Showing 1657–1668 of 7598 results
Transistors - FETs/MOSFETs - Single
Infineon Technologies IRF1010EPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Number of Terminations |
3 |
Contact Plating |
Tin |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Published |
2001 |
Series |
HEXFET® |
Part Status |
Active |
Case Connection |
DRAIN |
Factory Lead Time |
12 Weeks |
Termination |
Through Hole |
ECCN Code |
EAR99 |
Resistance |
12mOhm |
Voltage - Rated DC |
60V |
Current Rating |
84A |
Lead Pitch |
2.54mm |
Number of Elements |
1 |
Power Dissipation-Max |
200W Tc |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
170W |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Turn On Delay Time |
12 ns |
Threshold Voltage |
4V |
JEDEC-95 Code |
TO-220AB |
Rds On (Max) @ Id, Vgs |
12m Ω @ 50A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
3210pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
84A Tc |
Gate Charge (Qg) (Max) @ Vgs |
130nC @ 10V |
Rise Time |
78ns |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
53 ns |
Turn-Off Delay Time |
48 ns |
Continuous Drain Current (ID) |
84A |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
75A |
Drain to Source Breakdown Voltage |
60V |
Dual Supply Voltage |
60V |
Nominal Vgs |
4 V |
Height |
16.51mm |
Length |
10.668mm |
Width |
4.826mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRF1010ESTRLPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Number of Terminations |
2 |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Operating Mode |
ENHANCEMENT MODE |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Resistance |
12mOhm |
Voltage - Rated DC |
60V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
84A |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Number of Elements |
1 |
Power Dissipation-Max |
200W Tc |
Element Configuration |
Single |
Contact Plating |
Tin |
Factory Lead Time |
12 Weeks |
Fall Time (Typ) |
53 ns |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
12m Ω @ 50A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
3210pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
84A Tc |
Gate Charge (Qg) (Max) @ Vgs |
130nC @ 10V |
Rise Time |
78ns |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±20V |
Turn-Off Delay Time |
48 ns |
Continuous Drain Current (ID) |
84A |
Power Dissipation |
170W |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
75A |
Drain to Source Breakdown Voltage |
60V |
Nominal Vgs |
4 V |
Height |
4.826mm |
Length |
10.668mm |
Width |
9.65mm |
Radiation Hardening |
No |
REACH SVHC |
Unknown |
RoHS Status |
ROHS3 Compliant |
Turn On Delay Time |
12 ns |
Lead Free |
Contains Lead, Lead Free |
Infineon Technologies IRF1010EZSTRLP
In stock
Manufacturer |
Infineon Technologies |
---|---|
Turn Off Delay Time |
38 ns |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Current - Continuous Drain (Id) @ 25℃ |
75A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Factory Lead Time |
12 Weeks |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
Series |
HEXFET® |
Pbfree Code |
yes |
Part Status |
Active |
Power Dissipation (Max) |
140W Tc |
Resistance |
8.5MOhm |
Rise Time |
90ns |
Vgs (Max) |
±20V |
Turn On Delay Time |
19 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
8.5m Ω @ 51A, 10V |
Vgs(th) (Max) @ Id |
4V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds |
2810pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
86nC @ 10V |
Element Configuration |
Single |
Power Dissipation |
140W |
Fall Time (Typ) |
54 ns |
Continuous Drain Current (ID) |
75A |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
60V |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRF1010ZLPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Power Dissipation |
140W |
Number of Pins |
3 |
Current - Continuous Drain (Id) @ 25℃ |
75A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
140W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Turn Off Delay Time |
36 ns |
Published |
2004 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Voltage - Rated DC |
55V |
Current Rating |
75A |
Mounting Type |
Through Hole |
Mount |
Through Hole |
Continuous Drain Current (ID) |
75A |
Gate to Source Voltage (Vgs) |
20V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
2840pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
95nC @ 10V |
Rise Time |
150ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
92 ns |
FET Type |
N-Channel |
Turn On Delay Time |
18 ns |
Drain to Source Breakdown Voltage |
55V |
Height |
9.65mm |
Length |
10.668mm |
Width |
4.826mm |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Rds On (Max) @ Id, Vgs |
7.5m Ω @ 75A, 10V |
Lead Free |
Lead Free |
Infineon Technologies IRF1310NSTRLPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Termination |
SMD/SMT |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
1998 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Power Dissipation |
3.8W |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Resistance |
36mOhm |
Voltage - Rated DC |
100V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
42A |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Number of Elements |
1 |
Power Dissipation-Max |
3.8W Ta 160W Tc |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Contact Plating |
Tin |
Factory Lead Time |
12 Weeks |
Continuous Drain Current (ID) |
42A |
Turn On Delay Time |
11 ns |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
36m Ω @ 22A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1900pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
42A Tc |
Gate Charge (Qg) (Max) @ Vgs |
110nC @ 10V |
Rise Time |
56ns |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
40 ns |
Turn-Off Delay Time |
45 ns |
Threshold Voltage |
4V |
Gate to Source Voltage (Vgs) |
20V |
Case Connection |
DRAIN |
Drain to Source Breakdown Voltage |
100V |
Dual Supply Voltage |
100V |
Avalanche Energy Rating (Eas) |
420 mJ |
Recovery Time |
270 ns |
Nominal Vgs |
4 V |
Height |
4.826mm |
Length |
10.668mm |
Width |
9.65mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
FET Type |
N-Channel |
Lead Free |
Lead Free |
Infineon Technologies IRF1324LPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Mounting Type |
Through Hole |
Number of Pins |
3 |
Supplier Device Package |
TO-262 |
Current - Continuous Drain (Id) @ 25℃ |
195A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
300W Tc |
Turn Off Delay Time |
83 ns |
FET Type |
N-Channel |
Mount |
Through Hole |
Published |
2009 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Max Operating Temperature |
175°C |
Min Operating Temperature |
-55°C |
Power Dissipation |
300W |
Turn On Delay Time |
17 ns |
Operating Temperature |
-55°C~175°C TJ |
Rds On (Max) @ Id, Vgs |
1.65mOhm @ 195A, 10V |
Drain to Source Breakdown Voltage |
24V |
Input Capacitance |
7.59nF |
Gate Charge (Qg) (Max) @ Vgs |
240nC @ 10V |
Rise Time |
190ns |
Drain to Source Voltage (Vdss) |
24V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
120 ns |
Continuous Drain Current (ID) |
340A |
Gate to Source Voltage (Vgs) |
20V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
7590pF @ 24V |
Drain to Source Resistance |
1.65mOhm |
Rds On Max |
1.65 mΩ |
Nominal Vgs |
4 V |
Height |
9.65mm |
Length |
10.668mm |
Width |
4.826mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
RoHS Compliant |
Infineon Technologies IRF1324S-7PPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Series |
HEXFET® |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
7 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
240A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
300W Tc |
Turn Off Delay Time |
86 ns |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Element Configuration |
Single |
Contact Plating |
Tin |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
6 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Voltage - Rated DC |
24V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
429A |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G6 |
Published |
2006 |
Operating Mode |
ENHANCEMENT MODE |
Threshold Voltage |
4V |
Gate to Source Voltage (Vgs) |
20V |
Turn On Delay Time |
19 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
1m Ω @ 160A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
7700pF @ 19V |
Gate Charge (Qg) (Max) @ Vgs |
252nC @ 10V |
Rise Time |
240ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
93 ns |
Continuous Drain Current (ID) |
429A |
Power Dissipation |
300W |
Case Connection |
DRAIN |
Drain Current-Max (Abs) (ID) |
240A |
Drain to Source Breakdown Voltage |
24V |
Dual Supply Voltage |
24V |
Avalanche Energy Rating (Eas) |
230 mJ |
Recovery Time |
107 ns |
Nominal Vgs |
4 V |
Height |
4.5466mm |
Length |
10.795mm |
Width |
8.15mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRF1324SPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Supplier Device Package |
D2PAK |
Current - Continuous Drain (Id) @ 25℃ |
195A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
300W Tc |
Turn Off Delay Time |
83 ns |
FET Type |
N-Channel |
Mount |
Surface Mount |
Published |
2008 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
SMD/SMT |
Max Operating Temperature |
175°C |
Min Operating Temperature |
-55°C |
Power Dissipation |
300W |
Turn On Delay Time |
17 ns |
Operating Temperature |
-55°C~175°C TJ |
Rds On (Max) @ Id, Vgs |
1.65mOhm @ 195A, 10V |
Drain to Source Breakdown Voltage |
24V |
Dual Supply Voltage |
24V |
Gate Charge (Qg) (Max) @ Vgs |
240nC @ 10V |
Rise Time |
190ns |
Drain to Source Voltage (Vdss) |
24V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
120 ns |
Continuous Drain Current (ID) |
340A |
Threshold Voltage |
4V |
Gate to Source Voltage (Vgs) |
20V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
7590pF @ 24V |
Input Capacitance |
7.59nF |
Drain to Source Resistance |
1.65mOhm |
Rds On Max |
1.65 mΩ |
Nominal Vgs |
4 V |
Height |
4.826mm |
Length |
10.668mm |
Width |
9.65mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
RoHS Compliant |
Infineon Technologies IRF1324STRLPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tape & Reel (TR) |
Number of Pins |
3 |
Supplier Device Package |
D2PAK |
Current - Continuous Drain (Id) @ 25℃ |
195A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
300W Tc |
Turn Off Delay Time |
83 ns |
Turn On Delay Time |
17 ns |
Operating Temperature |
-55°C~175°C TJ |
Published |
2009 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Max Operating Temperature |
175°C |
Min Operating Temperature |
-55°C |
Power Dissipation |
300W |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Continuous Drain Current (ID) |
195A |
Rds On (Max) @ Id, Vgs |
1.65mOhm @ 195A, 10V |
Input Capacitance (Ciss) (Max) @ Vds |
7590pF @ 24V |
Gate Charge (Qg) (Max) @ Vgs |
240nC @ 10V |
Rise Time |
190ns |
Drain to Source Voltage (Vdss) |
24V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
120 ns |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
24V |
FET Type |
N-Channel |
Input Capacitance |
7.59nF |
Rds On Max |
1.65 mΩ |
Height |
4.826mm |
Length |
10.668mm |
Width |
9.65mm |
Radiation Hardening |
No |
Vgs(th) (Max) @ Id |
4V @ 250μA |
RoHS Status |
RoHS Compliant |
Infineon Technologies IRF1404LPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Series |
HEXFET® |
Mounting Type |
Through Hole |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
162A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
3.8W Ta 200W Tc |
Turn Off Delay Time |
72 ns |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Element Configuration |
Single |
Published |
2004 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Resistance |
4mOhm |
Voltage - Rated DC |
40V |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
162A |
Time@Peak Reflow Temperature-Max (s) |
30 |
Number of Channels |
1 |
Mount |
Through Hole |
Factory Lead Time |
12 Weeks |
Continuous Drain Current (ID) |
162A |
Power Dissipation |
200W |
Turn On Delay Time |
17 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
4m Ω @ 95A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
7360pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
200nC @ 10V |
Rise Time |
140ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
26 ns |
Threshold Voltage |
4V |
Gate to Source Voltage (Vgs) |
20V |
Operating Mode |
ENHANCEMENT MODE |
Drain Current-Max (Abs) (ID) |
75A |
Drain to Source Breakdown Voltage |
40V |
Pulsed Drain Current-Max (IDM) |
650A |
Nominal Vgs |
4 V |
Height |
9.652mm |
Length |
10.668mm |
Width |
4.826mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Case Connection |
DRAIN |
Lead Free |
Lead Free |
Infineon Technologies IRF1405ZLPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Operating Temperature |
-55°C~175°C TJ |
Mounting Type |
Through Hole |
Number of Pins |
3 |
Current - Continuous Drain (Id) @ 25℃ |
75A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
230W Tc |
Current Rating |
75A |
Mount |
Through Hole |
Packaging |
Tube |
Published |
2010 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Resistance |
4.9MOhm |
Voltage - Rated DC |
55V |
Turn Off Delay Time |
48 ns |
Power Dissipation |
230W |
Fall Time (Typ) |
82 ns |
Continuous Drain Current (ID) |
75A |
Rds On (Max) @ Id, Vgs |
4.9m Ω @ 75A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
4780pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
180nC @ 10V |
Rise Time |
110ns |
Vgs (Max) |
±20V |
Turn On Delay Time |
18 ns |
FET Type |
N-Channel |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
55V |
Height |
9.65mm |
Length |
10.668mm |
Width |
4.826mm |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRF1503PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
75A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
330W Tc |
Turn Off Delay Time |
59 ns |
Power Dissipation |
330W |
Factory Lead Time |
12 Weeks |
Published |
2002 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Voltage - Rated DC |
30V |
Current Rating |
75A |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Operating Temperature |
-55°C~175°C TJ |
Case Connection |
DRAIN |
JEDEC-95 Code |
TO-220AB |
Gate to Source Voltage (Vgs) |
20V |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
3.3m Ω @ 140A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
5730pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
200nC @ 10V |
Rise Time |
130ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
48 ns |
Continuous Drain Current (ID) |
75A |
Threshold Voltage |
4V |
Turn On Delay Time |
17 ns |
FET Type |
N-Channel |
Drain to Source Breakdown Voltage |
30V |
Pulsed Drain Current-Max (IDM) |
960A |
Avalanche Energy Rating (Eas) |
980 mJ |
Nominal Vgs |
4 V |
Height |
16.51mm |
Length |
10.668mm |
Width |
4.826mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |