Showing 2329–2340 of 15245 results

Discrete Semiconductors

Infineon Technologies BSP123E6327T

In stock

SKU: BSP123E6327T-11
Manufacturer

Infineon Technologies

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Supplier Device Package

PG-SOT223-4

Current - Continuous Drain (Id) @ 25℃

370mA Ta

Drive Voltage (Max Rds On, Min Rds On)

2.8V 10V

Power Dissipation (Max)

1.79W Ta

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2003

Series

SIPMOS®

Part Status

Obsolete

Mount

Surface Mount

Current Rating

380mA

Voltage - Rated DC

100V

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

6Ohm @ 370mA, 10V

Vgs(th) (Max) @ Id

1.8V @ 50μA

Input Capacitance (Ciss) (Max) @ Vds

70pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

2.4nC @ 10V

Rise Time

5ns

Drain to Source Voltage (Vdss)

100V

Vgs (Max)

±20V

Continuous Drain Current (ID)

370mA

Input Capacitance

70pF

Rds On Max

6 Ω

RoHS Status

Non-RoHS Compliant

Lead Free

Lead Free

Infineon Technologies BSP129L6327HTSA1

In stock

SKU: BSP129L6327HTSA1-11
Manufacturer

Infineon Technologies

Terminal Position

DUAL

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

350mA Ta

Drive Voltage (Max Rds On, Min Rds On)

0V 10V

Number of Elements

1

Power Dissipation (Max)

1.8W Ta

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Turn Off Delay Time

22 ns

Published

2012

Series

SIPMOS®

JESD-609 Code

e3

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Terminal Finish

MATTE TIN

Mounting Type

Surface Mount

Mount

Surface Mount

Rise Time

4.1ns

Drain to Source Voltage (Vdss)

240V

Power Dissipation

1.8W

Case Connection

DRAIN

Turn On Delay Time

4.4 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

6 Ω @ 350mA, 10V

Vgs(th) (Max) @ Id

1V @ 108μA

Input Capacitance (Ciss) (Max) @ Vds

108pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

5.7nC @ 5V

Pin Count

4

Terminal Form

GULL WING

Vgs (Max)

±20V

Fall Time (Typ)

35 ns

Continuous Drain Current (ID)

350mA

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

0.35A

Drain-source On Resistance-Max

6Ohm

FET Feature

Depletion Mode

Radiation Hardening

No

Configuration

SINGLE WITH BUILT-IN DIODE

RoHS Status

RoHS Compliant

Infineon Technologies BSP135 E6327

In stock

SKU: BSP135 E6327-11
Manufacturer

Infineon Technologies

Published

2007

Surface Mount

YES

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

120mA Ta

Drive Voltage (Max Rds On, Min Rds On)

0V 10V

Number of Elements

1

Power Dissipation (Max)

1.8W Ta

Operating Temperature

-55°C~150°C TJ

Terminal Position

DUAL

Packaging

Tape & Reel (TR)

Series

SIPMOS®

JESD-609 Code

e0

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Terminal Finish

Tin/Lead (Sn/Pb)

HTS Code

8541.29.00.95

Package / Case

TO-261-4, TO-261AA

Mounting Type

Surface Mount

Vgs(th) (Max) @ Id

1V @ 94μA

Peak Reflow Temperature (Cel)

260

Pin Count

4

JESD-30 Code

R-PDSO-G4

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Case Connection

DRAIN

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

45 Ω @ 120mA, 10V

Input Capacitance (Ciss) (Max) @ Vds

146pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

4.9nC @ 5V

Terminal Form

GULL WING

Drain to Source Voltage (Vdss)

600V

Vgs (Max)

±20V

Drain Current-Max (Abs) (ID)

0.1A

Drain-source On Resistance-Max

60Ohm

Pulsed Drain Current-Max (IDM)

0.3A

DS Breakdown Voltage-Min

600V

FET Feature

Depletion Mode

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

RoHS Status

Non-RoHS Compliant

Infineon Technologies BSP135 E6906

In stock

SKU: BSP135 E6906-11
Manufacturer

Infineon Technologies

HTS Code

8541.29.00.95

Surface Mount

YES

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

120mA Ta

Drive Voltage (Max Rds On, Min Rds On)

0V 10V

Number of Elements

1

Power Dissipation (Max)

1.8W Ta

Packaging

Tape & Reel (TR)

Published

2007

Operating Temperature

-55°C~150°C TJ

Series

SIPMOS®

JESD-609 Code

e3

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Terminal Finish

MATTE TIN

Package / Case

TO-261-4, TO-261AA

Mounting Type

Surface Mount

Input Capacitance (Ciss) (Max) @ Vds

146pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

4.9nC @ 5V

JESD-30 Code

R-PDSO-G4

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Case Connection

DRAIN

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

45 Ω @ 120mA, 10V

Vgs(th) (Max) @ Id

1V @ 94μA

Terminal Form

GULL WING

Terminal Position

DUAL

Drain to Source Voltage (Vdss)

600V

Vgs (Max)

±20V

Drain Current-Max (Abs) (ID)

0.1A

Drain-source On Resistance-Max

60Ohm

Pulsed Drain Current-Max (IDM)

0.3A

DS Breakdown Voltage-Min

600V

FET Feature

Depletion Mode

Pin Count

4

RoHS Status

Non-RoHS Compliant

Infineon Technologies BSP135H6327XTSA1

In stock

SKU: BSP135H6327XTSA1-11
Manufacturer

Infineon Technologies

Part Status

Active

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Cut Tape (CT)

Published

2012

Series

SIPMOS®

JESD-609 Code

e3

Element Configuration

Single

Factory Lead Time

10 Weeks

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

4

Number of Elements

1

Voltage

600V

Power Dissipation-Max

1.8W Ta

Pbfree Code

yes

Current

12A

Fall Time (Typ)

182 ns

Turn-Off Delay Time

28 ns

Turn On Delay Time

5.4 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

45 Ω @ 120mA, 10V

Vgs(th) (Max) @ Id

1V @ 94μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

146pF @ 25V

Current - Continuous Drain (Id) @ 25°C

120mA Ta

Gate Charge (Qg) (Max) @ Vgs

4.9nC @ 5V

Rise Time

5.6ns

Drive Voltage (Max Rds On,Min Rds On)

0V 10V

Vgs (Max)

±20V

Power Dissipation

1.8W

Case Connection

DRAIN

Continuous Drain Current (ID)

120mA

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

600V

Drain to Source Breakdown Voltage

600V

Recovery Time

130 ns

FET Feature

Depletion Mode

Height

1.5mm

Length

6.5mm

Width

3.5mm

Radiation Hardening

No

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies BSP135L6906HTSA1

In stock

SKU: BSP135L6906HTSA1-11
Manufacturer

Infineon Technologies

Turn Off Delay Time

28 ns

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

120mA Ta

Drive Voltage (Max Rds On, Min Rds On)

0V 10V

Number of Elements

1

Terminal Position

DUAL

Mount

Surface Mount

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2012

Series

SIPMOS®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

Power Dissipation (Max)

1.8W Ta

Terminal Form

GULL WING

Drain to Source Voltage (Vdss)

600V

Vgs (Max)

±20V

Turn On Delay Time

5.4 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

45 Ω @ 120mA, 10V

Vgs(th) (Max) @ Id

1V @ 94μA

Input Capacitance (Ciss) (Max) @ Vds

146pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

4.9nC @ 5V

Rise Time

5.6ns

Configuration

SINGLE WITH BUILT-IN DIODE

Case Connection

DRAIN

Fall Time (Typ)

182 ns

Continuous Drain Current (ID)

120mA

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

0.12A

DS Breakdown Voltage-Min

600V

FET Feature

Depletion Mode

Radiation Hardening

No

RoHS Status

RoHS Compliant

Infineon Technologies BSP149L6906HTSA1

In stock

SKU: BSP149L6906HTSA1-11
Manufacturer

Infineon Technologies

Terminal Position

DUAL

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

660mA Ta

Drive Voltage (Max Rds On, Min Rds On)

0V 10V

Power Dissipation (Max)

1.8W Ta

Operating Temperature

-55°C~150°C TJ

Number of Elements

1

Packaging

Tape & Reel (TR)

Published

2005

Series

SIPMOS®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

Mounting Type

Surface Mount

Mount

Surface Mount

Drain to Source Voltage (Vdss)

200V

Vgs (Max)

±20V

Case Connection

DRAIN

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

1.8 Ω @ 660mA, 10V

Vgs(th) (Max) @ Id

1V @ 400μA

Input Capacitance (Ciss) (Max) @ Vds

430pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

14nC @ 5V

Configuration

SINGLE WITH BUILT-IN DIODE

Terminal Form

GULL WING

Continuous Drain Current (ID)

660mA

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

0.66A

Pulsed Drain Current-Max (IDM)

2.6A

DS Breakdown Voltage-Min

200V

FET Feature

Depletion Mode

Power Dissipation

1.8W

RoHS Status

RoHS Compliant

Infineon Technologies BSP171PL6327HTSA1

In stock

SKU: BSP171PL6327HTSA1-11
Manufacturer

Infineon Technologies

Packaging

Tape & Reel (TR)

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

1.9A Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

Power Dissipation (Max)

1.8W Ta

Turn Off Delay Time

208 ns

Terminal Position

DUAL

Mount

Surface Mount

Published

2005

Series

SIPMOS®

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn)

Operating Temperature

-55°C~150°C TJ

Terminal Form

GULL WING

Gate Charge (Qg) (Max) @ Vgs

20nC @ 10V

Rise Time

25ns

Operating Mode

ENHANCEMENT MODE

Power Dissipation

1.8W

Case Connection

DRAIN

Turn On Delay Time

6 ns

FET Type

P-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

300m Ω @ 1.9A, 10V

Vgs(th) (Max) @ Id

2V @ 460μA

Input Capacitance (Ciss) (Max) @ Vds

460pF @ 25V

Pin Count

4

Configuration

SINGLE WITH BUILT-IN DIODE

Drain to Source Voltage (Vdss)

60V

Vgs (Max)

±20V

Fall Time (Typ)

87 ns

Continuous Drain Current (ID)

1.9A

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.3Ohm

DS Breakdown Voltage-Min

60V

Feedback Cap-Max (Crss)

55 pF

Radiation Hardening

No

RoHS Status

RoHS Compliant

Infineon Technologies BSP295L6327HTSA1

In stock

SKU: BSP295L6327HTSA1-11
Manufacturer

Infineon Technologies

Terminal Form

GULL WING

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

1.8A Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

Power Dissipation (Max)

1.8W Ta

Turn Off Delay Time

27 ns

Packaging

Tape & Reel (TR)

Published

2002

Operating Temperature

-55°C~150°C TJ

Series

SIPMOS®

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Terminal Finish

MATTE TIN

Terminal Position

DUAL

Mounting Type

Surface Mount

Mount

Surface Mount

Gate Charge (Qg) (Max) @ Vgs

17nC @ 10V

Rise Time

9.9ns

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Power Dissipation

1.8W

Case Connection

DRAIN

Turn On Delay Time

5.4 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

300m Ω @ 1.8A, 10V

Vgs(th) (Max) @ Id

1.8V @ 400μA

Input Capacitance (Ciss) (Max) @ Vds

368pF @ 25V

Time@Peak Reflow Temperature-Max (s)

40

Peak Reflow Temperature (Cel)

260

Drain to Source Voltage (Vdss)

60V

Vgs (Max)

±20V

Fall Time (Typ)

19 ns

Continuous Drain Current (ID)

1.8A

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.5Ohm

Pulsed Drain Current-Max (IDM)

7.2A

DS Breakdown Voltage-Min

60V

Radiation Hardening

No

Pin Count

4

RoHS Status

RoHS Compliant

Infineon Technologies BSP298H6327XUSA1

In stock

SKU: BSP298H6327XUSA1-11
Manufacturer

Infineon Technologies

Operating Temperature

-55°C~150°C TJ

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

3

Supplier Device Package

PG-SOT223-4

Current - Continuous Drain (Id) @ 25℃

500mA Ta

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

1.8W Ta

Turn On Delay Time

10 ns

Turn Off Delay Time

30 ns

Packaging

Cut Tape (CT)

Published

2008

Series

SIPMOS®

Part Status

Last Time Buy

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Termination

SMD/SMT

Max Operating Temperature

150°C

Min Operating Temperature

-55°C

Element Configuration

Single

Power Dissipation

1.8W

Contact Plating

Tin

Factory Lead Time

10 Weeks

Max Dual Supply Voltage

400V

Rds On (Max) @ Id, Vgs

3Ohm @ 500mA, 10V

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

400pF @ 25V

Rise Time

25ns

Drain to Source Voltage (Vdss)

400V

Vgs (Max)

±20V

Fall Time (Typ)

20 ns

Continuous Drain Current (ID)

500mA

Threshold Voltage

3V

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

400V

Dual Supply Voltage

400V

FET Type

N-Channel

Input Capacitance

400pF

Drain to Source Resistance

2.2Ohm

Rds On Max

3 Ω

Nominal Vgs

3 V

Height

1.6mm

Length

6.5mm

Width

6.7mm

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Vgs(th) (Max) @ Id

4V @ 1mA

Lead Free

Lead Free

Infineon Technologies BSP298L6327HUSA1

In stock

SKU: BSP298L6327HUSA1-11
Manufacturer

Infineon Technologies

Power Dissipation (Max)

1.8W Ta

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Supplier Device Package

PG-SOT223-4

Current - Continuous Drain (Id) @ 25℃

500mA Ta

Drive Voltage (Max Rds On, Min Rds On)

10V

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Mount

Surface Mount

Turn Off Delay Time

30 ns

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2008

Series

SIPMOS®

Part Status

Obsolete

Number of Elements

1

Max Operating Temperature

150°C

Drain to Source Voltage (Vdss)

400V

Vgs (Max)

±20V

Turn On Delay Time

10 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

3Ohm @ 500mA, 10V

Vgs(th) (Max) @ Id

4V @ 1mA

Input Capacitance (Ciss) (Max) @ Vds

400pF @ 25V

Rise Time

25ns

Min Operating Temperature

-55°C

Power Dissipation

1.8W

Fall Time (Typ)

20 ns

Continuous Drain Current (ID)

500mA

Gate to Source Voltage (Vgs)

20V

Input Capacitance

400pF

Rds On Max

3 Ω

Radiation Hardening

No

RoHS Status

RoHS Compliant

Infineon Technologies BSP300H6327XUSA1

In stock

SKU: BSP300H6327XUSA1-11
Manufacturer

Infineon Technologies

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Cut Tape (CT)

Published

2008

Series

SIPMOS®

JESD-609 Code

e3

Pbfree Code

yes

Power Dissipation-Max

1.8W Ta

Part Status

Last Time Buy

Number of Terminations

4

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Additional Feature

AVALANCHE RATED

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

4

Number of Elements

1

Voltage

800V

Mount

Surface Mount

Factory Lead Time

10 Weeks

Drive Voltage (Max Rds On,Min Rds On)

10V

Current

2A

Power Dissipation

1.8W

Case Connection

DRAIN

Turn On Delay Time

7 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

20 Ω @ 190mA, 10V

Vgs(th) (Max) @ Id

4V @ 1mA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

230pF @ 25V

Current - Continuous Drain (Id) @ 25°C

190mA Ta

Rise Time

16ns

Vgs (Max)

±20V

Fall Time (Typ)

21 ns

Element Configuration

Single

Turn-Off Delay Time

27 ns

Continuous Drain Current (ID)

190mA

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

800V

Drain to Source Breakdown Voltage

800V

Avalanche Energy Rating (Eas)

36 mJ

Height

1.6mm

Length

6.5mm

Width

3.5mm

RoHS Status

ROHS3 Compliant

Operating Mode

ENHANCEMENT MODE

Lead Free

Lead Free