Transistors - FETs/MOSFETs - Single

Infineon Technologies IRF3000PBF

In stock

SKU: IRF3000PBF-11
Manufacturer

Infineon Technologies

Power Dissipation (Max)

2.5W Ta

Max Operating Temperature

150°C

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Part Status

Obsolete

Series

HEXFET®

Published

2004

Packaging

Tube

Min Operating Temperature

-55°C

Operating Temperature

-55°C~150°C TJ

Drive Voltage (Max Rds On, Min Rds On)

10V

Current - Continuous Drain (Id) @ 25℃

1.6A Ta

Supplier Device Package

8-SO

Number of Pins

8

Package / Case

8-SOIC (0.154, 3.90mm Width)

Mounting Type

Surface Mount

Mount

Surface Mount

Current Rating

1.6A

Drain to Source Voltage (Vdss)

300V

RoHS Status

RoHS Compliant

Rds On Max

400 mΩ

Input Capacitance

730pF

Drain to Source Breakdown Voltage

300V

Continuous Drain Current (ID)

1.6A

Vgs (Max)

±30V

Rise Time

7.2ns

Voltage - Rated DC

300V

Gate Charge (Qg) (Max) @ Vgs

33nC @ 10V

Input Capacitance (Ciss) (Max) @ Vds

730pF @ 25V

Vgs(th) (Max) @ Id

5V @ 250μA

Rds On (Max) @ Id, Vgs

400mOhm @ 960mA, 10V

FET Type

N-Channel

Power Dissipation

2.5W

Lead Free

Lead Free

Infineon Technologies IRF3007STRLPBF

In stock

SKU: IRF3007STRLPBF-11
Manufacturer

Infineon Technologies

Published

2004

Mounting Type

Surface Mount

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

62A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

120W Tc

Operating Temperature

-55°C~175°C TJ

Peak Reflow Temperature (Cel)

260

Packaging

Tape & Reel (TR)

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Position

SINGLE

Terminal Form

GULL WING

Mount

Surface Mount

Factory Lead Time

12 Weeks

Input Capacitance (Ciss) (Max) @ Vds

3270pF @ 25V

JESD-30 Code

R-PSSO-G2

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Case Connection

DRAIN

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

12.6m Ω @ 48A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Gate Charge (Qg) (Max) @ Vgs

130nC @ 10V

Drain to Source Voltage (Vdss)

75V

Time@Peak Reflow Temperature-Max (s)

30

Vgs (Max)

±20V

Continuous Drain Current (ID)

62A

Drain-source On Resistance-Max

0.0126Ohm

Pulsed Drain Current-Max (IDM)

320A

DS Breakdown Voltage-Min

75V

Avalanche Energy Rating (Eas)

946 mJ

RoHS Status

ROHS3 Compliant

Qualification Status

Not Qualified

Lead Free

Lead Free

Infineon Technologies IRF3205LPBF

In stock

SKU: IRF3205LPBF-11
Manufacturer

Infineon Technologies

Published

2002

Mount

Through Hole

Mounting Type

Through Hole

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

110A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

200W Tc

Turn Off Delay Time

50 ns

Operating Temperature

-55°C~175°C TJ

Configuration

SINGLE WITH BUILT-IN DIODE

Factory Lead Time

14 Weeks

Series

HEXFET®

JESD-609 Code

e3

Part Status

Not For New Designs

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Voltage - Rated DC

55V

Terminal Position

SINGLE

Peak Reflow Temperature (Cel)

260

Current Rating

110A

Time@Peak Reflow Temperature-Max (s)

30

Packaging

Tube

Operating Mode

ENHANCEMENT MODE

Continuous Drain Current (ID)

110A

Threshold Voltage

4V

Turn On Delay Time

14 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

8m Ω @ 62A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

3247pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

146nC @ 10V

Rise Time

101ns

Vgs (Max)

±20V

Fall Time (Typ)

65 ns

Power Dissipation

200W

Case Connection

DRAIN

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

75A

Drain-source On Resistance-Max

0.008Ohm

Drain to Source Breakdown Voltage

55V

Avalanche Energy Rating (Eas)

264 mJ

Height

9.65mm

Length

10.668mm

Width

4.826mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies IRF3205STRLPBF

In stock

SKU: IRF3205STRLPBF-11
Manufacturer

Infineon Technologies

ECCN Code

EAR99

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2001

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

Case Connection

DRAIN

Factory Lead Time

12 Weeks

Resistance

8MOhm

Voltage - Rated DC

55V

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

110A

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Number of Elements

1

Number of Channels

1

Power Dissipation-Max

200W Tc

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Power Dissipation

200W

Termination

SMD/SMT

Turn On Delay Time

14 ns

JEDEC-95 Code

TO-252

Gate to Source Voltage (Vgs)

20V

Rds On (Max) @ Id, Vgs

8m Ω @ 62A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

3247pF @ 25V

Current - Continuous Drain (Id) @ 25°C

110A Tc

Gate Charge (Qg) (Max) @ Vgs

146nC @ 10V

Rise Time

101ns

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±20V

Fall Time (Typ)

65 ns

Turn-Off Delay Time

50 ns

Continuous Drain Current (ID)

110A

Threshold Voltage

4V

FET Type

N-Channel

Transistor Application

SWITCHING

Drain Current-Max (Abs) (ID)

75A

Drain to Source Breakdown Voltage

55V

Dual Supply Voltage

55V

Avalanche Energy Rating (Eas)

264 mJ

Recovery Time

104 ns

Max Junction Temperature (Tj)

175°C

Nominal Vgs

4 V

Height

5.084mm

Length

10.668mm

Width

10.54mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Contains Lead, Lead Free

Infineon Technologies IRF3205ZSTRRPBF

In stock

SKU: IRF3205ZSTRRPBF-11
Manufacturer

Infineon Technologies

Power Dissipation

170W

Number of Pins

3

Supplier Device Package

D2PAK

Current - Continuous Drain (Id) @ 25℃

75A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

170W Tc

Turn Off Delay Time

45 ns

Packaging

Tape & Reel (TR)

Published

2010

Operating Temperature

-55°C~175°C TJ

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Resistance

6.5MOhm

Max Operating Temperature

175°C

Min Operating Temperature

-55°C

Voltage - Rated DC

55V

Current Rating

75A

Mounting Type

Surface Mount

Mount

Surface Mount

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

55V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

3450pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

110nC @ 10V

Rise Time

95ns

Drain to Source Voltage (Vdss)

55V

Vgs (Max)

±20V

Fall Time (Typ)

67 ns

Continuous Drain Current (ID)

75A

FET Type

N-Channel

Turn On Delay Time

18 ns

Input Capacitance

3.45nF

Drain to Source Resistance

6.5mOhm

Rds On Max

6.5 mΩ

Height

4.826mm

Length

10.668mm

Width

9.65mm

Radiation Hardening

No

RoHS Status

RoHS Compliant

Rds On (Max) @ Id, Vgs

6.5mOhm @ 66A, 10V

Lead Free

Lead Free

Infineon Technologies IRF3315PBF

In stock

SKU: IRF3315PBF-11
Manufacturer

Infineon Technologies

Published

1998

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

TO-220-3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

23A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

94W Tc

Turn Off Delay Time

49 ns

Operating Temperature

-55°C~175°C TJ

Operating Mode

ENHANCEMENT MODE

Factory Lead Time

14 Weeks

Series

HEXFET®

JESD-609 Code

e3

Part Status

Not For New Designs

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Termination

Through Hole

ECCN Code

EAR99

Resistance

82mOhm

Voltage - Rated DC

150V

Current Rating

27A

Element Configuration

Single

Packaging

Tube

Power Dissipation

136W

JEDEC-95 Code

TO-220AB

Gate to Source Voltage (Vgs)

20V

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

70m Ω @ 12A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1300pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

95nC @ 10V

Rise Time

32ns

Vgs (Max)

±20V

Fall Time (Typ)

38 ns

Continuous Drain Current (ID)

27A

Threshold Voltage

4V

Case Connection

DRAIN

Turn On Delay Time

9.6 ns

Drain to Source Breakdown Voltage

150V

Pulsed Drain Current-Max (IDM)

84A

Dual Supply Voltage

150V

Recovery Time

260 ns

Nominal Vgs

4 V

Height

8.77mm

Length

10.54mm

Width

4.69mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Contains Lead, Lead Free

Infineon Technologies IRF3315STRRPBF

In stock

SKU: IRF3315STRRPBF-11
Manufacturer

Infineon Technologies

Turn On Delay Time

9.6 ns

Number of Pins

3

Supplier Device Package

D2PAK

Current - Continuous Drain (Id) @ 25℃

21A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

3.8W Ta 94W Tc

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Turn Off Delay Time

49 ns

Published

2004

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

175°C

Min Operating Temperature

-55°C

Power Dissipation

94W

Mounting Type

Surface Mount

Mount

Surface Mount

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

150V

Input Capacitance (Ciss) (Max) @ Vds

1300pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

95nC @ 10V

Rise Time

32ns

Drain to Source Voltage (Vdss)

150V

Vgs (Max)

±20V

Fall Time (Typ)

38 ns

Continuous Drain Current (ID)

21A

Rds On (Max) @ Id, Vgs

82mOhm @ 12A, 10V

FET Type

N-Channel

Input Capacitance

1.3nF

Drain to Source Resistance

82mOhm

Rds On Max

82 mΩ

Height

4.826mm

Length

10.668mm

Width

9.65mm

Radiation Hardening

No

Vgs(th) (Max) @ Id

4V @ 250μA

RoHS Status

RoHS Compliant

Infineon Technologies IRF3415S

In stock

SKU: IRF3415S-11
Manufacturer

Infineon Technologies

Series

HEXFET®

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

43A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

3.8W Ta 200W Tc

Operating Temperature

-55°C~175°C TJ

Packaging

Tube

Terminal Form

GULL WING

Published

1998

JESD-609 Code

e0

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Finish

Tin/Lead (Sn/Pb)

HTS Code

8541.29.00.95

Terminal Position

SINGLE

Surface Mount

YES

Mounting Type

Surface Mount

Vgs(th) (Max) @ Id

4V @ 250μA

Time@Peak Reflow Temperature-Max (s)

30

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Case Connection

DRAIN

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

42m Ω @ 22A, 10V

Input Capacitance (Ciss) (Max) @ Vds

2400pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

200nC @ 10V

Peak Reflow Temperature (Cel)

225

Drain to Source Voltage (Vdss)

150V

Vgs (Max)

±20V

Drain Current-Max (Abs) (ID)

43A

Drain-source On Resistance-Max

0.042Ohm

Pulsed Drain Current-Max (IDM)

150A

DS Breakdown Voltage-Min

150V

Avalanche Energy Rating (Eas)

590 mJ

JESD-30 Code

R-PSSO-G2

RoHS Status

Non-RoHS Compliant

Infineon Technologies IRF3415STRLPBF

In stock

SKU: IRF3415STRLPBF-11
Manufacturer

Infineon Technologies

Termination

SMD/SMT

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

1998

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Power Dissipation

3.8W

Factory Lead Time

12 Weeks

ECCN Code

EAR99

Resistance

4.2MOhm

Voltage - Rated DC

150V

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

43A

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Number of Elements

1

Power Dissipation-Max

3.8W Ta 200W Tc

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Number of Terminations

2

Case Connection

DRAIN

Continuous Drain Current (ID)

43A

Threshold Voltage

4V

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

42m Ω @ 22A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2400pF @ 25V

Current - Continuous Drain (Id) @ 25°C

43A Tc

Gate Charge (Qg) (Max) @ Vgs

200nC @ 10V

Rise Time

55ns

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±20V

Fall Time (Typ)

69 ns

Turn-Off Delay Time

71 ns

Turn On Delay Time

12 ns

FET Type

N-Channel

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

150V

Dual Supply Voltage

150V

Avalanche Energy Rating (Eas)

590 mJ

Recovery Time

390 ns

Nominal Vgs

4 V

Height

4.826mm

Length

10.668mm

Width

9.65mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Contains Lead, Lead Free

Infineon Technologies IRF3704SPBF

In stock

SKU: IRF3704SPBF-11
Manufacturer

Infineon Technologies

Packaging

Tube

Mounting Type

Surface Mount

Number of Pins

3

Supplier Device Package

D2PAK

Current - Continuous Drain (Id) @ 25℃

77A Tc

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Power Dissipation (Max)

87W Tc

Turn Off Delay Time

12 ns

Current Rating

77A

Mount

Surface Mount

Published

2004

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

175°C

Min Operating Temperature

-55°C

Voltage - Rated DC

20V

Operating Temperature

-55°C~175°C TJ

Power Dissipation

90W

Fall Time (Typ)

5 ns

Continuous Drain Current (ID)

77A

Rds On (Max) @ Id, Vgs

9mOhm @ 15A, 10V

Vgs(th) (Max) @ Id

3V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1996pF @ 10V

Gate Charge (Qg) (Max) @ Vgs

19nC @ 4.5V

Rise Time

98ns

Drain to Source Voltage (Vdss)

20V

Vgs (Max)

±20V

Turn On Delay Time

8.4 ns

FET Type

N-Channel

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

20V

Input Capacitance

1.996nF

Drain to Source Resistance

13.5mOhm

Rds On Max

9 mΩ

Radiation Hardening

No

RoHS Status

RoHS Compliant

Lead Free

Lead Free

Infineon Technologies IRF3704ZSPBF

In stock

SKU: IRF3704ZSPBF-11
Manufacturer

Infineon Technologies

JESD-609 Code

e3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

67A Tc

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

Power Dissipation (Max)

57W Tc

Turn Off Delay Time

11 ns

Operating Temperature

-55°C~175°C TJ

Packaging

Tube

Published

2004

Element Configuration

Single

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Resistance

7.9MOhm

Voltage - Rated DC

20V

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

67A

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Mounting Type

Surface Mount

Mount

Surface Mount

Continuous Drain Current (ID)

67A

Power Dissipation

57W

Turn On Delay Time

8.9 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

7.9m Ω @ 21A, 10V

Vgs(th) (Max) @ Id

2.55V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1220pF @ 10V

Gate Charge (Qg) (Max) @ Vgs

13nC @ 4.5V

Rise Time

38ns

Vgs (Max)

±20V

Fall Time (Typ)

4.2 ns

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

42A

Operating Mode

ENHANCEMENT MODE

Drain to Source Breakdown Voltage

20V

Pulsed Drain Current-Max (IDM)

260A

Recovery Time

17 ns

Nominal Vgs

2.1 V

Height

4.83mm

Length

10.67mm

Width

9.65mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

RoHS Compliant

Case Connection

DRAIN

Lead Free

Lead Free

Infineon Technologies IRF3706LPBF

In stock

SKU: IRF3706LPBF-11
Manufacturer

Infineon Technologies

Published

2004

Supplier Device Package

TO-262

Current - Continuous Drain (Id) @ 25℃

77A Tc

Drive Voltage (Max Rds On, Min Rds On)

2.8V 10V

Power Dissipation (Max)

88W Tc

Turn Off Delay Time

17 ns

Operating Temperature

-55°C~175°C TJ

Current Rating

77A

Packaging

Tube

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Resistance

8.5MOhm

Max Operating Temperature

175°C

Min Operating Temperature

-55°C

Voltage - Rated DC

20V

Mounting Type

Through Hole

Mount

Through Hole

Vgs (Max)

±12V

Power Dissipation

88W

Rds On (Max) @ Id, Vgs

8.5mOhm @ 15A, 10V

Vgs(th) (Max) @ Id

2V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2410pF @ 10V

Gate Charge (Qg) (Max) @ Vgs

35nC @ 4.5V

Rise Time

87ns

Drain to Source Voltage (Vdss)

20V

Fall Time (Typ)

4.8 ns

Continuous Drain Current (ID)

77A

Element Configuration

Single

Gate to Source Voltage (Vgs)

12V

Drain to Source Breakdown Voltage

20V

Input Capacitance

2.41nF

Drain to Source Resistance

10.5mOhm

Rds On Max

8.5 mΩ

RoHS Status

RoHS Compliant

FET Type

N-Channel

Lead Free

Lead Free