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Discrete Semiconductors
Taiwan Semiconductor TSM9434CS RLG
In stock
Manufacturer |
Taiwan Semiconductor |
---|---|
Operating Temperature |
-55°C ~ 150°C (TJ) |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Supplier Device Package |
8-SOP |
Base Product Number |
TSM9434 |
Drive Voltage (Max Rds On, Min Rds On) |
2.5V, 4.5V |
Power Dissipation (Max) |
2.5W (Ta) |
Product Status |
Active |
Mounting Type |
Surface Mount |
FET Type |
P-Channel |
Technology |
MOSFET (Metal Oxide) |
Rds On (Max) @ Id, Vgs |
40mOhm @ 6.4A, 4.5V |
Vgs(th) (Max) @ Id |
1V @ 250µA |
Input Capacitance (Ciss) (Max) @ Vds |
1020 pF @ 10 V |
Current - Continuous Drain (Id) @ 25°C |
6.4A (Tc) |
Gate Charge (Qg) (Max) @ Vgs |
19 nC @ 4.5 V |
Drain to Source Voltage (Vdss) |
20 V |
Vgs (Max) |
±8V |
TDK-Epcos U232
In stock
Manufacturer |
InterFET Corporation |
---|---|
Surface Mount |
NO |
Ihs Manufacturer |
INTER F E T CORP |
Manufacturer Part Number |
U232 |
Operating Temperature-Max |
200 °C |
Package Description |
, |
Part Life Cycle Code |
Contact Manufacturer |
Risk Rank |
5.63 |
Rohs Code |
No |
JESD-609 Code |
e0 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Reach Compliance Code |
unknown |
Polarity/Channel Type |
N-CHANNEL |
FET Technology |
JUNCTION |
Power Dissipation-Max (Abs) |
0.3 W |
Texas Instruments 2N4222A
In stock
Manufacturer |
Texas Instruments |
---|---|
Surface Mount |
NO |
Number of Terminals |
4 |
Transistor Element Material |
SILICON |
Package Shape |
ROUND |
JESD-609 Code |
e0 |
Pbfree Code |
No |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Terminal Position |
BOTTOM |
Terminal Form |
WIRE |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
unknown |
Pin Count |
4 |
JESD-30 Code |
O-MBCY-W4 |
Qualification Status |
Not Qualified |
Number of Elements |
1 |
Operating Mode |
DEPLETION MODE |
Polarity/Channel Type |
N-CHANNEL |
JEDEC-95 Code |
TO-72 |
FET Technology |
JUNCTION |
Power Dissipation-Max (Abs) |
0.3 W |
Texas Instruments 2N4860
In stock
Manufacturer |
Texas Instruments |
---|---|
Package Style |
CYLINDRICAL |
Number of Terminals |
3 |
Transistor Element Material |
SILICON |
Ihs Manufacturer |
MICROSEMI CORP |
Manufacturer Part Number |
2N4860 |
Operating Temperature-Max |
200 °C |
Package Body Material |
METAL |
Package Description |
TO-18, 3 PIN |
ECCN Code |
EAR99 |
Surface Mount |
NO |
Part Life Cycle Code |
Active |
Part Package Code |
BCY |
Reflow Temperature-Max (s) |
NOT SPECIFIED |
Risk Rank |
5.05 |
Rohs Code |
No |
JESD-609 Code |
e0 |
Pbfree Code |
No |
Package Shape |
ROUND |
Terminal Finish |
TIN LEAD |
Number of Elements |
1 |
Configuration |
SINGLE |
Terminal Form |
WIRE |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
unknown |
Pin Count |
3 |
Reference Standard |
MIL-19500/385 |
JESD-30 Code |
O-MBCY-W3 |
Qualification Status |
Not Qualified |
HTS Code |
8541.21.00.95 |
Terminal Position |
BOTTOM |
Operating Mode |
DEPLETION MODE |
Polarity/Channel Type |
N-CHANNEL |
JEDEC-95 Code |
TO-206AA |
Drain-source On Resistance-Max |
40 Ω |
DS Breakdown Voltage-Min |
30 V |
FET Technology |
JUNCTION |
Power Dissipation-Max (Abs) |
1.8 W |
Feedback Cap-Max (Crss) |
8 pF |
Texas Instruments 2N5461
In stock
Manufacturer |
Texas Instruments |
---|---|
Number of Pins |
3 |
Voltage Rating (DC) |
10 V |
Tolerance |
2 % |
Termination |
Axial |
Resistance |
680 kΩ |
Current Rating |
10 mA |
Military Standard |
MIL-R-39017 |
Power Dissipation |
350 mW |
Breakdown Voltage |
40 V |
Drain to Source Voltage (Vdss) |
40 V |
Continuous Drain Current (ID) |
5.5 mA |
Length |
6.4 mm |
Lead Free |
Lead Free |
Texas Instruments CSD13201W10
In stock
Manufacturer |
Texas Instruments |
---|---|
Packaging |
Tape & Reel (TR) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
4-UFBGA, DSBGA |
Number of Pins |
4 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.6A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.8V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.2W Ta |
Turn Off Delay Time |
14.4 ns |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Operating Temperature |
-55°C~150°C TJ |
Series |
NexFET™ |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Contact Plating |
Copper, Silver, Tin |
Factory Lead Time |
6 Weeks |
Vgs (Max) |
±8V |
Number of Channels |
1 |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
1.2W |
Turn On Delay Time |
3.9 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
34m Ω @ 1A, 4.5V |
Vgs(th) (Max) @ Id |
1.1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
462pF @ 6V |
Gate Charge (Qg) (Max) @ Vgs |
2.9nC @ 4.5V |
Rise Time |
5.9ns |
Fall Time (Typ) |
9.7 ns |
Continuous Drain Current (ID) |
1.6A |
Base Part Number |
CSD13201 |
Gate to Source Voltage (Vgs) |
8V |
Drain-source On Resistance-Max |
0.053Ohm |
Drain to Source Breakdown Voltage |
12V |
Pulsed Drain Current-Max (IDM) |
20.2A |
Feedback Cap-Max (Crss) |
22.6 pF |
Height |
625μm |
Length |
0m |
Width |
0m |
Thickness |
650μm |
RoHS Status |
ROHS3 Compliant |
Element Configuration |
Single |
Lead Free |
Lead Free |