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Discrete Semiconductors
Infineon Technologies AUIRFR4620
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
24A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
144W Tc |
Turn Off Delay Time |
25.4 ns |
JESD-30 Code |
R-PSSO-G2 |
Factory Lead Time |
36 Weeks |
Published |
2011 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Operating Temperature |
-55°C~175°C TJ |
Element Configuration |
Single |
Fall Time (Typ) |
14.8 ns |
Continuous Drain Current (ID) |
24A |
Case Connection |
DRAIN |
Turn On Delay Time |
13.4 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
78m Ω @ 15A, 10V |
Vgs(th) (Max) @ Id |
5V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds |
1710pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
38nC @ 10V |
Rise Time |
22.4ns |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
144W |
Threshold Voltage |
3V |
JEDEC-95 Code |
TO-252AA |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.078Ohm |
Drain to Source Breakdown Voltage |
200V |
Height |
2.39mm |
Length |
6.73mm |
Width |
6.22mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRFR5305TR
In stock
Manufacturer |
Infineon Technologies |
---|---|
JESD-609 Code |
e3 |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Current - Continuous Drain (Id) @ 25℃ |
31A Tc |
Number of Elements |
1 |
Turn Off Delay Time |
39 ns |
Packaging |
Tape & Reel (TR) |
Published |
2010 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Series |
HEXFET® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Max Operating Temperature |
175°C |
Min Operating Temperature |
-55°C |
Max Power Dissipation |
110W |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Contact Plating |
Tin |
Factory Lead Time |
16 Weeks |
Gate Charge (Qg) (Max) @ Vgs |
63nC @ 10V |
Element Configuration |
Single |
Power Dissipation |
110W |
Case Connection |
DRAIN |
Turn On Delay Time |
14 ns |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
65m Ω @ 16A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1200pF @ 25V |
Rise Time |
66ns |
Fall Time (Typ) |
63 ns |
JESD-30 Code |
R-PSSO-G2 |
Continuous Drain Current (ID) |
31A |
JEDEC-95 Code |
TO-252AA |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.065Ohm |
Drain to Source Breakdown Voltage |
55V |
Avalanche Energy Rating (Eas) |
280 mJ |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Operating Mode |
ENHANCEMENT MODE |
Lead Free |
Lead Free |
Infineon Technologies AUIRFR8401
In stock
Manufacturer |
Infineon Technologies |
---|---|
Turn On Delay Time |
7.9 ns |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Supplier Device Package |
D-Pak |
Current - Continuous Drain (Id) @ 25℃ |
100A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
79W Tc |
Turn Off Delay Time |
25 ns |
Packaging |
Tube |
Published |
2009 |
Operating Temperature |
-55°C~175°C TJ |
Series |
HEXFET® |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Max Operating Temperature |
175°C |
Min Operating Temperature |
-55°C |
Base Part Number |
IRFR8401 |
Number of Channels |
1 |
Element Configuration |
Single |
Power Dissipation |
79W |
Contact Plating |
Tin |
Factory Lead Time |
13 Weeks |
Drain to Source Breakdown Voltage |
40V |
Input Capacitance |
2.2nF |
Input Capacitance (Ciss) (Max) @ Vds |
2200pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
63nC @ 10V |
Rise Time |
34ns |
Drain to Source Voltage (Vdss) |
40V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
24 ns |
Continuous Drain Current (ID) |
100A |
Threshold Voltage |
3.9V |
Gate to Source Voltage (Vgs) |
20V |
Rds On (Max) @ Id, Vgs |
4.25mOhm @ 60A, 10V |
FET Type |
N-Channel |
Drain to Source Resistance |
4.25mOhm |
Rds On Max |
4.25 mΩ |
Nominal Vgs |
2.2 V |
Height |
2.39mm |
Length |
6.73mm |
Width |
6.22mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Vgs(th) (Max) @ Id |
3.9V @ 50μA |
Lead Free |
Lead Free |
Infineon Technologies AUIRFR8401TRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Factory Lead Time |
26 Weeks |
Mounting Type |
Surface Mount |
Surface Mount |
YES |
Current - Continuous Drain (Id) @ 25℃ |
100A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
79W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2010 |
Series |
Automotive, AEC-Q101, HEXFET® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
IRFR8401 |
Configuration |
Single |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
4.25m Ω @ 60A, 10V |
Vgs(th) (Max) @ Id |
3.9V @ 50μA |
Input Capacitance (Ciss) (Max) @ Vds |
2200pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
63nC @ 10V |
Drain to Source Voltage (Vdss) |
40V |
Vgs (Max) |
±20V |
Drain Current-Max (Abs) (ID) |
100A |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRFR8403TRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Factory Lead Time |
16 Weeks |
Mounting Type |
Surface Mount |
Surface Mount |
YES |
Current - Continuous Drain (Id) @ 25℃ |
100A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
99W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2010 |
Series |
HEXFET® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
IRFR8403 |
Configuration |
Single |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
3.1m Ω @ 76A, 10V |
Vgs(th) (Max) @ Id |
3.9V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds |
3171pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
99nC @ 10V |
Drain to Source Voltage (Vdss) |
40V |
Vgs (Max) |
±20V |
Drain Current-Max (Abs) (ID) |
100A |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRFS3004-7P
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Mounting Type |
Surface Mount |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
240A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
380W Tc |
Terminal Form |
GULL WING |
Factory Lead Time |
16 Weeks |
Published |
2015 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
6 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Operating Temperature |
-55°C~175°C TJ |
Peak Reflow Temperature (Cel) |
260 |
Input Capacitance (Ciss) (Max) @ Vds |
9130pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
240nC @ 10V |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
1.25m Ω @ 195A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G6 |
Drain to Source Voltage (Vdss) |
40V |
Vgs (Max) |
±20V |
JEDEC-95 Code |
TO-263CB |
Drain Current-Max (Abs) (ID) |
240A |
Drain-source On Resistance-Max |
0.00125Ohm |
Pulsed Drain Current-Max (IDM) |
1610A |
DS Breakdown Voltage-Min |
40V |
Avalanche Energy Rating (Eas) |
290 mJ |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRFS3006-7P
In stock
Manufacturer |
Infineon Technologies |
---|---|
JESD-30 Code |
R-PSSO-G6 |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
7 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
240A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
375W Tc |
Turn Off Delay Time |
118 ns |
Packaging |
Tube |
Published |
2010 |
Operating Temperature |
-55°C~175°C TJ |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
6 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Contact Plating |
Tin |
Factory Lead Time |
16 Weeks |
Fall Time (Typ) |
69 ns |
Continuous Drain Current (ID) |
240A |
Case Connection |
DRAIN |
Turn On Delay Time |
14 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
2.1m Ω @ 168A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
8850pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
300nC @ 10V |
Rise Time |
61ns |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Threshold Voltage |
2V |
JEDEC-95 Code |
TO-263CB |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
60V |
Avalanche Energy Rating (Eas) |
303 mJ |
Height |
4.83mm |
Length |
10.67mm |
Width |
9.65mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
Power Dissipation |
375W |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRFS3107-7P
In stock
Manufacturer |
Infineon Technologies |
---|---|
Element Configuration |
Single |
Mounting Type |
Surface Mount |
Number of Pins |
7 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
240A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
370W Tc |
Turn Off Delay Time |
100 ns |
Packaging |
Tube |
Published |
2010 |
Operating Temperature |
-55°C~175°C TJ |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
6 |
ECCN Code |
EAR99 |
Additional Feature |
ULTRA LOW RESISTANCE |
Terminal Form |
GULL WING |
JESD-30 Code |
R-PSSO-G6 |
Mount |
Surface Mount |
Contact Plating |
Tin |
Fall Time (Typ) |
64 ns |
Continuous Drain Current (ID) |
240A |
Turn On Delay Time |
17 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
2.6m Ω @ 160A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
9200pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
240nC @ 10V |
Rise Time |
80ns |
Vgs (Max) |
±20V |
Power Dissipation |
370W |
Operating Mode |
ENHANCEMENT MODE |
JEDEC-95 Code |
TO-263CB |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0026Ohm |
Drain to Source Breakdown Voltage |
75V |
Avalanche Energy Rating (Eas) |
320 mJ |
Height |
4.83mm |
Length |
10.67mm |
Width |
9.65mm |
Radiation Hardening |
No |
Case Connection |
DRAIN |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRFS3806
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
43A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
71W Tc |
Turn Off Delay Time |
49 ns |
Time@Peak Reflow Temperature-Max (s) |
30 |
Contact Plating |
Tin |
Published |
2011 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Operating Temperature |
-55°C~175°C TJ |
JESD-30 Code |
R-PSSO-G2 |
Rise Time |
40ns |
Vgs (Max) |
±20V |
Power Dissipation |
71W |
Case Connection |
DRAIN |
Turn On Delay Time |
6.3 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
15.8m Ω @ 25A, 10V |
Vgs(th) (Max) @ Id |
4V @ 50μA |
Input Capacitance (Ciss) (Max) @ Vds |
1150pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
30nC @ 10V |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Fall Time (Typ) |
47 ns |
Continuous Drain Current (ID) |
43A |
Threshold Voltage |
2V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
60V |
Height |
4.83mm |
Length |
10.67mm |
Width |
9.65mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRFS4010-7P
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
7 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
190A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
380W Tc |
Turn Off Delay Time |
100 ns |
Time@Peak Reflow Temperature-Max (s) |
30 |
Operating Temperature |
-55°C~175°C TJ |
Published |
2010 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
6 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Contact Plating |
Tin |
Factory Lead Time |
10 Weeks |
Rise Time |
56ns |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Power Dissipation |
380W |
Case Connection |
DRAIN |
Turn On Delay Time |
19 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
4m Ω @ 110A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
9830pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
230nC @ 10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
48 ns |
JESD-30 Code |
R-PSSO-G6 |
Continuous Drain Current (ID) |
190A |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.004Ohm |
Drain to Source Breakdown Voltage |
100V |
Avalanche Energy Rating (Eas) |
330 mJ |
Height |
4.83mm |
Length |
10.67mm |
Width |
9.65mm |
Radiation Hardening |
No |
Operating Mode |
ENHANCEMENT MODE |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRFS4127TRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Operating Temperature |
-55°C~175°C TJ |
Mounting Type |
Surface Mount |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
72A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Terminal Position |
SINGLE |
Factory Lead Time |
16 Weeks |
Packaging |
Tape & Reel (TR) |
Published |
2015 |
Series |
Automotive, AEC-Q101, HEXFET® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Power Dissipation (Max) |
375W Tc |
Terminal Form |
GULL WING |
Input Capacitance (Ciss) (Max) @ Vds |
5380pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
150nC @ 10V |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
22m Ω @ 44A, 10V |
Vgs(th) (Max) @ Id |
5V @ 250μA |
JESD-30 Code |
R-PSSO-G2 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Drain to Source Voltage (Vdss) |
200V |
Vgs (Max) |
±20V |
Drain Current-Max (Abs) (ID) |
72A |
Drain-source On Resistance-Max |
0.022Ohm |
Pulsed Drain Current-Max (IDM) |
300A |
DS Breakdown Voltage-Min |
200V |
Avalanche Energy Rating (Eas) |
250 mJ |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies AUIRFS4310
In stock
Manufacturer |
Infineon Technologies |
---|---|
Published |
2010 |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
75A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
300W Tc |
Turn Off Delay Time |
68 ns |
Operating Temperature |
-55°C~175°C TJ |
Operating Mode |
ENHANCEMENT MODE |
Contact Plating |
Tin |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Element Configuration |
Single |
Packaging |
Tube |
Power Dissipation |
300W |
Threshold Voltage |
2V |
Gate to Source Voltage (Vgs) |
20V |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
7m Ω @ 75A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
7670pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
250nC @ 10V |
Rise Time |
110ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
78 ns |
Continuous Drain Current (ID) |
130A |
Case Connection |
DRAIN |
Turn On Delay Time |
26 ns |
Drain Current-Max (Abs) (ID) |
75A |
Drain-source On Resistance-Max |
0.007Ohm |
Drain to Source Breakdown Voltage |
100V |
Pulsed Drain Current-Max (IDM) |
550A |
Avalanche Energy Rating (Eas) |
980 mJ |
Nominal Vgs |
2 V |
Height |
4.83mm |
Length |
10.67mm |
Width |
9.65mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |