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Discrete Semiconductors
Infineon Technologies AUIRF1404
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
160A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
333W Tc |
Turn Off Delay Time |
46 ns |
Case Connection |
DRAIN |
Operating Temperature |
-55°C~175°C TJ |
Published |
2007 |
Series |
HEXFET® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Additional Feature |
AVALANCHE RATED |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
333W |
Mount |
Through Hole |
Factory Lead Time |
16 Weeks |
JEDEC-95 Code |
TO-220AB |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
4m Ω @ 121A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
5669pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
196nC @ 10V |
Rise Time |
190ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
33 ns |
Continuous Drain Current (ID) |
160A |
Threshold Voltage |
2V |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.004Ohm |
Turn On Delay Time |
17 ns |
Drain to Source Breakdown Voltage |
40V |
Pulsed Drain Current-Max (IDM) |
808A |
Avalanche Energy Rating (Eas) |
620 mJ |
Nominal Vgs |
2 V |
Height |
16.51mm |
Length |
10.66mm |
Width |
4.82mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
Transistor Application |
SWITCHING |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRF1404ZS
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
160A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
200W Tc |
Turn Off Delay Time |
36 ns |
JESD-30 Code |
R-PSSO-G2 |
Operating Temperature |
-55°C~175°C TJ |
Published |
2010 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Contact Plating |
Tin |
Factory Lead Time |
16 Weeks |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
Turn On Delay Time |
18 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
3.7m Ω @ 75A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
4340pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
150nC @ 10V |
Rise Time |
110ns |
Fall Time (Typ) |
58 ns |
Continuous Drain Current (ID) |
160A |
Element Configuration |
Single |
Threshold Voltage |
2V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
40V |
Avalanche Energy Rating (Eas) |
480 mJ |
Height |
4.83mm |
Length |
10.67mm |
Width |
9.65mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
Power Dissipation |
200W |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRF1404ZSTRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tape & Reel (TR) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
160A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
200W Tc |
Turn Off Delay Time |
36 ns |
Time@Peak Reflow Temperature-Max (s) |
30 |
Factory Lead Time |
16 Weeks |
Published |
2010 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Operating Temperature |
-55°C~175°C TJ |
JESD-30 Code |
R-PSSO-G2 |
Rise Time |
110ns |
Vgs (Max) |
±20V |
Power Dissipation |
200W |
Case Connection |
DRAIN |
Turn On Delay Time |
18 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
3.7m Ω @ 75A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
4340pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
150nC @ 10V |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Fall Time (Typ) |
58 ns |
Continuous Drain Current (ID) |
160A |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
40V |
Avalanche Energy Rating (Eas) |
480 mJ |
Height |
4.826mm |
Length |
10.668mm |
Width |
9.65mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRF1405ZS-7TRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Factory Lead Time |
16 Weeks |
Mounting Type |
Surface Mount |
Current - Continuous Drain (Id) @ 25℃ |
120A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
230W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2010 |
Series |
HEXFET® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
4.9m Ω @ 88A, 10V |
Vgs(th) (Max) @ Id |
4V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds |
5360pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
230nC @ 10V |
Drain to Source Voltage (Vdss) |
55V |
Vgs (Max) |
±20V |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRF2804STRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Element Configuration |
Single |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
195A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
300W Tc |
Turn Off Delay Time |
130 ns |
Packaging |
Tape & Reel (TR) |
Published |
2010 |
Operating Temperature |
-55°C~175°C TJ |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Contact Plating |
Tin |
Factory Lead Time |
16 Weeks |
Continuous Drain Current (ID) |
195A |
Threshold Voltage |
2V |
Turn On Delay Time |
13 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
2m Ω @ 75A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
6450pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
240nC @ 10V |
Rise Time |
120ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
130 ns |
Power Dissipation |
300W |
Operating Mode |
ENHANCEMENT MODE |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
270A |
Drain to Source Breakdown Voltage |
40V |
Avalanche Energy Rating (Eas) |
540 mJ |
Height |
4.826mm |
Length |
10.668mm |
Width |
9.65mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Case Connection |
DRAIN |
Lead Free |
Lead Free |
Infineon Technologies AUIRF2804STRL7P
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tape & Reel (TR) |
Mounting Type |
Surface Mount |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
240A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
330W Tc |
Terminal Form |
GULL WING |
Factory Lead Time |
16 Weeks |
Published |
2010 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
6 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Operating Temperature |
-55°C~175°C TJ |
Peak Reflow Temperature (Cel) |
260 |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
6930pF @ 25V |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
1.6m Ω @ 160A, 10V |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G6 |
Gate Charge (Qg) (Max) @ Vgs |
260nC @ 10V |
Drain to Source Voltage (Vdss) |
40V |
Vgs (Max) |
±20V |
Drain Current-Max (Abs) (ID) |
240A |
Drain-source On Resistance-Max |
0.0016Ohm |
Pulsed Drain Current-Max (IDM) |
1360A |
DS Breakdown Voltage-Min |
40V |
Avalanche Energy Rating (Eas) |
1050 mJ |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRF2804WL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Turn Off Delay Time |
71 ns |
Mounting Type |
Through Hole |
Package / Case |
TO-262-3 Wide Leads |
Number of Pins |
3 |
Current - Continuous Drain (Id) @ 25℃ |
240A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Element Configuration |
Single |
Power Dissipation (Max) |
300W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Published |
2010 |
Series |
HEXFET® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Mount |
Through Hole |
Factory Lead Time |
16 Weeks |
Fall Time (Typ) |
100 ns |
Turn On Delay Time |
19 ns |
Rds On (Max) @ Id, Vgs |
1.8m Ω @ 187A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
7978pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
225nC @ 10V |
Rise Time |
241ns |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
295A |
Gate to Source Voltage (Vgs) |
20V |
Power Dissipation |
300W |
Drain Current-Max (Abs) (ID) |
240A |
Drain to Source Breakdown Voltage |
40V |
Height |
9.65mm |
Length |
10.67mm |
Width |
4.83mm |
Radiation Hardening |
No |
FET Type |
N-Channel |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRF2903ZL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
160A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
231W Tc |
Turn Off Delay Time |
48 ns |
Operating Mode |
ENHANCEMENT MODE |
Factory Lead Time |
13 Weeks |
Published |
2007 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Temperature |
-55°C~175°C TJ |
Power Dissipation |
231W |
Continuous Drain Current (ID) |
160A |
Threshold Voltage |
2V |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
2.4m Ω @ 75A, 10V |
Vgs(th) (Max) @ Id |
4V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds |
6320pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
240nC @ 10V |
Rise Time |
100ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
37 ns |
Case Connection |
DRAIN |
Turn On Delay Time |
24 ns |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0024Ohm |
Drain to Source Breakdown Voltage |
30V |
Nominal Vgs |
2 V |
Height |
9.65mm |
Length |
10.67mm |
Width |
4.83mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
RoHS Compliant |
Infineon Technologies AUIRF2903ZS
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
160A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
231W Tc |
Turn Off Delay Time |
48 ns |
JESD-30 Code |
R-PSSO-G2 |
Operating Temperature |
-55°C~175°C TJ |
Published |
2010 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Contact Plating |
Tin |
Factory Lead Time |
16 Weeks |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
Turn On Delay Time |
24 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
2.4m Ω @ 75A, 10V |
Vgs(th) (Max) @ Id |
4V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds |
6320pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
240nC @ 10V |
Rise Time |
100ns |
Fall Time (Typ) |
37 ns |
Continuous Drain Current (ID) |
160A |
Element Configuration |
Single |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0024Ohm |
Drain to Source Breakdown Voltage |
30V |
Nominal Vgs |
2 V |
Height |
4.83mm |
Length |
10.67mm |
Width |
9.65mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
Power Dissipation |
231W |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRF2903ZSTRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tape & Reel (TR) |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
160A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
231W Tc |
Turn Off Delay Time |
48 ns |
Peak Reflow Temperature (Cel) |
260 |
Operating Temperature |
-55°C~175°C TJ |
Published |
2013 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Mount |
Surface Mount |
Factory Lead Time |
16 Weeks |
Input Capacitance (Ciss) (Max) @ Vds |
6320pF @ 25V |
JESD-30 Code |
R-PSSO-G2 |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
231W |
Case Connection |
DRAIN |
Turn On Delay Time |
24 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
2.4m Ω @ 75A, 10V |
Vgs(th) (Max) @ Id |
4V @ 150μA |
Gate Charge (Qg) (Max) @ Vgs |
240nC @ 10V |
Rise Time |
100ns |
Time@Peak Reflow Temperature-Max (s) |
30 |
Vgs (Max) |
±20V |
Fall Time (Typ) |
37 ns |
Continuous Drain Current (ID) |
160A |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0024Ohm |
Drain to Source Breakdown Voltage |
30V |
Pulsed Drain Current-Max (IDM) |
1020A |
Radiation Hardening |
No |
Configuration |
SINGLE WITH BUILT-IN DIODE |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRF3004WL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Operating Mode |
ENHANCEMENT MODE |
Mount |
Surface Mount, Through Hole |
Mounting Type |
Surface Mount |
Package / Case |
TO-262-3 Wide Leads |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
240A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Turn Off Delay Time |
90 ns |
Operating Temperature |
-55°C~175°C TJ |
Power Dissipation (Max) |
375W Tc |
Packaging |
Tube |
Published |
2011 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Element Configuration |
Single |
Contact Plating |
Tin |
Factory Lead Time |
16 Weeks |
Threshold Voltage |
2V |
JEDEC-95 Code |
TO-262AA |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
1.4m Ω @ 195A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
9450pF @ 32V |
Gate Charge (Qg) (Max) @ Vgs |
210nC @ 10V |
Rise Time |
220ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
130 ns |
Continuous Drain Current (ID) |
240A |
Turn On Delay Time |
19 ns |
Power Dissipation |
375W |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
40V |
Avalanche Energy Rating (Eas) |
470 mJ |
Nominal Vgs |
2 V |
Height |
11.3mm |
Length |
10.67mm |
Width |
4.83mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
FET Type |
N-Channel |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRF3007
In stock
Manufacturer |
Infineon Technologies |
---|---|
Element Configuration |
Single |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Current - Continuous Drain (Id) @ 25℃ |
75A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Turn Off Delay Time |
55 ns |
Operating Temperature |
-55°C~175°C TJ |
Power Dissipation (Max) |
200W Tc |
Packaging |
Tube |
Published |
2010 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Mount |
Through Hole |
Factory Lead Time |
8 Weeks |
Fall Time (Typ) |
49 ns |
Continuous Drain Current (ID) |
75A |
Rds On (Max) @ Id, Vgs |
12.6m Ω @ 48A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
3270pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
130nC @ 10V |
Rise Time |
80ns |
Vgs (Max) |
±20V |
Turn On Delay Time |
12 ns |
Power Dissipation |
200W |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
75V |
Height |
9.02mm |
Length |
10.67mm |
Width |
4.83mm |
Radiation Hardening |
No |
FET Type |
N-Channel |
RoHS Status |
RoHS Compliant |