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Series
Diodes - Bridge Rectifiers
Comchip Technology KBPC5008W-G
In stock
Manufacturer |
Comchip Technology |
---|---|
Factory Lead Time |
12 Weeks |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
4-Square, KBPC-W |
Diode Element Material |
SILICON |
Operating Temperature |
'-55°C~150°C TJ |
Packaging |
Bulk |
Published |
2012 |
Part Status |
Active |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Additional Feature |
UL RECOGNIZED |
HTS Code |
8541.10.00.80 |
Terminal Position |
UPPER |
Terminal Form |
WIRE |
Peak Reflow Temperature (Cel) |
260 |
JESD-30 Code |
S-XUFM-W4 |
Number of Elements |
4 |
Configuration |
BRIDGE, 4 ELEMENTS |
Diode Type |
Single Phase |
Current - Reverse Leakage @ Vr |
10μA @ 800V |
Voltage - Forward (Vf) (Max) @ If |
1.1V @ 25A |
Case Connection |
ISOLATED |
Output Current-Max |
50A |
Current - Average Rectified (Io) |
50A |
Number of Phases |
1 |
Voltage - Peak Reverse (Max) |
800V |
Breakdown Voltage-Min |
800V |
RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC5010-G
In stock
Manufacturer |
Comchip Technology |
---|---|
Part Status |
Active |
Mount |
Surface Mount |
Mounting Type |
QC Terminal |
Package / Case |
4-Square, KBPC |
Diode Element Material |
SILICON |
Operating Temperature |
'-55°C~150°C TJ |
Packaging |
Bulk |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Factory Lead Time |
12 Weeks |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Additional Feature |
UL RECOGNIZED |
HTS Code |
8541.10.00.80 |
Terminal Position |
UPPER |
Terminal Form |
SOLDER LUG |
Published |
2003 |
Max Surge Current |
500A |
Output Current-Max |
50A |
Configuration |
BRIDGE, 4 ELEMENTS |
Diode Type |
Single Phase |
Current - Reverse Leakage @ Vr |
5μA @ 1000V |
Voltage - Forward (Vf) (Max) @ If |
1.1V @ 25A |
Case Connection |
ISOLATED |
Max Reverse Leakage Current |
10μA |
JESD-30 Code |
R-XUFM-D4 |
Number of Elements |
4 |
Current - Average Rectified (Io) |
50A |
Number of Phases |
1 |
Voltage - Peak Reverse (Max) |
1kV |
Breakdown Voltage-Min |
1000V |
Height |
10.77mm |
Length |
28.3mm |
Width |
28.3mm |
RoHS Status |
ROHS3 Compliant |
Comchip Technology KBPC5010W-G
In stock
Manufacturer |
Comchip Technology |
---|---|
Part Status |
Active |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
4-Square, KBPC-W |
Diode Element Material |
SILICON |
Operating Temperature |
'-55°C~150°C TJ |
Packaging |
Tray |
Peak Reflow Temperature (Cel) |
260 |
Factory Lead Time |
12 Weeks |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Additional Feature |
UL RECOGNIZED |
HTS Code |
8541.10.00.80 |
Terminal Position |
UPPER |
Terminal Form |
WIRE |
Published |
2003 |
Max Surge Current |
500A |
Output Current-Max |
50A |
Configuration |
BRIDGE, 4 ELEMENTS |
Diode Type |
Single Phase |
Current - Reverse Leakage @ Vr |
10μA @ 1000V |
Voltage - Forward (Vf) (Max) @ If |
1.1V @ 25A |
Case Connection |
ISOLATED |
Max Reverse Leakage Current |
10A |
JESD-30 Code |
S-XUFM-W4 |
Number of Elements |
4 |
Current - Average Rectified (Io) |
50A |
Number of Phases |
1 |
Voltage - Peak Reverse (Max) |
1kV |
Breakdown Voltage-Min |
1000V |
Height |
10.77mm |
Length |
28.3mm |
Width |
28.3mm |
RoHS Status |
ROHS3 Compliant |
Comchip Technology KBU10005-G
In stock
Manufacturer |
Comchip Technology |
---|---|
Terminal Form |
WIRE |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
4-SIP, KBU |
Diode Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tray |
Published |
2011 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Additional Feature |
UL RECOGNIZED |
HTS Code |
8541.10.00.80 |
Factory Lead Time |
12 Weeks |
Time@Peak Reflow Temperature-Max (s) |
30 |
Peak Reflow Temperature (Cel) |
260 |
JESD-30 Code |
R-PSIP-W4 |
Number of Elements |
4 |
Configuration |
BRIDGE, 4 ELEMENTS |
Diode Type |
Single Phase |
Current - Reverse Leakage @ Vr |
10μA @ 50V |
Voltage - Forward (Vf) (Max) @ If |
1V @ 5A |
Max Reverse Leakage Current |
10μA |
Max Surge Current |
240A |
Output Current-Max |
10A |
Current - Average Rectified (Io) |
10A |
Number of Phases |
1 |
Voltage - Peak Reverse (Max) |
50V |
Breakdown Voltage-Min |
50V |
RoHS Status |
ROHS3 Compliant |
Comchip Technology KBU2501-G
In stock
Manufacturer |
Comchip Technology |
---|---|
Factory Lead Time |
12 Weeks |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
4-SIP, KBU |
Diode Element Material |
SILICON |
Operating Temperature |
'-55°C~150°C TJ |
Packaging |
Bulk |
Published |
2011 |
Part Status |
Active |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Additional Feature |
UL RECOGNIZED |
HTS Code |
8541.10.00.80 |
Terminal Form |
WIRE |
Peak Reflow Temperature (Cel) |
260 |
JESD-30 Code |
R-PSIP-W4 |
Number of Elements |
4 |
Configuration |
BRIDGE, 4 ELEMENTS |
Diode Type |
Single Phase |
Current - Reverse Leakage @ Vr |
10μA @ 100V |
Voltage - Forward (Vf) (Max) @ If |
1.1V @ 12.5A |
Output Current-Max |
25A |
Current - Average Rectified (Io) |
3.6A |
Number of Phases |
1 |
Voltage - Peak Reverse (Max) |
100V |
Breakdown Voltage-Min |
100V |
RoHS Status |
ROHS3 Compliant |
Comchip Technology MP10005G-G
In stock
Manufacturer |
Comchip Technology |
---|---|
Packaging |
Tray |
Terminal Position |
UPPER |
Additional Feature |
UL RECOGNIZED |
ECCN Code |
EAR99 |
Number of Terminations |
4 |
Part Status |
Active |
Terminal Form |
WIRE |
Published |
2011 |
Operating Temperature |
'-55°C~150°C TJ |
Diode Element Material |
SILICON |
Number of Pins |
8 |
Package / Case |
4-Square, MP-8 |
Mounting Type |
Through Hole |
Mount |
Through Hole |
Factory Lead Time |
12 Weeks |
Max Surge Current |
200A |
Breakdown Voltage-Min |
50V |
Voltage - Peak Reverse (Max) |
50V |
Number of Phases |
1 |
Current - Average Rectified (Io) |
10A |
Output Current-Max |
10A |
Max Reverse Leakage Current |
10μA |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Voltage - Forward (Vf) (Max) @ If |
1.1V @ 5A |
Current - Reverse Leakage @ Vr |
10μA @ 50V |
Diode Type |
Single Phase |
Configuration |
BRIDGE, 4 ELEMENTS |
Number of Elements |
4 |
JESD-30 Code |
R-XUFM-W4 |
RoHS Status |
ROHS3 Compliant |
Comchip Technology SC35VB80-G
In stock
Manufacturer |
Comchip Technology |
---|---|
Factory Lead Time |
12 Weeks |
Mounting Type |
QC Terminal |
Package / Case |
5-Square, SCVB |
Surface Mount |
NO |
Diode Element Material |
SILICON |
Operating Temperature |
'-55°C~150°C TJ |
Packaging |
Tray |
Published |
2013 |
Part Status |
Active |
Number of Terminations |
5 |
ECCN Code |
EAR99 |
Additional Feature |
UL RECOGNIZED |
HTS Code |
8541.10.00.80 |
Terminal Position |
UPPER |
Terminal Form |
SOLDER LUG |
Peak Reflow Temperature (Cel) |
260 |
JESD-30 Code |
S-XUFM-D5 |
Number of Elements |
6 |
Configuration |
BRIDGE, 6 ELEMENTS |
Diode Type |
Three Phase |
Current - Reverse Leakage @ Vr |
10μA @ 800V |
Voltage - Forward (Vf) (Max) @ If |
1.05V @ 12.5A |
Case Connection |
ISOLATED |
Max Reverse Leakage Current |
10μA |
Max Surge Current |
350A |
Output Current-Max |
35A |
Current - Average Rectified (Io) |
35A |
Number of Phases |
3 |
Voltage - Peak Reverse (Max) |
800V |
RoHS Status |
ROHS3 Compliant |
Comchip Technology Z4GP208-HF
In stock
Manufacturer |
Comchip Technology |
---|---|
Terminal Position |
DUAL |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
4-SMD, No Lead |
Number of Pins |
4 |
Diode Element Material |
SILICON |
Operating Temperature |
'-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2013 |
Pbfree Code |
yes |
Part Status |
Active |
Number of Terminations |
4 |
Additional Feature |
LOW POWER LOSS |
Factory Lead Time |
10 Weeks |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Number of Elements |
4 |
Diode Type |
Single Phase |
Current - Reverse Leakage @ Vr |
5μA @ 800V |
Voltage - Forward (Vf) (Max) @ If |
1V @ 2A |
Max Reverse Leakage Current |
5μA |
Max Surge Current |
50A |
Output Current-Max |
2A |
Current - Average Rectified (Io) |
2A |
Number of Phases |
1 |
Voltage - Peak Reverse (Max) |
800V |
Height |
1.35mm |
Length |
5.9mm |
Width |
5.4mm |
RoHS Status |
ROHS3 Compliant |
Comchip Technology Z4GP210L-HF
In stock
Manufacturer |
Comchip Technology |
---|---|
Factory Lead Time |
10 Weeks |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
4-SMD, No Lead |
Number of Pins |
4 |
Operating Temperature |
'-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2013 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Terminal Finish |
PURE TIN |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Diode Type |
Single Phase |
Current - Reverse Leakage @ Vr |
5μA @ 1000V |
Voltage - Forward (Vf) (Max) @ If |
950mV @ 2A |
Max Reverse Leakage Current |
5μA |
Max Surge Current |
60A |
Current - Average Rectified (Io) |
2A |
Voltage - Peak Reverse (Max) |
1kV |
Height |
1.35mm |
Length |
5.9mm |
Width |
5.4mm |
RoHS Status |
ROHS3 Compliant |
Diodes Incorporated 2W01G
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Package / Case |
4-Circular, WOG |
Number of Pins |
4 |
Diode Element Material |
SILICON |
Operating Temperature |
'-65°C~150°C TJ |
Packaging |
Bulk |
Published |
2008 |
JESD-609 Code |
e4 |
Base Part Number |
2W01 |
Part Status |
Obsolete |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Finish |
Silver (Ag) |
Additional Feature |
UL RECOGNIZED |
Terminal Position |
BOTTOM |
Terminal Form |
WIRE |
Peak Reflow Temperature (Cel) |
260 |
Mounting Type |
Through Hole |
Mount |
Through Hole |
Output Current-Max |
2A |
Number of Elements |
1 |
Diode Type |
Single Phase |
Current - Reverse Leakage @ Vr |
5μA @ 100V |
Voltage - Forward (Vf) (Max) @ If |
1.1V @ 2A |
Case Connection |
ISOLATED |
Forward Current |
2A |
Max Reverse Leakage Current |
5μA |
Max Surge Current |
60A |
Forward Voltage |
1.1V |
Number of Phases |
1 |
Pin Count |
4 |
Peak Reverse Current |
5μA |
Height |
4.6mm |
Length |
9.86mm |
Width |
9.86mm |
Radiation Hardening |
No |
Element Configuration |
Single |
RoHS Status |
ROHS3 Compliant |
Diodes Incorporated 2W04G
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Part Status |
Obsolete |
Mounting Type |
Through Hole |
Package / Case |
4-Circular, WOG |
Number of Pins |
4 |
Diode Element Material |
SILICON |
Operating Temperature |
'-65°C~150°C TJ |
Packaging |
Bulk |
Published |
2012 |
Reach Compliance Code |
not_compliant |
Mount |
Through Hole |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Finish |
Silver (Ag) |
Additional Feature |
UL RECOGNIZED |
Terminal Position |
BOTTOM |
Terminal Form |
WIRE |
Peak Reflow Temperature (Cel) |
260 |
JESD-609 Code |
e4 |
Max Surge Current |
60A |
Output Current-Max |
2A |
Qualification Status |
Not Qualified |
Number of Elements |
1 |
Diode Type |
Single Phase |
Current - Reverse Leakage @ Vr |
5μA @ 400V |
Voltage - Forward (Vf) (Max) @ If |
1.1V @ 2A |
Case Connection |
ISOLATED |
Max Reverse Leakage Current |
5μA |
Base Part Number |
2W04 |
Pin Count |
4 |
Current - Average Rectified (Io) |
2A |
Forward Voltage |
1.1V |
Number of Phases |
1 |
Voltage - Peak Reverse (Max) |
400V |
Height |
4.6mm |
Length |
9.86mm |
Width |
9.86mm |
RoHS Status |
ROHS3 Compliant |
Diodes Incorporated ABS10B-13
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Factory Lead Time |
16 Weeks |
Mounting Type |
Surface Mount |
Package / Case |
4-SMD, Gull Wing |
Surface Mount |
YES |
Diode Element Material |
SILICON |
Operating Temperature |
'-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2017 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Terminal Position |
DUAL |
Peak Reflow Temperature (Cel) |
260 |
Reach Compliance Code |
not_compliant |
JESD-30 Code |
R-PDSO-G4 |
Number of Elements |
4 |
Configuration |
BRIDGE, 4 ELEMENTS |
Diode Type |
Single Phase |
Current - Reverse Leakage @ Vr |
5μA @ 1000V |
Voltage - Forward (Vf) (Max) @ If |
1.1V @ 1.5A |
Output Current-Max |
1.5A |
Current - Average Rectified (Io) |
1.5A |
Number of Phases |
1 |
Voltage - Peak Reverse (Max) |
1kV |
Breakdown Voltage-Min |
1000V |
RoHS Status |
ROHS3 Compliant |