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Discrete Semiconductors
STMicroelectronics STB9NK60ZT4
In stock
Manufacturer |
STMicroelectronics |
---|---|
JESD-609 Code |
e3 |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
7A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
125W Tc |
Turn Off Delay Time |
43 ns |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Base Part Number |
STB9N |
Factory Lead Time |
12 Weeks |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Resistance |
950mOhm |
Terminal Finish |
Matte Tin (Sn) – annealed |
Voltage - Rated DC |
600V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
245 |
Current Rating |
7A |
Time@Peak Reflow Temperature-Max (s) |
30 |
Series |
SuperMESH™ |
Pin Count |
3 |
Fall Time (Typ) |
15 ns |
Continuous Drain Current (ID) |
7A |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
125W |
Turn On Delay Time |
19 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
950m Ω @ 3.5A, 10V |
Vgs(th) (Max) @ Id |
4.5V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds |
1110pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
53nC @ 10V |
Rise Time |
17ns |
Vgs (Max) |
±30V |
JESD-30 Code |
R-PSSO-G2 |
Element Configuration |
Single |
Threshold Voltage |
3.75V |
Gate to Source Voltage (Vgs) |
30V |
Drain Current-Max (Abs) (ID) |
7A |
Drain to Source Breakdown Voltage |
600V |
Pulsed Drain Current-Max (IDM) |
28A |
Height |
4.6mm |
Length |
10.4mm |
Width |
9.35mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
STMicroelectronics STD100N10LF7AG
In stock
Manufacturer |
STMicroelectronics |
---|---|
Base Part Number |
STD10 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
80A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
125W Tc |
Packaging |
Tape & Reel (TR) |
Part Status |
Active |
Operating Temperature |
-55°C~175°C TJ |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Surface Mount |
YES |
Mounting Type |
Surface Mount |
Gate Charge (Qg) (Max) @ Vgs |
73nC @ 10V |
Drain to Source Voltage (Vdss) |
100V |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
9m Ω @ 40A, 10V |
Vgs(th) (Max) @ Id |
2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
4000pF @ 25V |
Configuration |
SINGLE WITH BUILT-IN DIODE |
JESD-30 Code |
R-PSSO-G2 |
Vgs (Max) |
±20V |
Drain Current-Max (Abs) (ID) |
80A |
Drain-source On Resistance-Max |
0.011Ohm |
Pulsed Drain Current-Max (IDM) |
320A |
DS Breakdown Voltage-Min |
100V |
Avalanche Energy Rating (Eas) |
200 mJ |
Operating Mode |
ENHANCEMENT MODE |
RoHS Status |
ROHS3 Compliant |
STMicroelectronics STD100N3LF3
In stock
Manufacturer |
STMicroelectronics |
---|---|
Series |
STripFET™ II |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
80A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
110W Tc |
Turn Off Delay Time |
31 ns |
Operating Temperature |
-55°C~175°C TJ |
Time@Peak Reflow Temperature-Max (s) |
30 |
Mount |
Surface Mount |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Resistance |
4.5mOhm |
Terminal Finish |
Matte Tin (Sn) |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Packaging |
Tape & Reel (TR) |
Base Part Number |
STD10 |
Input Capacitance (Ciss) (Max) @ Vds |
2060pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
27nC @ 5V |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
110W |
Case Connection |
DRAIN |
Turn On Delay Time |
9 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
5.5m Ω @ 40A, 10V |
Vgs(th) (Max) @ Id |
2.5V @ 250μA |
Pin Count |
3 |
JESD-30 Code |
R-PSSO-G2 |
Rise Time |
205ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
35 ns |
Continuous Drain Current (ID) |
80A |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
30V |
Avalanche Energy Rating (Eas) |
500 mJ |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
STMicroelectronics STD100NH02LT4
In stock
Manufacturer |
STMicroelectronics |
---|---|
Part Status |
Obsolete |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
60A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
100W Tc |
Turn Off Delay Time |
60 ns |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Series |
STripFET™ II |
Current Rating |
60A |
JESD-609 Code |
e3 |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Resistance |
4.8mOhm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
LOW THRESHOLD |
Voltage - Rated DC |
24V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Reach Compliance Code |
not_compliant |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Vgs(th) (Max) @ Id |
1.8V @ 250μA |
Base Part Number |
STD10 |
JESD-30 Code |
R-PSSO-G2 |
Qualification Status |
Not Qualified |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
100W |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
4.8m Ω @ 30A, 10V |
Input Capacitance (Ciss) (Max) @ Vds |
3940pF @ 15V |
Gate Charge (Qg) (Max) @ Vgs |
84nC @ 10V |
Time@Peak Reflow Temperature-Max (s) |
30 |
Rise Time |
200ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
35 ns |
Continuous Drain Current (ID) |
60A |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
24V |
Pulsed Drain Current-Max (IDM) |
240A |
Avalanche Energy Rating (Eas) |
800 mJ |
RoHS Status |
ROHS3 Compliant |
Pin Count |
3 |
Lead Free |
Lead Free |
STMicroelectronics STD100NH03LT4
In stock
Manufacturer |
STMicroelectronics |
---|---|
JESD-609 Code |
e3 |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
60A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
100W Tc |
Turn Off Delay Time |
48 ns |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Base Part Number |
STD10 |
Series |
STripFET™ III |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Voltage - Rated DC |
30V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
60A |
Time@Peak Reflow Temperature-Max (s) |
30 |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Gate Charge (Qg) (Max) @ Vgs |
77nC @ 10V |
JESD-30 Code |
R-PSSO-G2 |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
100W |
Case Connection |
DRAIN |
Turn On Delay Time |
16 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
5.5m Ω @ 30A, 10V |
Vgs(th) (Max) @ Id |
2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
4100pF @ 15V |
Rise Time |
95ns |
Vgs (Max) |
±20V |
Pin Count |
3 |
Fall Time (Typ) |
23 ns |
Continuous Drain Current (ID) |
60A |
JEDEC-95 Code |
TO-252AA |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
30V |
Pulsed Drain Current-Max (IDM) |
240A |
Avalanche Energy Rating (Eas) |
700 mJ |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Element Configuration |
Single |
Lead Free |
Lead Free |
STMicroelectronics STD105N10F7AG
In stock
Manufacturer |
STMicroelectronics |
---|---|
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Current - Continuous Drain (Id) @ 25℃ |
80A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
120W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Cut Tape (CT) |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
STD10 |
Configuration |
Single |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
8m Ω @ 40A, 10V |
Vgs(th) (Max) @ Id |
4.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
4369pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
61nC @ 10V |
Drain to Source Voltage (Vdss) |
100V |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
80A |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
STMicroelectronics STD10NM50N
In stock
Manufacturer |
STMicroelectronics |
---|---|
Pbfree Code |
yes |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
7A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
70W Tc |
Turn Off Delay Time |
7.8 ns |
Operating Temperature |
150°C TJ |
Packaging |
Tape & Reel (TR) |
Series |
MDmesh™ II |
Pin Count |
3 |
Mount |
Surface Mount |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Resistance |
630mOhm |
Terminal Finish |
Matte Tin (Sn) – annealed |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
STD10 |
JESD-609 Code |
e3 |
JESD-30 Code |
R-PSSO-G2 |
Fall Time (Typ) |
12 ns |
Continuous Drain Current (ID) |
7A |
Power Dissipation |
70W |
Turn On Delay Time |
7.8 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
630m Ω @ 3.5A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
450pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
17nC @ 10V |
Rise Time |
4.4ns |
Drain to Source Voltage (Vdss) |
500V |
Vgs (Max) |
±25V |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Threshold Voltage |
3V |
Gate to Source Voltage (Vgs) |
25V |
Drain Current-Max (Abs) (ID) |
7A |
Pulsed Drain Current-Max (IDM) |
28A |
DS Breakdown Voltage-Min |
500V |
Height |
2.4mm |
Length |
6.6mm |
Width |
6.2mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
STMicroelectronics STD10NM60N
In stock
Manufacturer |
STMicroelectronics |
---|---|
JESD-609 Code |
e3 |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
10A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
70W Tc |
Turn Off Delay Time |
32 ns |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Cut Tape (CT) |
JESD-30 Code |
R-PSSO-G2 |
Series |
MDmesh™ II |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Resistance |
600mOhm |
Terminal Finish |
Matte Tin (Sn) – annealed |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
STD10 |
Pin Count |
3 |
Mount |
Surface Mount |
Factory Lead Time |
16 Weeks |
Continuous Drain Current (ID) |
10A |
Operating Mode |
ENHANCEMENT MODE |
Turn On Delay Time |
10 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
550m Ω @ 4A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
540pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
19nC @ 10V |
Rise Time |
12ns |
Vgs (Max) |
±25V |
Fall Time (Typ) |
15 ns |
Threshold Voltage |
3V |
Gate to Source Voltage (Vgs) |
25V |
Element Configuration |
Single |
Drain Current-Max (Abs) (ID) |
8A |
Drain to Source Breakdown Voltage |
600V |
Avalanche Energy Rating (Eas) |
200 mJ |
Nominal Vgs |
3 V |
Height |
2.4mm |
Length |
6.6mm |
Width |
6.2mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Power Dissipation |
70W |
Lead Free |
Lead Free |
STMicroelectronics STD10P10F6
In stock
Manufacturer |
STMicroelectronics |
---|---|
Series |
STripFET™ F6 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
10A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
40W Tc |
Operating Temperature |
175°C TJ |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Packaging |
Cut Tape (CT) |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Input Capacitance (Ciss) (Max) @ Vds |
864pF @ 80V |
JESD-30 Code |
R-PSSO-G2 |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
180m Ω @ 5A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Gate Charge (Qg) (Max) @ Vgs |
16.5nC @ 10V |
Drain to Source Voltage (Vdss) |
100V |
Base Part Number |
STD10 |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
10A |
Drain-source On Resistance-Max |
0.18Ohm |
Pulsed Drain Current-Max (IDM) |
40A |
DS Breakdown Voltage-Min |
100V |
RoHS Status |
ROHS3 Compliant |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Lead Free |
Lead Free |
STMicroelectronics STD10PF06T4
In stock
Manufacturer |
STMicroelectronics |
---|---|
Part Status |
Obsolete |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Weight |
4.535924g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
10A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
40W Tc |
Turn Off Delay Time |
17 ns |
Operating Temperature |
175°C TJ |
Packaging |
Tape & Reel (TR) |
Series |
STripFET™ II |
JESD-30 Code |
R-PSSO-G2 |
Mount |
Surface Mount |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Resistance |
200mOhm |
Terminal Finish |
Matte Tin (Sn) |
Voltage - Rated DC |
-60V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
-10A |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
STD10 |
Pin Count |
3 |
JESD-609 Code |
e3 |
Number of Channels |
1 |
Continuous Drain Current (ID) |
10A |
Threshold Voltage |
-4V |
Power Dissipation |
40W |
Case Connection |
DRAIN |
Turn On Delay Time |
7 ns |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
200m Ω @ 5A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
850pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
21nC @ 10V |
Rise Time |
40ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
10 ns |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
JEDEC-95 Code |
TO-252AA |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
60V |
Pulsed Drain Current-Max (IDM) |
40A |
Dual Supply Voltage |
-60V |
Max Junction Temperature (Tj) |
175°C |
Nominal Vgs |
-4 V |
Height |
2.63mm |
Length |
6.6mm |
Width |
6.2mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
STMicroelectronics STD11NM50N
In stock
Manufacturer |
STMicroelectronics |
---|---|
Series |
MDmesh™ II |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
8.5A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
70W Tc |
Turn Off Delay Time |
33 ns |
Operating Temperature |
150°C TJ |
Pin Count |
3 |
Factory Lead Time |
16 Weeks |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Resistance |
470mOhm |
Terminal Finish |
Matte Tin (Sn) – annealed |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Base Part Number |
STD11 |
Packaging |
Cut Tape (CT) |
JESD-30 Code |
R-PSSO-G2 |
Fall Time (Typ) |
10 ns |
Continuous Drain Current (ID) |
8.5A |
Power Dissipation |
70W |
Turn On Delay Time |
8 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
470m Ω @ 4.5A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
547pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
19nC @ 10V |
Rise Time |
10ns |
Vgs (Max) |
±25V |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Threshold Voltage |
3V |
Gate to Source Voltage (Vgs) |
25V |
Drain Current-Max (Abs) (ID) |
9A |
Drain to Source Breakdown Voltage |
500V |
Height |
2.4mm |
Length |
6.6mm |
Width |
6.2mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
STMicroelectronics STD11NM60N-1
In stock
Manufacturer |
STMicroelectronics |
---|---|
Base Part Number |
STD11 |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
10A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
90W Tc |
Turn Off Delay Time |
50 ns |
Packaging |
Tube |
Series |
MDmesh™ II |
Operating Temperature |
150°C TJ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
Terminal Finish |
MATTE TIN |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Mounting Type |
Through Hole |
Mount |
Through Hole |
Gate Charge (Qg) (Max) @ Vgs |
31nC @ 10V |
Rise Time |
18.5ns |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
90W |
Case Connection |
ISOLATED |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
450m Ω @ 5A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
850pF @ 50V |
Qualification Status |
Not Qualified |
Pin Count |
3 |
Vgs (Max) |
±25V |
Fall Time (Typ) |
12 ns |
Continuous Drain Current (ID) |
10A |
Gate to Source Voltage (Vgs) |
25V |
Drain-source On Resistance-Max |
0.45Ohm |
Drain to Source Breakdown Voltage |
600V |
Pulsed Drain Current-Max (IDM) |
40A |
Avalanche Energy Rating (Eas) |
200 mJ |
Element Configuration |
Single |
RoHS Status |
ROHS3 Compliant |