A |
| Number of Elements |
4 |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 1000V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 17.5A |
| Case Connection |
ISOLATED |
| Max Reverse Leakage Current |
10A |
| Max Surge Current |
500A |
| Current - Average Rectified (Io) |
35A |
| Number of Phases |
1 |
| JESD-30 Code |
S-XUFM-W4 |
| Voltage - Peak Reverse (Max) |
1kV |
| Breakdown Voltage-Min |
1000V |
| Height |
10.77mm |
| Length |
28.3mm |
| Width |
28.3mm |
| Configuration |
BRIDGE, 4 ELEMENTS |
| RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC5002W-G
In stock
| Manufacturer |
Comchip Technology |
|---|---|
| Factory Lead Time |
12 Weeks |
| Mount |
Through Hole |
| Mounting Type |
Through Hole |
| Package / Case |
4-Square, KBPC-W |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Bulk |
| Published |
2013 |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Additional Feature |
UL RECOGNIZED |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
UPPER |
| Terminal Form |
WIRE |
| Peak Reflow Temperature (Cel) |
260 |
| JESD-30 Code |
S-XUFM-W4 |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 200V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 25A |
| Case Connection |
ISOLATED |
| Output Current-Max |
50A |
| Current - Average Rectified (Io) |
50A |
| Number of Phases |
1 |
| Voltage - Peak Reverse (Max) |
200V |
| Breakdown Voltage-Min |
200V |
| RoHS Status |
ROHS3 Compliant |