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Discrete Semiconductors

Comchip Technology KBPC3504-G

In stock

SKU: KBPC3504-G-9
Manufacturer

Comchip Technology

Factory Lead Time

12 Weeks

Mount

Surface Mount

Mounting Type

QC Terminal

Package / Case

4-Square, KBPC

Diode Element Material

SILICON

Operating Temperature

'-55°C~150°C TJ

Packaging

Bulk

Published

2011

Part Status

Active

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

UL RECOGNIZED

HTS Code

8541.10.00.80

Terminal Position

UPPER

Terminal Form

SOLDER LUG

Peak Reflow Temperature (Cel)

NOT SPECIFIED

JESD-30 Code

R-XUFM-D4

Number of Elements

4

Configuration

BRIDGE, 4 ELEMENTS

Diode Type

Single Phase

Current - Reverse Leakage @ Vr

10μA @ 400V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 17.5A

Case Connection

ISOLATED

Output Current-Max

35A

Current - Average Rectified (Io)

35A

Number of Phases

1

Voltage - Peak Reverse (Max)

400V

Breakdown Voltage-Min

400V

RoHS Status

ROHS3 Compliant

Comchip Technology KBPC3504W-G

In stock

SKU: KBPC3504W-G-9
Manufacturer

Comchip Technology

Factory Lead Time

12 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

4-Square, KBPC-W

Diode Element Material

SILICON

Operating Temperature

'-55°C~150°C TJ

Packaging

Tray

Published

2013

Part Status

Active

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

UL RECOGNIZED

HTS Code

8541.10.00.80

Terminal Position

UPPER

Terminal Form

WIRE

Peak Reflow Temperature (Cel)

260

JESD-30 Code

S-XUFM-W4

Number of Elements

4

Configuration

BRIDGE, 4 ELEMENTS

Diode Type

Single Phase

Current - Reverse Leakage @ Vr

10μA @ 400V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 17.5A

Case Connection

ISOLATED

Output Current-Max

35A

Current - Average Rectified (Io)

35A

Number of Phases

1

Voltage - Peak Reverse (Max)

400V

Breakdown Voltage-Min

400V

RoHS Status

ROHS3 Compliant

Comchip Technology KBPC3510W-G

In stock

SKU: KBPC3510W-G-9
Manufacturer

Comchip Technology

Mounting Type

Through Hole

Package / Case

4-Square, KBPC-W

Diode Element Material

SILICON

Operating Temperature

'-55°C~150°C TJ

Packaging

Tray

Published

2004

Part Status

Active

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

UL RECOGNIZED

HTS Code

8541.10.00.80

Terminal Position

UPPER

Terminal Form

WIRE

Peak Reflow Temperature (Cel)

260

Mount

Through Hole

Factory Lead Time

12 Weeks

Output Current-Max

35A

Number of Elements

4

Diode Type

Single Phase

Current - Reverse Leakage @ Vr

10μA @ 1000V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 17.5A

Case Connection

ISOLATED

Max Reverse Leakage Current

10A

Max Surge Current

500A

Current - Average Rectified (Io)

35A

Number of Phases

1

JESD-30 Code

S-XUFM-W4

Voltage - Peak Reverse (Max)

1kV

Breakdown Voltage-Min

1000V

Height

10.77mm

Length

28.3mm

Width

28.3mm

Configuration

BRIDGE, 4 ELEMENTS

RoHS Status

ROHS3 Compliant

Comchip Technology KBPC5002W-G

In stock

SKU: KBPC5002W-G-9
Manufacturer

Comchip Technology

Factory Lead Time

12 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

4-Square, KBPC-W

Diode Element Material

SILICON

Operating Temperature

'-55°C~150°C TJ

Packaging

Bulk

Published

2013

Part Status

Active

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

UL RECOGNIZED

HTS Code

8541.10.00.80

Terminal Position

UPPER

Terminal Form

WIRE

Peak Reflow Temperature (Cel)

260

JESD-30 Code

S-XUFM-W4

Number of Elements

4

Configuration

BRIDGE, 4 ELEMENTS

Diode Type

Single Phase

Current - Reverse Leakage @ Vr

10μA @ 200V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 25A

Case Connection

ISOLATED

Output Current-Max

50A

Current - Average Rectified (Io)

50A

Number of Phases

1

Voltage - Peak Reverse (Max)

200V

Breakdown Voltage-Min

200V

RoHS Status

ROHS3 Compliant

Comchip Technology KBPC5008W-G

In stock

SKU: KBPC5008W-G-9
Manufacturer

Comchip Technology

Factory Lead Time

12 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

4-Square, KBPC-W

Diode Element Material

SILICON

Operating Temperature

'-55°C~150°C TJ

Packaging

Bulk

Published

2012

Part Status

Active

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

UL RECOGNIZED

HTS Code

8541.10.00.80

Terminal Position

UPPER

Terminal Form

WIRE

Peak Reflow Temperature (Cel)

260

JESD-30 Code

S-XUFM-W4

Number of Elements

4

Configuration

BRIDGE, 4 ELEMENTS

Diode Type

Single Phase

Current - Reverse Leakage @ Vr

10μA @ 800V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 25A

Case Connection

ISOLATED

Output Current-Max

50A

Current - Average Rectified (Io)

50A

Number of Phases

1

Voltage - Peak Reverse (Max)

800V

Breakdown Voltage-Min

800V

RoHS Status

ROHS3 Compliant

Comchip Technology KBPC5010-G

In stock

SKU: KBPC5010-G-9
Manufacturer

Comchip Technology

Part Status

Active

Mount

Surface Mount

Mounting Type

QC Terminal

Package / Case

4-Square, KBPC

Diode Element Material

SILICON

Operating Temperature

'-55°C~150°C TJ

Packaging

Bulk

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Factory Lead Time

12 Weeks

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

UL RECOGNIZED

HTS Code

8541.10.00.80

Terminal Position

UPPER

Terminal Form

SOLDER LUG

Published

2003

Max Surge Current

500A

Output Current-Max

50A

Configuration

BRIDGE, 4 ELEMENTS

Diode Type

Single Phase

Current - Reverse Leakage @ Vr

5μA @ 1000V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 25A

Case Connection

ISOLATED

Max Reverse Leakage Current

10μA

JESD-30 Code

R-XUFM-D4

Number of Elements

4

Current - Average Rectified (Io)

50A

Number of Phases

1

Voltage - Peak Reverse (Max)

1kV

Breakdown Voltage-Min

1000V

Height

10.77mm

Length

28.3mm

Width

28.3mm

RoHS Status

ROHS3 Compliant

Comchip Technology KBPC5010W-G

In stock

SKU: KBPC5010W-G-9
Manufacturer

Comchip Technology

Part Status

Active

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

4-Square, KBPC-W

Diode Element Material

SILICON

Operating Temperature

'-55°C~150°C TJ

Packaging

Tray

Peak Reflow Temperature (Cel)

260

Factory Lead Time

12 Weeks

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

UL RECOGNIZED

HTS Code

8541.10.00.80

Terminal Position

UPPER

Terminal Form

WIRE

Published

2003

Max Surge Current

500A

Output Current-Max

50A

Configuration

BRIDGE, 4 ELEMENTS

Diode Type

Single Phase

Current - Reverse Leakage @ Vr

10μA @ 1000V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 25A

Case Connection

ISOLATED

Max Reverse Leakage Current

10A

JESD-30 Code

S-XUFM-W4

Number of Elements

4

Current - Average Rectified (Io)

50A

Number of Phases

1

Voltage - Peak Reverse (Max)

1kV

Breakdown Voltage-Min

1000V

Height

10.77mm

Length

28.3mm

Width

28.3mm

RoHS Status

ROHS3 Compliant

Comchip Technology KBU10005-G

In stock

SKU: KBU10005-G-9
Manufacturer

Comchip Technology

Terminal Form

WIRE

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

4-SIP, KBU

Diode Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Tray

Published

2011

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

UL RECOGNIZED

HTS Code

8541.10.00.80

Factory Lead Time

12 Weeks

Time@Peak Reflow Temperature-Max (s)

30

Peak Reflow Temperature (Cel)

260

JESD-30 Code

R-PSIP-W4

Number of Elements

4

Configuration

BRIDGE, 4 ELEMENTS

Diode Type

Single Phase

Current - Reverse Leakage @ Vr

10μA @ 50V

Voltage - Forward (Vf) (Max) @ If

1V @ 5A

Max Reverse Leakage Current

10μA

Max Surge Current

240A

Output Current-Max

10A

Current - Average Rectified (Io)

10A

Number of Phases

1

Voltage - Peak Reverse (Max)

50V

Breakdown Voltage-Min

50V

RoHS Status

ROHS3 Compliant

Comchip Technology KBU2501-G

In stock

SKU: KBU2501-G-9
Manufacturer

Comchip Technology

Factory Lead Time

12 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

4-SIP, KBU

Diode Element Material

SILICON

Operating Temperature

'-55°C~150°C TJ

Packaging

Bulk

Published

2011

Part Status

Active

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

UL RECOGNIZED

HTS Code

8541.10.00.80

Terminal Form

WIRE

Peak Reflow Temperature (Cel)

260

JESD-30 Code

R-PSIP-W4

Number of Elements

4

Configuration

BRIDGE, 4 ELEMENTS

Diode Type

Single Phase

Current - Reverse Leakage @ Vr

10μA @ 100V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 12.5A

Output Current-Max

25A

Current - Average Rectified (Io)

3.6A

Number of Phases

1

Voltage - Peak Reverse (Max)

100V

Breakdown Voltage-Min

100V

RoHS Status

ROHS3 Compliant

Comchip Technology MP10005G-G

In stock

SKU: MP10005G-G-9
Manufacturer

Comchip Technology

Packaging

Tray

Terminal Position

UPPER

Additional Feature

UL RECOGNIZED

ECCN Code

EAR99

Number of Terminations

4

Part Status

Active

Terminal Form

WIRE

Published

2011

Operating Temperature

'-55°C~150°C TJ

Diode Element Material

SILICON

Number of Pins

8

Package / Case

4-Square, MP-8

Mounting Type

Through Hole

Mount

Through Hole

Factory Lead Time

12 Weeks

Max Surge Current

200A

Breakdown Voltage-Min

50V

Voltage - Peak Reverse (Max)

50V

Number of Phases

1

Current - Average Rectified (Io)

10A

Output Current-Max

10A

Max Reverse Leakage Current

10μA

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Voltage - Forward (Vf) (Max) @ If

1.1V @ 5A

Current - Reverse Leakage @ Vr

10μA @ 50V

Diode Type

Single Phase

Configuration

BRIDGE, 4 ELEMENTS

Number of Elements

4

JESD-30 Code

R-XUFM-W4

RoHS Status

ROHS3 Compliant

Comchip Technology SC35VB80-G

In stock

SKU: SC35VB80-G-9
Manufacturer

Comchip Technology

Factory Lead Time

12 Weeks

Mounting Type

QC Terminal

Package / Case

5-Square, SCVB

Surface Mount

NO

Diode Element Material

SILICON

Operating Temperature

'-55°C~150°C TJ

Packaging

Tray

Published

2013

Part Status

Active

Number of Terminations

5

ECCN Code

EAR99

Additional Feature

UL RECOGNIZED

HTS Code

8541.10.00.80

Terminal Position

UPPER

Terminal Form

SOLDER LUG

Peak Reflow Temperature (Cel)

260

JESD-30 Code

S-XUFM-D5

Number of Elements

6

Configuration

BRIDGE, 6 ELEMENTS

Diode Type

Three Phase

Current - Reverse Leakage @ Vr

10μA @ 800V

Voltage - Forward (Vf) (Max) @ If

1.05V @ 12.5A

Case Connection

ISOLATED

Max Reverse Leakage Current

10μA

Max Surge Current

350A

Output Current-Max

35A

Current - Average Rectified (Io)

35A

Number of Phases

3

Voltage - Peak Reverse (Max)

800V

RoHS Status

ROHS3 Compliant

Comchip Technology Z4GP208-HF

In stock

SKU: Z4GP208-HF-9
Manufacturer

Comchip Technology

Terminal Position

DUAL

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

4-SMD, No Lead

Number of Pins

4

Diode Element Material

SILICON

Operating Temperature

'-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2013

Pbfree Code

yes

Part Status

Active

Number of Terminations

4

Additional Feature

LOW POWER LOSS

Factory Lead Time

10 Weeks

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Elements

4

Diode Type

Single Phase

Current - Reverse Leakage @ Vr

5μA @ 800V

Voltage - Forward (Vf) (Max) @ If

1V @ 2A

Max Reverse Leakage Current

5μA

Max Surge Current

50A

Output Current-Max

2A

Current - Average Rectified (Io)

2A

Number of Phases

1

Voltage - Peak Reverse (Max)

800V

Height

1.35mm

Length

5.9mm

Width

5.4mm

RoHS Status

ROHS3 Compliant