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Discrete Semiconductors
Infineon Technologies BSP123E6327T
In stock
Manufacturer |
Infineon Technologies |
---|---|
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Mounting Type |
Surface Mount |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
4 |
Supplier Device Package |
PG-SOT223-4 |
Current - Continuous Drain (Id) @ 25℃ |
370mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
2.8V 10V |
Power Dissipation (Max) |
1.79W Ta |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2003 |
Series |
SIPMOS® |
Part Status |
Obsolete |
Mount |
Surface Mount |
Current Rating |
380mA |
Voltage - Rated DC |
100V |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
6Ohm @ 370mA, 10V |
Vgs(th) (Max) @ Id |
1.8V @ 50μA |
Input Capacitance (Ciss) (Max) @ Vds |
70pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
2.4nC @ 10V |
Rise Time |
5ns |
Drain to Source Voltage (Vdss) |
100V |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
370mA |
Input Capacitance |
70pF |
Rds On Max |
6 Ω |
RoHS Status |
Non-RoHS Compliant |
Lead Free |
Lead Free |
Infineon Technologies BSP129L6327HTSA1
In stock
Manufacturer |
Infineon Technologies |
---|---|
Terminal Position |
DUAL |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
4 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
350mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
0V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.8W Ta |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Turn Off Delay Time |
22 ns |
Published |
2012 |
Series |
SIPMOS® |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Finish |
MATTE TIN |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Rise Time |
4.1ns |
Drain to Source Voltage (Vdss) |
240V |
Power Dissipation |
1.8W |
Case Connection |
DRAIN |
Turn On Delay Time |
4.4 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
6 Ω @ 350mA, 10V |
Vgs(th) (Max) @ Id |
1V @ 108μA |
Input Capacitance (Ciss) (Max) @ Vds |
108pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
5.7nC @ 5V |
Pin Count |
4 |
Terminal Form |
GULL WING |
Vgs (Max) |
±20V |
Fall Time (Typ) |
35 ns |
Continuous Drain Current (ID) |
350mA |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
0.35A |
Drain-source On Resistance-Max |
6Ohm |
FET Feature |
Depletion Mode |
Radiation Hardening |
No |
Configuration |
SINGLE WITH BUILT-IN DIODE |
RoHS Status |
RoHS Compliant |
Infineon Technologies BSP135 E6327
In stock
Manufacturer |
Infineon Technologies |
---|---|
Published |
2007 |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
120mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
0V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.8W Ta |
Operating Temperature |
-55°C~150°C TJ |
Terminal Position |
DUAL |
Packaging |
Tape & Reel (TR) |
Series |
SIPMOS® |
JESD-609 Code |
e0 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8541.29.00.95 |
Package / Case |
TO-261-4, TO-261AA |
Mounting Type |
Surface Mount |
Vgs(th) (Max) @ Id |
1V @ 94μA |
Peak Reflow Temperature (Cel) |
260 |
Pin Count |
4 |
JESD-30 Code |
R-PDSO-G4 |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
45 Ω @ 120mA, 10V |
Input Capacitance (Ciss) (Max) @ Vds |
146pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
4.9nC @ 5V |
Terminal Form |
GULL WING |
Drain to Source Voltage (Vdss) |
600V |
Vgs (Max) |
±20V |
Drain Current-Max (Abs) (ID) |
0.1A |
Drain-source On Resistance-Max |
60Ohm |
Pulsed Drain Current-Max (IDM) |
0.3A |
DS Breakdown Voltage-Min |
600V |
FET Feature |
Depletion Mode |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
RoHS Status |
Non-RoHS Compliant |
Infineon Technologies BSP135 E6906
In stock
Manufacturer |
Infineon Technologies |
---|---|
HTS Code |
8541.29.00.95 |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
120mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
0V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.8W Ta |
Packaging |
Tape & Reel (TR) |
Published |
2007 |
Operating Temperature |
-55°C~150°C TJ |
Series |
SIPMOS® |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Finish |
MATTE TIN |
Package / Case |
TO-261-4, TO-261AA |
Mounting Type |
Surface Mount |
Input Capacitance (Ciss) (Max) @ Vds |
146pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
4.9nC @ 5V |
JESD-30 Code |
R-PDSO-G4 |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
45 Ω @ 120mA, 10V |
Vgs(th) (Max) @ Id |
1V @ 94μA |
Terminal Form |
GULL WING |
Terminal Position |
DUAL |
Drain to Source Voltage (Vdss) |
600V |
Vgs (Max) |
±20V |
Drain Current-Max (Abs) (ID) |
0.1A |
Drain-source On Resistance-Max |
60Ohm |
Pulsed Drain Current-Max (IDM) |
0.3A |
DS Breakdown Voltage-Min |
600V |
FET Feature |
Depletion Mode |
Pin Count |
4 |
RoHS Status |
Non-RoHS Compliant |
Infineon Technologies BSP135H6327XTSA1
In stock
Manufacturer |
Infineon Technologies |
---|---|
Part Status |
Active |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
4 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Cut Tape (CT) |
Published |
2012 |
Series |
SIPMOS® |
JESD-609 Code |
e3 |
Element Configuration |
Single |
Factory Lead Time |
10 Weeks |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
4 |
Number of Elements |
1 |
Voltage |
600V |
Power Dissipation-Max |
1.8W Ta |
Pbfree Code |
yes |
Current |
12A |
Fall Time (Typ) |
182 ns |
Turn-Off Delay Time |
28 ns |
Turn On Delay Time |
5.4 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
45 Ω @ 120mA, 10V |
Vgs(th) (Max) @ Id |
1V @ 94μA |
Halogen Free |
Halogen Free |
Input Capacitance (Ciss) (Max) @ Vds |
146pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
120mA Ta |
Gate Charge (Qg) (Max) @ Vgs |
4.9nC @ 5V |
Rise Time |
5.6ns |
Drive Voltage (Max Rds On,Min Rds On) |
0V 10V |
Vgs (Max) |
±20V |
Power Dissipation |
1.8W |
Case Connection |
DRAIN |
Continuous Drain Current (ID) |
120mA |
Gate to Source Voltage (Vgs) |
20V |
Max Dual Supply Voltage |
600V |
Drain to Source Breakdown Voltage |
600V |
Recovery Time |
130 ns |
FET Feature |
Depletion Mode |
Height |
1.5mm |
Length |
6.5mm |
Width |
3.5mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Infineon Technologies BSP135L6906HTSA1
In stock
Manufacturer |
Infineon Technologies |
---|---|
Turn Off Delay Time |
28 ns |
Mounting Type |
Surface Mount |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
4 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
120mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
0V 10V |
Number of Elements |
1 |
Terminal Position |
DUAL |
Mount |
Surface Mount |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2012 |
Series |
SIPMOS® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
Power Dissipation (Max) |
1.8W Ta |
Terminal Form |
GULL WING |
Drain to Source Voltage (Vdss) |
600V |
Vgs (Max) |
±20V |
Turn On Delay Time |
5.4 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
45 Ω @ 120mA, 10V |
Vgs(th) (Max) @ Id |
1V @ 94μA |
Input Capacitance (Ciss) (Max) @ Vds |
146pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
4.9nC @ 5V |
Rise Time |
5.6ns |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Case Connection |
DRAIN |
Fall Time (Typ) |
182 ns |
Continuous Drain Current (ID) |
120mA |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
0.12A |
DS Breakdown Voltage-Min |
600V |
FET Feature |
Depletion Mode |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Infineon Technologies BSP149L6906HTSA1
In stock
Manufacturer |
Infineon Technologies |
---|---|
Terminal Position |
DUAL |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
4 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
660mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
0V 10V |
Power Dissipation (Max) |
1.8W Ta |
Operating Temperature |
-55°C~150°C TJ |
Number of Elements |
1 |
Packaging |
Tape & Reel (TR) |
Published |
2005 |
Series |
SIPMOS® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Drain to Source Voltage (Vdss) |
200V |
Vgs (Max) |
±20V |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
1.8 Ω @ 660mA, 10V |
Vgs(th) (Max) @ Id |
1V @ 400μA |
Input Capacitance (Ciss) (Max) @ Vds |
430pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
14nC @ 5V |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Terminal Form |
GULL WING |
Continuous Drain Current (ID) |
660mA |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
0.66A |
Pulsed Drain Current-Max (IDM) |
2.6A |
DS Breakdown Voltage-Min |
200V |
FET Feature |
Depletion Mode |
Power Dissipation |
1.8W |
RoHS Status |
RoHS Compliant |
Infineon Technologies BSP171PL6327HTSA1
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tape & Reel (TR) |
Mounting Type |
Surface Mount |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
4 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.9A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.8W Ta |
Turn Off Delay Time |
208 ns |
Terminal Position |
DUAL |
Mount |
Surface Mount |
Published |
2005 |
Series |
SIPMOS® |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Operating Temperature |
-55°C~150°C TJ |
Terminal Form |
GULL WING |
Gate Charge (Qg) (Max) @ Vgs |
20nC @ 10V |
Rise Time |
25ns |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
1.8W |
Case Connection |
DRAIN |
Turn On Delay Time |
6 ns |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
300m Ω @ 1.9A, 10V |
Vgs(th) (Max) @ Id |
2V @ 460μA |
Input Capacitance (Ciss) (Max) @ Vds |
460pF @ 25V |
Pin Count |
4 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Drain to Source Voltage (Vdss) |
60V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
87 ns |
Continuous Drain Current (ID) |
1.9A |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.3Ohm |
DS Breakdown Voltage-Min |
60V |
Feedback Cap-Max (Crss) |
55 pF |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Infineon Technologies BSP295L6327HTSA1
In stock
Manufacturer |
Infineon Technologies |
---|---|
Terminal Form |
GULL WING |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
4 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.8A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.8W Ta |
Turn Off Delay Time |
27 ns |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
Operating Temperature |
-55°C~150°C TJ |
Series |
SIPMOS® |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Finish |
MATTE TIN |
Terminal Position |
DUAL |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Gate Charge (Qg) (Max) @ Vgs |
17nC @ 10V |
Rise Time |
9.9ns |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
1.8W |
Case Connection |
DRAIN |
Turn On Delay Time |
5.4 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
300m Ω @ 1.8A, 10V |
Vgs(th) (Max) @ Id |
1.8V @ 400μA |
Input Capacitance (Ciss) (Max) @ Vds |
368pF @ 25V |
Time@Peak Reflow Temperature-Max (s) |
40 |
Peak Reflow Temperature (Cel) |
260 |
Drain to Source Voltage (Vdss) |
60V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
19 ns |
Continuous Drain Current (ID) |
1.8A |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.5Ohm |
Pulsed Drain Current-Max (IDM) |
7.2A |
DS Breakdown Voltage-Min |
60V |
Radiation Hardening |
No |
Pin Count |
4 |
RoHS Status |
RoHS Compliant |
Infineon Technologies BSP298H6327XUSA1
In stock
Manufacturer |
Infineon Technologies |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
3 |
Supplier Device Package |
PG-SOT223-4 |
Current - Continuous Drain (Id) @ 25℃ |
500mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.8W Ta |
Turn On Delay Time |
10 ns |
Turn Off Delay Time |
30 ns |
Packaging |
Cut Tape (CT) |
Published |
2008 |
Series |
SIPMOS® |
Part Status |
Last Time Buy |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Termination |
SMD/SMT |
Max Operating Temperature |
150°C |
Min Operating Temperature |
-55°C |
Element Configuration |
Single |
Power Dissipation |
1.8W |
Contact Plating |
Tin |
Factory Lead Time |
10 Weeks |
Max Dual Supply Voltage |
400V |
Rds On (Max) @ Id, Vgs |
3Ohm @ 500mA, 10V |
Halogen Free |
Halogen Free |
Input Capacitance (Ciss) (Max) @ Vds |
400pF @ 25V |
Rise Time |
25ns |
Drain to Source Voltage (Vdss) |
400V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
20 ns |
Continuous Drain Current (ID) |
500mA |
Threshold Voltage |
3V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
400V |
Dual Supply Voltage |
400V |
FET Type |
N-Channel |
Input Capacitance |
400pF |
Drain to Source Resistance |
2.2Ohm |
Rds On Max |
3 Ω |
Nominal Vgs |
3 V |
Height |
1.6mm |
Length |
6.5mm |
Width |
6.7mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Vgs(th) (Max) @ Id |
4V @ 1mA |
Lead Free |
Lead Free |
Infineon Technologies BSP298L6327HUSA1
In stock
Manufacturer |
Infineon Technologies |
---|---|
Power Dissipation (Max) |
1.8W Ta |
Mounting Type |
Surface Mount |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
4 |
Supplier Device Package |
PG-SOT223-4 |
Current - Continuous Drain (Id) @ 25℃ |
500mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Mount |
Surface Mount |
Turn Off Delay Time |
30 ns |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2008 |
Series |
SIPMOS® |
Part Status |
Obsolete |
Number of Elements |
1 |
Max Operating Temperature |
150°C |
Drain to Source Voltage (Vdss) |
400V |
Vgs (Max) |
±20V |
Turn On Delay Time |
10 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
3Ohm @ 500mA, 10V |
Vgs(th) (Max) @ Id |
4V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds |
400pF @ 25V |
Rise Time |
25ns |
Min Operating Temperature |
-55°C |
Power Dissipation |
1.8W |
Fall Time (Typ) |
20 ns |
Continuous Drain Current (ID) |
500mA |
Gate to Source Voltage (Vgs) |
20V |
Input Capacitance |
400pF |
Rds On Max |
3 Ω |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Infineon Technologies BSP300H6327XUSA1
In stock
Manufacturer |
Infineon Technologies |
---|---|
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Mounting Type |
Surface Mount |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
4 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Cut Tape (CT) |
Published |
2008 |
Series |
SIPMOS® |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Power Dissipation-Max |
1.8W Ta |
Part Status |
Last Time Buy |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin (Sn) |
Additional Feature |
AVALANCHE RATED |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
4 |
Number of Elements |
1 |
Voltage |
800V |
Mount |
Surface Mount |
Factory Lead Time |
10 Weeks |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Current |
2A |
Power Dissipation |
1.8W |
Case Connection |
DRAIN |
Turn On Delay Time |
7 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
20 Ω @ 190mA, 10V |
Vgs(th) (Max) @ Id |
4V @ 1mA |
Halogen Free |
Halogen Free |
Input Capacitance (Ciss) (Max) @ Vds |
230pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
190mA Ta |
Rise Time |
16ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
21 ns |
Element Configuration |
Single |
Turn-Off Delay Time |
27 ns |
Continuous Drain Current (ID) |
190mA |
Gate to Source Voltage (Vgs) |
20V |
Max Dual Supply Voltage |
800V |
Drain to Source Breakdown Voltage |
800V |
Avalanche Energy Rating (Eas) |
36 mJ |
Height |
1.6mm |
Length |
6.5mm |
Width |
3.5mm |
RoHS Status |
ROHS3 Compliant |
Operating Mode |
ENHANCEMENT MODE |
Lead Free |
Lead Free |