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Discrete Semiconductors
Texas Instruments CSD18541F5
In stock
Manufacturer |
Texas Instruments |
---|---|
Terminal Position |
BOTTOM |
Mounting Type |
Surface Mount |
Package / Case |
3-SMD, No Lead |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
2.2A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Power Dissipation (Max) |
500mW Ta |
Operating Temperature |
-55°C~150°C TJ |
Number of Elements |
1 |
Packaging |
Tape & Reel (TR) |
Series |
FemtoFET™ |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Mount |
Surface Mount |
Factory Lead Time |
6 Weeks |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
2.2A |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
65m Ω @ 1A, 10V |
Vgs(th) (Max) @ Id |
2.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
777pF @ 30V |
Gate Charge (Qg) (Max) @ Vgs |
14nC @ 10V |
Drain to Source Voltage (Vdss) |
60V |
Element Configuration |
Single |
Base Part Number |
CSD18541 |
Drain-source On Resistance-Max |
0.075Ohm |
DS Breakdown Voltage-Min |
60V |
Feedback Cap-Max (Crss) |
10.5 pF |
Length |
1.49mm |
Width |
730μm |
Thickness |
338μm |
RoHS Status |
ROHS3 Compliant |
Operating Mode |
ENHANCEMENT MODE |
Lead Free |
Lead Free |
Texas Instruments CSD18541F5T
In stock
Manufacturer |
Texas Instruments |
---|---|
Power Dissipation (Max) |
500mW Ta |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
3-SMD, No Lead |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
2.2A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Base Part Number |
CSD18541 |
Factory Lead Time |
6 Weeks |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Series |
FemtoFET™ |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
Terminal Position |
BOTTOM |
Number of Elements |
1 |
Element Configuration |
Single |
Continuous Drain Current (ID) |
2.2A |
Threshold Voltage |
1.75V |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
65m Ω @ 1A, 10V |
Vgs(th) (Max) @ Id |
2.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
777pF @ 30V |
Gate Charge (Qg) (Max) @ Vgs |
14nC @ 10V |
Drain to Source Voltage (Vdss) |
60V |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
FET Type |
N-Channel |
Drain-source On Resistance-Max |
0.075Ohm |
DS Breakdown Voltage-Min |
60V |
Feedback Cap-Max (Crss) |
10.5 pF |
Length |
1.49mm |
Width |
730μm |
Thickness |
338μm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Texas Instruments CSD18542KCS
In stock
Manufacturer |
Texas Instruments |
---|---|
Packaging |
Tray |
Contact Plating |
Copper, Tin |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Current - Continuous Drain (Id) @ 25℃ |
200A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Power Dissipation (Max) |
200W Tc |
Turn Off Delay Time |
18 ns |
Element Configuration |
Single |
Factory Lead Time |
6 Weeks |
Series |
NexFET™ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Reach Compliance Code |
not_compliant |
Base Part Number |
CSD18542 |
Operating Temperature |
-55°C~175°C TJ |
Case Connection |
DRAIN |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
170A |
Rds On (Max) @ Id, Vgs |
44m Ω @ 100A, 10V |
Vgs(th) (Max) @ Id |
2.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
5070pF @ 30V |
Gate Charge (Qg) (Max) @ Vgs |
57nC @ 10V |
Rise Time |
5ns |
Drain to Source Voltage (Vdss) |
60V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
21 ns |
Continuous Drain Current (ID) |
200A |
Turn On Delay Time |
6 ns |
FET Type |
N-Channel |
Pulsed Drain Current-Max (IDM) |
400A |
DS Breakdown Voltage-Min |
60V |
Avalanche Energy Rating (Eas) |
281 mJ |
Feedback Cap-Max (Crss) |
14 pF |
Height |
4.7mm |
Length |
10.16mm |
Width |
8.7mm |
Thickness |
4.58mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Contains Lead |
Texas Instruments CSD18543Q3AT
In stock
Manufacturer |
Texas Instruments |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mounting Type |
Surface Mount |
Package / Case |
8-PowerVDFN |
Surface Mount |
YES |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
12A Ta 60A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
66W Tc |
Terminal Form |
FLAT |
Factory Lead Time |
6 Weeks |
Packaging |
Tape & Reel (TR) |
Series |
NexFET™ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
5 |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
AVALANCHE RATED |
Terminal Position |
DUAL |
Turn Off Delay Time |
8 ns |
Base Part Number |
CSD18543 |
Gate Charge (Qg) (Max) @ Vgs |
14.5nC @ 10V |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
2.8W |
Case Connection |
DRAIN |
Turn On Delay Time |
9 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
15.6m Ω @ 12A, 4.5V |
Vgs(th) (Max) @ Id |
2.7V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1150pF @ 30V |
Number of Channels |
1 |
Element Configuration |
Single |
Continuous Drain Current (ID) |
12A |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
60V |
Avalanche Energy Rating (Eas) |
55 mJ |
Max Junction Temperature (Tj) |
150°C |
Feedback Cap-Max (Crss) |
6.2 pF |
Height |
900μm |
Length |
3.3mm |
Width |
3.3mm |
Thickness |
800μm |
RoHS Status |
ROHS3 Compliant |
Texas Instruments CSD18563Q5A
In stock
Manufacturer |
Texas Instruments |
---|---|
Number of Terminations |
5 |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
8-PowerTDFN |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Series |
NexFET™ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Power Dissipation |
3.2W |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Terminal Position |
DUAL |
Terminal Form |
NO LEAD |
Peak Reflow Temperature (Cel) |
260 |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
CSD18563 |
Number of Elements |
1 |
Number of Channels |
1 |
Power Dissipation-Max |
3.2W Ta 116W Tc |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Contact Plating |
Tin |
Factory Lead Time |
8 Weeks |
Continuous Drain Current (ID) |
15A |
Turn On Delay Time |
3.2 ns |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
6.8m Ω @ 18A, 10V |
Vgs(th) (Max) @ Id |
2.4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1500pF @ 30V |
Current - Continuous Drain (Id) @ 25°C |
100A Ta |
Gate Charge (Qg) (Max) @ Vgs |
20nC @ 10V |
Rise Time |
6.3ns |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
1.7 ns |
Turn-Off Delay Time |
11.4 ns |
Threshold Voltage |
2V |
Gate to Source Voltage (Vgs) |
20V |
Case Connection |
DRAIN |
Drain Current-Max (Abs) (ID) |
93A |
Drain to Source Breakdown Voltage |
60V |
Pulsed Drain Current-Max (IDM) |
96A |
Max Junction Temperature (Tj) |
150°C |
Nominal Vgs |
2 V |
Height |
1.1mm |
Length |
4.9mm |
Width |
6mm |
Thickness |
1mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
FET Type |
N-Channel |
Lead Free |
Contains Lead |
Texas Instruments CSD19505KCS
In stock
Manufacturer |
Texas Instruments |
---|---|
Operating Temperature |
-55°C~175°C TJ |
Contact Plating |
Tin |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Weight |
6.000006g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
150A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
300W Tc |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Factory Lead Time |
12 Weeks |
Packaging |
Tube |
Series |
NexFET™ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Additional Feature |
AVALANCHE RATED |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
not_compliant |
Turn Off Delay Time |
62 ns |
Base Part Number |
CSD19505 |
Vgs (Max) |
±20V |
Fall Time (Typ) |
6 ns |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
300W |
Case Connection |
DRAIN |
Turn On Delay Time |
31 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
3.8m Ω @ 100A, 6V |
Vgs(th) (Max) @ Id |
3.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
7820pF @ 40V |
Gate Charge (Qg) (Max) @ Vgs |
76nC @ 10V |
Rise Time |
16ns |
Number of Channels |
1 |
Element Configuration |
Single |
Continuous Drain Current (ID) |
150A |
Threshold Voltage |
2.6V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
80V |
Pulsed Drain Current-Max (IDM) |
400A |
Height |
4.7mm |
Length |
10.16mm |
Width |
8.7mm |
Thickness |
4.58mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Texas Instruments CSD19531KCS
In stock
Manufacturer |
Texas Instruments |
---|---|
Base Part Number |
CSD19531 |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Weight |
6.000006g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
100A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
214W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Turn Off Delay Time |
16 ns |
Series |
NexFET™ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Additional Feature |
AVALANCHE RATED |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Contact Plating |
Tin |
Factory Lead Time |
6 Weeks |
Vgs (Max) |
±20V |
Fall Time (Typ) |
4.1 ns |
Power Dissipation |
179W |
Case Connection |
DRAIN |
Turn On Delay Time |
8.4 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
7.7m Ω @ 60A, 10V |
Vgs(th) (Max) @ Id |
3.3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
3870pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
38nC @ 10V |
Rise Time |
7.2ns |
Drain to Source Voltage (Vdss) |
100V |
Element Configuration |
Single |
Number of Channels |
1 |
Continuous Drain Current (ID) |
105A |
Threshold Voltage |
2.7V |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0088Ohm |
Pulsed Drain Current-Max (IDM) |
285A |
Height |
4.7mm |
Length |
10.16mm |
Width |
8.7mm |
Thickness |
4.58mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Operating Mode |
ENHANCEMENT MODE |
Lead Free |
Lead Free |
Texas Instruments CSD19531Q5AT
In stock
Manufacturer |
Texas Instruments |
---|---|
Packaging |
Tape & Reel (TR) |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
8-PowerTDFN |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
100A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
3.3W Ta 125W Tc |
Turn Off Delay Time |
18.4 ns |
Reach Compliance Code |
not_compliant |
Factory Lead Time |
8 Weeks |
Series |
NexFET™ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
5 |
ECCN Code |
EAR99 |
Additional Feature |
AVALANCHE RATED |
Terminal Position |
DUAL |
Terminal Form |
NO LEAD |
Peak Reflow Temperature (Cel) |
260 |
Operating Temperature |
-55°C~150°C TJ |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Vgs (Max) |
±20V |
Fall Time (Typ) |
5.2 ns |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
Turn On Delay Time |
6 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
6.4m Ω @ 16A, 10V |
Vgs(th) (Max) @ Id |
3.3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
3870pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
48nC @ 10V |
Rise Time |
5.8ns |
Base Part Number |
CSD19531 |
Number of Channels |
1 |
Continuous Drain Current (ID) |
100A |
Threshold Voltage |
2.7V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
100V |
Pulsed Drain Current-Max (IDM) |
337A |
Height |
1.1mm |
Length |
4.9mm |
Width |
6mm |
Thickness |
1mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Contains Lead |
Texas Instruments CSD19532Q5BT
In stock
Manufacturer |
Texas Instruments |
---|---|
Series |
NexFET™ |
Package / Case |
8-PowerTDFN |
Surface Mount |
YES |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
100A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
3.1W Ta 195W Tc |
Operating Temperature |
-55°C~150°C TJ |
Peak Reflow Temperature (Cel) |
260 |
Packaging |
Tape & Reel (TR) |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
5 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
AVALANCHE RATED |
Terminal Position |
DUAL |
Terminal Form |
NO LEAD |
Mounting Type |
Surface Mount |
Factory Lead Time |
6 Weeks |
Drain to Source Voltage (Vdss) |
100V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
4.9m Ω @ 17A, 10V |
Vgs(th) (Max) @ Id |
3.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
4810pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
62nC @ 10V |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
100A |
Reach Compliance Code |
not_compliant |
Drain Current-Max (Abs) (ID) |
17A |
Drain-source On Resistance-Max |
0.0057Ohm |
Pulsed Drain Current-Max (IDM) |
400A |
DS Breakdown Voltage-Min |
100V |
Avalanche Energy Rating (Eas) |
274 mJ |
Length |
5mm |
Width |
6mm |
Thickness |
950μm |
RoHS Status |
ROHS3 Compliant |
Base Part Number |
CSD19532 |
Lead Free |
Contains Lead |
Texas Instruments CSD19533KCS
In stock
Manufacturer |
Texas Instruments |
---|---|
Operating Temperature |
-55°C~175°C TJ |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Weight |
6.000006g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
100A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
188W Tc |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Turn Off Delay Time |
12 ns |
Packaging |
Tube |
Series |
NexFET™ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Additional Feature |
AVALANCHE RATED |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
not_compliant |
Contact Plating |
Tin |
Factory Lead Time |
6 Weeks |
Vgs (Max) |
±20V |
Number of Channels |
1 |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
Turn On Delay Time |
7 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
10.5m Ω @ 55A, 10V |
Vgs(th) (Max) @ Id |
3.4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
2670pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
35nC @ 10V |
Rise Time |
5ns |
Fall Time (Typ) |
2 ns |
Continuous Drain Current (ID) |
100A |
Base Part Number |
CSD19533 |
Threshold Voltage |
2.8V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
100V |
Pulsed Drain Current-Max (IDM) |
207A |
Height |
4.7mm |
Length |
10.16mm |
Width |
8.7mm |
Thickness |
4.58mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Element Configuration |
Single |
Lead Free |
Lead Free |
Texas Instruments CSD19535KTTT
In stock
Manufacturer |
Texas Instruments |
---|---|
Packaging |
Tape & Reel (TR) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
200A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
300W Tc |
Turn Off Delay Time |
21 ns |
Element Configuration |
Single |
Operating Temperature |
-55°C~175°C TJ |
Series |
NexFET™ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
2 (1 Year) |
Number of Terminations |
2 |
Additional Feature |
AVALANCHE RATED |
Terminal Form |
GULL WING |
Reach Compliance Code |
not_compliant |
Base Part Number |
CSD19535 |
Contact Plating |
Tin |
Factory Lead Time |
12 Weeks |
Fall Time (Typ) |
15 ns |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
3.4m Ω @ 100A, 10V |
Vgs(th) (Max) @ Id |
3.4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
7930pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
98nC @ 10V |
Rise Time |
18ns |
Drain to Source Voltage (Vdss) |
100V |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
200A |
Gate to Source Voltage (Vgs) |
20V |
Operating Mode |
ENHANCEMENT MODE |
Drain-source On Resistance-Max |
0.0041Ohm |
Pulsed Drain Current-Max (IDM) |
400A |
DS Breakdown Voltage-Min |
100V |
Avalanche Energy Rating (Eas) |
451 mJ |
Height |
4.83mm |
Length |
10.18mm |
Width |
8.41mm |
Thickness |
4.44mm |
RoHS Status |
ROHS3 Compliant |
Turn On Delay Time |
9 ns |
Lead Free |
Contains Lead |
Texas Instruments CSD19536KTTT
In stock
Manufacturer |
Texas Instruments |
---|---|
Packaging |
Tape & Reel (TR) |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
200A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
375W Tc |
Turn Off Delay Time |
32 ns |
Base Part Number |
CSD19536 |
Factory Lead Time |
6 Weeks |
Series |
NexFET™ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
2 (1 Year) |
Number of Terminations |
2 |
Additional Feature |
AVALANCHE RATED |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Operating Temperature |
-55°C~175°C TJ |
Element Configuration |
Single |
Fall Time (Typ) |
6 ns |
Continuous Drain Current (ID) |
200A |
Turn On Delay Time |
13 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
2.4m Ω @ 100A, 10V |
Vgs(th) (Max) @ Id |
3.2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
12000pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
153nC @ 10V |
Rise Time |
8ns |
Drain to Source Voltage (Vdss) |
100V |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0028Ohm |
Pulsed Drain Current-Max (IDM) |
400A |
DS Breakdown Voltage-Min |
100V |
Avalanche Energy Rating (Eas) |
806 mJ |
Feedback Cap-Max (Crss) |
61 pF |
Height |
4.83mm |
Length |
10.18mm |
Width |
8.41mm |
Thickness |
4.44mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Contains Lead |