Showing 2341–2352 of 15245 results

Discrete Semiconductors

Infineon Technologies BSP315PH6327XTSA1

In stock

SKU: BSP315PH6327XTSA1-11
Manufacturer

Infineon Technologies

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Manufacturer Package Identifier

PG-SOT223-4

Operating Temperature

-55°C~150°C TJ

Packaging

Cut Tape (CT)

Published

1999

Series

SIPMOS®

JESD-609 Code

e3

Pbfree Code

yes

Power Dissipation

1.8W

Factory Lead Time

10 Weeks

Number of Terminations

4

Termination

SMD/SMT

ECCN Code

EAR99

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

40

Pin Count

4

Number of Elements

1

Number of Channels

1

Power Dissipation-Max

1.8W Ta

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Part Status

Active

Case Connection

DRAIN

Threshold Voltage

-1.5V

Gate to Source Voltage (Vgs)

20V

Rds On (Max) @ Id, Vgs

800m Ω @ 1.17A, 10V

Vgs(th) (Max) @ Id

2V @ 160μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

160pF @ 25V

Current - Continuous Drain (Id) @ 25°C

1.17A Ta

Gate Charge (Qg) (Max) @ Vgs

7.8nC @ 10V

Rise Time

9ns

Drain to Source Voltage (Vdss)

60V

Drive Voltage (Max Rds On,Min Rds On)

4.5V 10V

Vgs (Max)

±20V

Fall Time (Typ)

19 ns

Turn-Off Delay Time

32 ns

Continuous Drain Current (ID)

1.17A

Turn On Delay Time

24 ns

FET Type

P-Channel

Max Dual Supply Voltage

-60V

Drain-source On Resistance-Max

0.8Ohm

Drain to Source Breakdown Voltage

-60V

Dual Supply Voltage

-60V

Recovery Time

46 ns

Max Junction Temperature (Tj)

150°C

Nominal Vgs

-1.5 V

Height

1.8mm

Length

6.5mm

Width

6.7mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies BSP316PH6327XTSA1

In stock

SKU: BSP316PH6327XTSA1-11
Manufacturer

Infineon Technologies

Part Status

Active

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Cut Tape (CT)

Published

2002

Series

SIPMOS®

JESD-609 Code

e3

Element Configuration

Single

Pbfree Code

yes

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

LOGIC LEVEL COMPATIBLE

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

40

Pin Count

4

Number of Elements

1

Power Dissipation-Max

1.8W Ta

Contact Plating

Tin

Factory Lead Time

10 Weeks

Drive Voltage (Max Rds On,Min Rds On)

4.5V 10V

Power Dissipation

1.8W

Turn On Delay Time

4.7 ns

FET Type

P-Channel

Rds On (Max) @ Id, Vgs

1.8 Ω @ 680mA, 10V

Vgs(th) (Max) @ Id

2V @ 170μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

146pF @ 25V

Current - Continuous Drain (Id) @ 25°C

680mA Ta

Gate Charge (Qg) (Max) @ Vgs

6.4nC @ 10V

Rise Time

7.5ns

Drain to Source Voltage (Vdss)

100V

Vgs (Max)

±20V

Fall Time (Typ)

25.9 ns

Operating Mode

ENHANCEMENT MODE

Turn-Off Delay Time

67.4 ns

Continuous Drain Current (ID)

680mA

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

-100V

Drain Current-Max (Abs) (ID)

0.68A

Pulsed Drain Current-Max (IDM)

2.72A

Height

1.6mm

Length

6.5mm

Width

3.5mm

RoHS Status

ROHS3 Compliant

Case Connection

DRAIN

Lead Free

Lead Free

Infineon Technologies BSP318SL6327HTSA1

In stock

SKU: BSP318SL6327HTSA1-11
Manufacturer

Infineon Technologies

Terminal Form

GULL WING

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

2.6A Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

Turn Off Delay Time

20 ns

Operating Temperature

-55°C~150°C TJ

Power Dissipation (Max)

1.8W Ta

Packaging

Tape & Reel (TR)

Published

1999

Series

SIPMOS®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

Terminal Position

DUAL

Mounting Type

Surface Mount

Mount

Surface Mount

Rise Time

15ns

Drain to Source Voltage (Vdss)

60V

Case Connection

DRAIN

Turn On Delay Time

12 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

90m Ω @ 2.6A, 10V

Vgs(th) (Max) @ Id

2V @ 20μA

Input Capacitance (Ciss) (Max) @ Vds

380pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

20nC @ 10V

Operating Mode

ENHANCEMENT MODE

Configuration

SINGLE WITH BUILT-IN DIODE

Vgs (Max)

±20V

Fall Time (Typ)

15 ns

Continuous Drain Current (ID)

2.6A

Gate to Source Voltage (Vgs)

20V

DS Breakdown Voltage-Min

60V

Avalanche Energy Rating (Eas)

60 mJ

Radiation Hardening

No

Power Dissipation

1.8W

RoHS Status

RoHS Compliant

Infineon Technologies BSP320SL6433HTMA1

In stock

SKU: BSP320SL6433HTMA1-11
Manufacturer

Infineon Technologies

Turn Off Delay Time

25 ns

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

2.9A Ta

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Terminal Position

DUAL

Mount

Surface Mount

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2008

Series

SIPMOS®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

Additional Feature

AVALANCHE RATED

Power Dissipation (Max)

1.8W Ta

Terminal Form

GULL WING

Gate Charge (Qg) (Max) @ Vgs

12nC @ 10V

Rise Time

25ns

Power Dissipation

1.8W

Case Connection

DRAIN

Turn On Delay Time

11 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

120m Ω @ 2.9A, 10V

Vgs(th) (Max) @ Id

4V @ 20μA

Input Capacitance (Ciss) (Max) @ Vds

340pF @ 25V

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Drain to Source Voltage (Vdss)

60V

Vgs (Max)

±20V

Fall Time (Typ)

35 ns

Continuous Drain Current (ID)

2.9A

Gate to Source Voltage (Vgs)

20V

DS Breakdown Voltage-Min

60V

Avalanche Energy Rating (Eas)

60 mJ

Radiation Hardening

No

RoHS Status

RoHS Compliant

Infineon Technologies BSP321PH6327XTSA1

In stock

SKU: BSP321PH6327XTSA1-11
Manufacturer

Infineon Technologies

Operating Temperature

-55°C~150°C TJ

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Weight

250.212891mg

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

980mA Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

1.8W Ta

Terminal Form

GULL WING

Factory Lead Time

10 Weeks

Packaging

Tape & Reel (TR)

Published

2012

Series

SIPMOS™

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

AVALANCHE RATED

Terminal Position

DUAL

Turn Off Delay Time

16.5 ns

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Rise Time

4.4ns

Drain to Source Voltage (Vdss)

100V

Number of Channels

1

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Case Connection

DRAIN

Turn On Delay Time

5.9 ns

FET Type

P-Channel

Rds On (Max) @ Id, Vgs

900m Ω @ 980mA, 10V

Vgs(th) (Max) @ Id

4V @ 380μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

319pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

12nC @ 10V

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

4

Vgs (Max)

±20V

Fall Time (Typ)

8.5 ns

Continuous Drain Current (ID)

980mA

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

-100V

Drain Current-Max (Abs) (ID)

0.98A

Drain-source On Resistance-Max

0.9Ohm

Height

3.5mm

Length

6.5mm

Width

1.6mm

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies BSP322PH6327XTSA1

In stock

SKU: BSP322PH6327XTSA1-11
Manufacturer

Infineon Technologies

Pbfree Code

yes

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Cut Tape (CT)

Published

2012

Series

SIPMOS®

Element Configuration

Single

Factory Lead Time

10 Weeks

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

4

Number of Elements

1

Power Dissipation-Max

1.8W Ta

JESD-609 Code

e3

Operating Mode

ENHANCEMENT MODE

Drive Voltage (Max Rds On,Min Rds On)

4.5V 10V

Vgs (Max)

±20V

Turn On Delay Time

4.6 ns

FET Type

P-Channel

Rds On (Max) @ Id, Vgs

800m Ω @ 1A, 10V

Vgs(th) (Max) @ Id

1V @ 380μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

372pF @ 25V

Current - Continuous Drain (Id) @ 25°C

1A Tc

Gate Charge (Qg) (Max) @ Vgs

16.5nC @ 10V

Rise Time

4.3ns

Drain to Source Voltage (Vdss)

100V

Power Dissipation

1.8W

Case Connection

DRAIN

Fall Time (Typ)

8.3 ns

Turn-Off Delay Time

21.2 ns

Continuous Drain Current (ID)

1A

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

-100V

Drain Current-Max (Abs) (ID)

1A

Drain-source On Resistance-Max

0.8Ohm

Height

1.6mm

Length

6.5mm

Width

3.5mm

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies BSP324L6327HTSA1

In stock

SKU: BSP324L6327HTSA1-11
Manufacturer

Infineon Technologies

Turn Off Delay Time

17 ns

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

170mA Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

Additional Feature

LOGIC LEVEL COMPATIBLE

Mount

Surface Mount

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2008

Series

SIPMOS®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Power Dissipation (Max)

1.8W Ta

Terminal Position

DUAL

Vgs(th) (Max) @ Id

2.3V @ 94μA

Input Capacitance (Ciss) (Max) @ Vds

154pF @ 25V

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Power Dissipation

1.8W

Case Connection

DRAIN

Turn On Delay Time

4.6 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

25 Ω @ 170mA, 10V

Terminal Form

GULL WING

Pin Count

4

Gate Charge (Qg) (Max) @ Vgs

5.9nC @ 10V

Drain to Source Voltage (Vdss)

400V

Vgs (Max)

±20V

Fall Time (Typ)

68 ns

Continuous Drain Current (ID)

170mA

Gate to Source Voltage (Vgs)

20V

Pulsed Drain Current-Max (IDM)

0.68A

Radiation Hardening

No

RoHS Status

RoHS Compliant

Infineon Technologies BSP88H6327XTSA1

In stock

SKU: BSP88H6327XTSA1-11
Manufacturer

Infineon Technologies

Power Dissipation (Max)

1.8W Ta

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Supplier Device Package

PG-SOT223-4

Weight

250.212891mg

Current - Continuous Drain (Id) @ 25℃

350mA Ta

Drive Voltage (Max Rds On, Min Rds On)

2.8V 10V

Number of Channels

1

Factory Lead Time

10 Weeks

Turn Off Delay Time

17.9 ns

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2008

Series

SIPMOS®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

150°C

Min Operating Temperature

-55°C

Number of Elements

1

Power Dissipation

1.8W

Continuous Drain Current (ID)

350mA

Gate to Source Voltage (Vgs)

20V

Rds On (Max) @ Id, Vgs

6Ohm @ 350mA, 10V

Vgs(th) (Max) @ Id

1.4V @ 108μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

95pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

6.8nC @ 10V

Rise Time

3.5ns

Drain to Source Voltage (Vdss)

240V

Vgs (Max)

±20V

Fall Time (Typ)

18.9 ns

Turn On Delay Time

3.6 ns

FET Type

N-Channel

Max Dual Supply Voltage

240V

Drain to Source Breakdown Voltage

240V

Input Capacitance

76pF

Drain to Source Resistance

6Ohm

Rds On Max

600 mΩ

Height

1.6mm

Length

6.5mm

Width

3.5mm

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies BSP92PH6327XTSA1

In stock

SKU: BSP92PH6327XTSA1-11
Manufacturer

Infineon Technologies

Operating Mode

ENHANCEMENT MODE

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2002

Series

SIPMOS®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Pbfree Code

yes

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

LOGIC LEVEL COMPATIBLE

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

4

Number of Elements

1

Power Dissipation-Max

1.8W Ta

Element Configuration

Single

Contact Plating

Tin

Factory Lead Time

10 Weeks

Fall Time (Typ)

33 ns

Turn-Off Delay Time

67 ns

FET Type

P-Channel

Rds On (Max) @ Id, Vgs

12 Ω @ 260mA, 10V

Vgs(th) (Max) @ Id

2V @ 130μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

104pF @ 25V

Current - Continuous Drain (Id) @ 25°C

260mA Ta

Gate Charge (Qg) (Max) @ Vgs

5.4nC @ 10V

Rise Time

6ns

Drain to Source Voltage (Vdss)

250V

Drive Voltage (Max Rds On,Min Rds On)

2.8V 10V

Vgs (Max)

±20V

Case Connection

DRAIN

Power Dissipation

1.8W

Continuous Drain Current (ID)

260mA

Threshold Voltage

-1.5V

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

-250V

Drain Current-Max (Abs) (ID)

0.26A

Drain to Source Breakdown Voltage

-250V

Height

1.5mm

Length

6.5mm

Width

3.5mm

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Turn On Delay Time

5 ns

Lead Free

Lead Free

Infineon Technologies BSR202NL6327HTSA1

In stock

SKU: BSR202NL6327HTSA1-11
Manufacturer

Infineon Technologies

ECCN Code

EAR99

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

3.8A Ta

Drive Voltage (Max Rds On, Min Rds On)

2.5V 4.5V

Power Dissipation (Max)

500mW Ta

Operating Temperature

-55°C~150°C TJ

Number of Elements

1

Packaging

Tape & Reel (TR)

Published

2012

Series

OptiMOS™

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Contact Plating

Tin

Factory Lead Time

10 Weeks

Vgs(th) (Max) @ Id

1.2V @ 30μA

Input Capacitance (Ciss) (Max) @ Vds

1147pF @ 10V

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

3

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

21m Ω @ 3.8A, 4.5V

Terminal Position

DUAL

HTS Code

8541.21.00.95

Gate Charge (Qg) (Max) @ Vgs

8.8nC @ 4.5V

Rise Time

16.7ns

Vgs (Max)

±12V

Continuous Drain Current (ID)

3.8A

Gate to Source Voltage (Vgs)

12V

Max Dual Supply Voltage

20V

Drain-source On Resistance-Max

0.021Ohm

Feedback Cap-Max (Crss)

60 pF

Terminal Form

GULL WING

RoHS Status

ROHS3 Compliant

Infineon Technologies BSR315PH6327XTSA1

In stock

SKU: BSR315PH6327XTSA1-11
Manufacturer

Infineon Technologies

Turn On Delay Time

8 ns

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Supplier Device Package

PG-SC-59

Current - Continuous Drain (Id) @ 25℃

620mA Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Turn Off Delay Time

21 ns

Operating Temperature

-55°C~150°C TJ

Power Dissipation (Max)

500mW Ta

Packaging

Tape & Reel (TR)

Published

2013

Series

SIPMOS®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

150°C

Min Operating Temperature

-55°C

Mount

Surface Mount

Factory Lead Time

10 Weeks

Continuous Drain Current (ID)

620mA

Threshold Voltage

-1.5V

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

176pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

6nC @ 10V

Rise Time

28ns

Drain to Source Voltage (Vdss)

60V

Vgs (Max)

±20V

Fall Time (Typ)

20 ns

Rds On (Max) @ Id, Vgs

800mOhm @ 620mA, 10V

FET Type

P-Channel

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

-60V

Input Capacitance

176pF

Drain to Source Resistance

620mOhm

Rds On Max

800 mΩ

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Vgs(th) (Max) @ Id

2V @ 160μA

Lead Free

Lead Free

Infineon Technologies BSR316PL6327HTSA1

In stock

SKU: BSR316PL6327HTSA1-11
Manufacturer

Infineon Technologies

Operating Temperature

-55°C~150°C TJ

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

360mA Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

ECCN Code

EAR99

Power Dissipation (Max)

500mW Ta

Packaging

Tape & Reel (TR)

Published

2015

Series

SIPMOS®

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Mount

Surface Mount

Contact Plating

Tin

Rds On (Max) @ Id, Vgs

1.8 Ω @ 360mA, 10V

Terminal Form

GULL WING

Time@Peak Reflow Temperature-Max (s)

40

Pin Count

3

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Power Dissipation

500mW

FET Type

P-Channel

Vgs(th) (Max) @ Id

1V @ 170μA

Input Capacitance (Ciss) (Max) @ Vds

165pF @ 25V

Terminal Position

DUAL

Gate Charge (Qg) (Max) @ Vgs

7nC @ 10V

Rise Time

6ns

Drain to Source Voltage (Vdss)

100V

Vgs (Max)

±20V

Continuous Drain Current (ID)

360mA

Gate to Source Voltage (Vgs)

20V

Feedback Cap-Max (Crss)

20 pF

Peak Reflow Temperature (Cel)

260

RoHS Status

ROHS3 Compliant