Showing 2113–2124 of 15245 results

Discrete Semiconductors

Infineon Technologies AUIRF7732S2TR

In stock

SKU: AUIRF7732S2TR-11
Manufacturer

Infineon Technologies

Operating Temperature

-55°C~175°C TJ

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

DirectFET™ Isometric SC

Number of Pins

7

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

14A Ta

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Configuration

SINGLE WITH BUILT-IN DIODE

Factory Lead Time

16 Weeks

Packaging

Tape & Reel (TR)

Published

2015

Series

HEXFET®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Terminal Position

BOTTOM

JESD-30 Code

R-XBCC-N3

Power Dissipation (Max)

2.5W Ta 41W Tc

Operating Mode

ENHANCEMENT MODE

Fall Time (Typ)

37 ns

Continuous Drain Current (ID)

14A

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

6.95m Ω @ 33A, 10V

Vgs(th) (Max) @ Id

4V @ 50μA

Input Capacitance (Ciss) (Max) @ Vds

1700pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

45nC @ 10V

Rise Time

123ns

Vgs (Max)

±20V

Power Dissipation

41W

Case Connection

DRAIN

Threshold Voltage

4V

Gate to Source Voltage (Vgs)

16V

Drain Current-Max (Abs) (ID)

55A

Drain-source On Resistance-Max

0.00695Ohm

Drain to Source Breakdown Voltage

40V

Pulsed Drain Current-Max (IDM)

220A

Avalanche Energy Rating (Eas)

45 mJ

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRFN7110TR

In stock

SKU: AUIRFN7110TR-11
Manufacturer

Infineon Technologies

Factory Lead Time

11 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

8-PowerTDFN

Number of Pins

8

Supplier Device Package

8-PQFN (5×6)

Current - Continuous Drain (Id) @ 25℃

58A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Power Dissipation (Max)

4.3W Ta 125W Tc

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2015

Series

Automotive, AEC-Q101, HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

175°C

Min Operating Temperature

-55°C

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

14.5mOhm @ 35A, 10V

Vgs(th) (Max) @ Id

4V @ 100μA

Input Capacitance (Ciss) (Max) @ Vds

3050pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

74nC @ 10V

Drain to Source Voltage (Vdss)

100V

Vgs (Max)

±20V

Continuous Drain Current (ID)

58A

Input Capacitance

3.05nF

Rds On Max

14.5 mΩ

RoHS Status

RoHS Compliant

Infineon Technologies AUIRFN8403TR

In stock

SKU: AUIRFN8403TR-11
Manufacturer

Infineon Technologies

Packaging

Tape & Reel (TR)

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

8-PowerTDFN

Number of Pins

8

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

95A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

4.3W Ta 94W Tc

Turn Off Delay Time

33 ns

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Factory Lead Time

11 Weeks

Published

2013

Series

HEXFET®

Part Status

Not For New Designs

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

5

ECCN Code

EAR99

Additional Feature

ULTRA LOW RESISTANCE

Terminal Position

DUAL

Terminal Form

FLAT

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Operating Temperature

-55°C~175°C TJ

Base Part Number

IRFN8403

Rise Time

37ns

Drain to Source Voltage (Vdss)

40V

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Case Connection

DRAIN

Turn On Delay Time

11 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

3.3m Ω @ 50A, 10V

Vgs(th) (Max) @ Id

3.9V @ 100μA

Input Capacitance (Ciss) (Max) @ Vds

3174pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

98nC @ 10V

JESD-30 Code

R-PDSO-F5

Number of Channels

1

Vgs (Max)

±20V

Fall Time (Typ)

26 ns

Continuous Drain Current (ID)

95A

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.0033Ohm

Pulsed Drain Current-Max (IDM)

492A

DS Breakdown Voltage-Min

40V

Height

1.17mm

Length

5.85mm

Width

5mm

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRFP4004

In stock

SKU: AUIRFP4004-11
Manufacturer

Infineon Technologies

Operating Temperature

-55°C~175°C TJ

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

TO-247-3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

195A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

380W Tc

Operating Mode

ENHANCEMENT MODE

Factory Lead Time

16 Weeks

Packaging

Tube

Published

2008

Series

HEXFET®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Additional Feature

ULTRA-LOW RESISTANCE

Element Configuration

Single

Turn Off Delay Time

160 ns

Power Dissipation

380W

Continuous Drain Current (ID)

195A

Threshold Voltage

2V

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

1.7m Ω @ 195A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

8920pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

330nC @ 10V

Rise Time

370ns

Vgs (Max)

±20V

Fall Time (Typ)

190 ns

Case Connection

DRAIN

Turn On Delay Time

59 ns

JEDEC-95 Code

TO-247AC

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

40V

Avalanche Energy Rating (Eas)

290 mJ

Height

20.7mm

Length

15.87mm

Width

5.31mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRFP4568

In stock

SKU: AUIRFP4568-11
Manufacturer

Infineon Technologies

Operating Temperature

-55°C~175°C TJ

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

TO-247-3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

171A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Additional Feature

ULTRA LOW RESISTANCE

Factory Lead Time

16 Weeks

Packaging

Tube

Published

2015

Series

HEXFET®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Resistance

4.8mOhm

Power Dissipation (Max)

517W Tc

Terminal Position

SINGLE

Vgs(th) (Max) @ Id

5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

10470pF @ 50V

Reference Standard

AEC-Q101

JESD-30 Code

R-PSFM-T3

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

5.9m Ω @ 103A, 10V

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Gate Charge (Qg) (Max) @ Vgs

227nC @ 10V

Drain to Source Voltage (Vdss)

150V

Vgs (Max)

±30V

Continuous Drain Current (ID)

171A

JEDEC-95 Code

TO-247AC

Pulsed Drain Current-Max (IDM)

684A

DS Breakdown Voltage-Min

150V

Avalanche Energy Rating (Eas)

763 mJ

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRFR024N

In stock

SKU: AUIRFR024N-11
Manufacturer

Infineon Technologies

Element Configuration

Single

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

17A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

45W Tc

Turn Off Delay Time

19 ns

Packaging

Tube

Published

2011

Operating Temperature

-55°C~175°C TJ

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Contact Plating

Tin

Factory Lead Time

16 Weeks

Continuous Drain Current (ID)

17A

Threshold Voltage

2V

Turn On Delay Time

4.9 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

75m Ω @ 10A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

370pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

20nC @ 10V

Rise Time

34ns

Vgs (Max)

±20V

Fall Time (Typ)

27 ns

Power Dissipation

45W

Operating Mode

ENHANCEMENT MODE

JEDEC-95 Code

TO-252AA

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.075Ohm

Drain to Source Breakdown Voltage

55V

Pulsed Drain Current-Max (IDM)

68A

Height

2.39mm

Length

6.73mm

Width

6.22mm

Radiation Hardening

No

REACH SVHC

No SVHC

Case Connection

DRAIN

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRFR2407

In stock

SKU: AUIRFR2407-11
Manufacturer

Infineon Technologies

Published

2011

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

42A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

110W Tc

Turn Off Delay Time

65 ns

Operating Temperature

-55°C~175°C TJ

JESD-30 Code

R-PSSO-G2

Contact Plating

Tin

Series

HEXFET®

JESD-609 Code

e3

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Position

SINGLE

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

Packaging

Tube

Configuration

SINGLE WITH BUILT-IN DIODE

Fall Time (Typ)

66 ns

Continuous Drain Current (ID)

42A

Case Connection

DRAIN

Turn On Delay Time

16 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

26m Ω @ 25A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2400pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

110nC @ 10V

Rise Time

90ns

Vgs (Max)

±20V

Operating Mode

ENHANCEMENT MODE

Power Dissipation

110W

Threshold Voltage

2V

JEDEC-95 Code

TO-252AA

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.026Ohm

Drain to Source Breakdown Voltage

75V

Height

2.39mm

Length

6.73mm

Width

6.22mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRFR2407TRL

In stock

SKU: AUIRFR2407TRL-11
Manufacturer

Infineon Technologies

Packaging

Tape & Reel (TR)

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

42A Tc

Number of Elements

1

Power Dissipation (Max)

110W Tc

Turn Off Delay Time

65 ns

Peak Reflow Temperature (Cel)

260

Factory Lead Time

16 Weeks

Published

2015

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Position

SINGLE

Terminal Form

GULL WING

Operating Temperature

-55°C~175°C TJ

Time@Peak Reflow Temperature-Max (s)

30

Input Capacitance (Ciss) (Max) @ Vds

2400pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

110nC @ 10V

Operating Mode

ENHANCEMENT MODE

Power Dissipation

110W

Case Connection

DRAIN

Turn On Delay Time

16 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

26m Ω @ 25A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

JESD-30 Code

R-PSSO-G2

Configuration

SINGLE WITH BUILT-IN DIODE

Rise Time

90ns

Fall Time (Typ)

66 ns

Continuous Drain Current (ID)

42A

JEDEC-95 Code

TO-252AA

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.026Ohm

Drain to Source Breakdown Voltage

75V

Pulsed Drain Current-Max (IDM)

170A

Radiation Hardening

No

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRFR2905ZTRL

In stock

SKU: AUIRFR2905ZTRL-11
Manufacturer

Infineon Technologies

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Mounting Type

Surface Mount

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

42A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

110W Tc

Operating Temperature

-55°C~175°C TJ

Published

2013

Series

HEXFET®

Packaging

Tape & Reel (TR)

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Additional Feature

ULTRA LOW RESISTANCE

Terminal Position

SINGLE

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Mount

Surface Mount

Factory Lead Time

16 Weeks

Gate Charge (Qg) (Max) @ Vgs

44nC @ 10V

Rise Time

66ns

Operating Mode

ENHANCEMENT MODE

Power Dissipation

110W

Case Connection

DRAIN

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

14.5m Ω @ 36A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1380pF @ 25V

JESD-30 Code

R-PSSO-G2

Reference Standard

AEC-Q101

Vgs (Max)

±20V

Fall Time (Typ)

35 ns

Continuous Drain Current (ID)

42A

JEDEC-95 Code

TO-252AA

Drain-source On Resistance-Max

0.0145Ohm

Drain to Source Breakdown Voltage

55V

Pulsed Drain Current-Max (IDM)

240A

Avalanche Energy Rating (Eas)

55 mJ

Configuration

SINGLE WITH BUILT-IN DIODE

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRFR3504

In stock

SKU: AUIRFR3504-11
Manufacturer

Infineon Technologies

Packaging

Tube

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

56A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

140W Tc

Turn Off Delay Time

36 ns

Element Configuration

Single

Factory Lead Time

26 Weeks

Published

2011

Series

HEXFET®

JESD-609 Code

e3

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Operating Temperature

-55°C~175°C TJ

Operating Mode

ENHANCEMENT MODE

Continuous Drain Current (ID)

56A

Threshold Voltage

2V

Turn On Delay Time

11 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

9.2m Ω @ 30A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2150pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

71nC @ 10V

Rise Time

53ns

Vgs (Max)

±20V

Fall Time (Typ)

22 ns

Power Dissipation

140W

Case Connection

DRAIN

JEDEC-95 Code

TO-252AA

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

87A

Drain-source On Resistance-Max

0.0092Ohm

Drain to Source Breakdown Voltage

40V

Avalanche Energy Rating (Eas)

480 mJ

Height

2.39mm

Length

6.73mm

Width

6.22mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRFR4105Z

In stock

SKU: AUIRFR4105Z-11
Manufacturer

Infineon Technologies

Element Configuration

Single

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

20A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

48W Tc

Turn Off Delay Time

26 ns

Operating Temperature

-55°C~175°C TJ

Published

2010

Series

HEXFET®

Packaging

Tube

JESD-609 Code

e3

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Resistance

24.5MOhm

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Mount

Surface Mount

Contact Plating

Tin

Continuous Drain Current (ID)

30A

Threshold Voltage

2V

Turn On Delay Time

10 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

24.5m Ω @ 18A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

740pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

27nC @ 10V

Rise Time

40ns

Vgs (Max)

±20V

Fall Time (Typ)

24 ns

Power Dissipation

48W

Operating Mode

ENHANCEMENT MODE

JEDEC-95 Code

TO-252AA

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

55V

Avalanche Energy Rating (Eas)

29 mJ

Height

2.39mm

Length

6.73mm

Width

6.22mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Case Connection

DRAIN

Lead Free

Lead Free

Infineon Technologies AUIRFR4615

In stock

SKU: AUIRFR4615-11
Manufacturer

Infineon Technologies

Packaging

Tube

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

33A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

144W Tc

Turn Off Delay Time

25 ns

JESD-30 Code

R-PSSO-G2

Factory Lead Time

13 Weeks

Published

2011

Series

HEXFET®

JESD-609 Code

e3

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

Operating Temperature

-55°C~175°C TJ

Element Configuration

Single

Fall Time (Typ)

20 ns

Continuous Drain Current (ID)

33A

Case Connection

DRAIN

Turn On Delay Time

15 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

42m Ω @ 21A, 10V

Vgs(th) (Max) @ Id

5V @ 100μA

Input Capacitance (Ciss) (Max) @ Vds

1750pF @ 50V

Gate Charge (Qg) (Max) @ Vgs

26nC @ 10V

Rise Time

35ns

Vgs (Max)

±20V

Operating Mode

ENHANCEMENT MODE

Power Dissipation

144W

Threshold Voltage

3V

JEDEC-95 Code

TO-252AA

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.042Ohm

Drain to Source Breakdown Voltage

150V

Height

2.39mm

Length

6.73mm

Width

6.22mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant