Showing 1789–1800 of 7598 results
Transistors - FETs/MOSFETs - Single
Infineon Technologies IRF6794MTRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Operating Temperature |
-40°C~150°C TJ |
Package / Case |
DirectFET™ Isometric MX |
Number of Pins |
5 |
Supplier Device Package |
DIRECTFET™ MX |
Current - Continuous Drain (Id) @ 25℃ |
32A Ta 200A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
2.8W Ta 100W Tc |
Turn On Delay Time |
15 ns |
Turn Off Delay Time |
9.7 ns |
Packaging |
Tape & Reel (TR) |
Published |
2010 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Max Operating Temperature |
150°C |
Min Operating Temperature |
-40°C |
Power Dissipation |
100W |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Gate to Source Voltage (Vgs) |
20V |
Rds On (Max) @ Id, Vgs |
1.7mOhm @ 32A, 10V |
Input Capacitance (Ciss) (Max) @ Vds |
4420pF @ 13V |
Gate Charge (Qg) (Max) @ Vgs |
47nC @ 4.5V |
Rise Time |
25ns |
Drain to Source Voltage (Vdss) |
25V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
9.6 ns |
Continuous Drain Current (ID) |
32A |
Drain to Source Breakdown Voltage |
25V |
Input Capacitance |
4.42nF |
FET Type |
N-Channel |
FET Feature |
Schottky Diode (Body) |
Drain to Source Resistance |
3mOhm |
Rds On Max |
1.7 mΩ |
Height |
506μm |
Length |
6.35mm |
Width |
5.05mm |
Radiation Hardening |
No |
Vgs(th) (Max) @ Id |
2.35V @ 100μA |
RoHS Status |
RoHS Compliant |
Infineon Technologies IRF6797MTRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Operating Temperature |
-40°C~150°C TJ |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
DirectFET™ Isometric MX |
Number of Pins |
7 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
36A Ta 210A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
2.8W Ta 89W Tc |
Terminal Position |
BOTTOM |
Factory Lead Time |
12 Weeks |
Packaging |
Tape & Reel (TR) |
Published |
2009 |
Series |
HEXFET® |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Additional Feature |
LOW CONDUCTION LOSS |
Turn Off Delay Time |
20 ns |
JESD-30 Code |
R-XBCC-N3 |
Rise Time |
32ns |
Vgs (Max) |
±20V |
Power Dissipation |
89W |
Case Connection |
DRAIN |
Turn On Delay Time |
22 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
1.4m Ω @ 38A, 10V |
Vgs(th) (Max) @ Id |
2.35V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds |
5790pF @ 13V |
Gate Charge (Qg) (Max) @ Vgs |
68nC @ 4.5V |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Fall Time (Typ) |
15 ns |
Continuous Drain Current (ID) |
36A |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
25V |
Pulsed Drain Current-Max (IDM) |
300A |
Avalanche Energy Rating (Eas) |
260 mJ |
Height |
506μm |
Length |
6.35mm |
Width |
5.05mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies IRF6894MTR1PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Power Dissipation |
2.1W |
Package / Case |
DirectFET™ Isometric MX |
Number of Pins |
7 |
Supplier Device Package |
DIRECTFET™ MX |
Current - Continuous Drain (Id) @ 25℃ |
32A Ta 160A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Power Dissipation (Max) |
2.1W Ta 54W Tc |
Operating Temperature |
-40°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Turn Off Delay Time |
20 ns |
Published |
2011 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Resistance |
1.3MOhm |
Max Operating Temperature |
150°C |
Min Operating Temperature |
-40°C |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Continuous Drain Current (ID) |
32A |
Gate to Source Voltage (Vgs) |
16V |
Vgs(th) (Max) @ Id |
2.1V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds |
4160pF @ 13V |
Gate Charge (Qg) (Max) @ Vgs |
39nC @ 4.5V |
Rise Time |
42ns |
Drain to Source Voltage (Vdss) |
25V |
Vgs (Max) |
±16V |
Fall Time (Typ) |
14 ns |
FET Type |
N-Channel |
Turn On Delay Time |
16 ns |
Drain to Source Breakdown Voltage |
25V |
Input Capacitance |
4.16nF |
FET Feature |
Schottky Diode (Body) |
Drain to Source Resistance |
1.7mOhm |
Rds On Max |
1.3 mΩ |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Rds On (Max) @ Id, Vgs |
1.3mOhm @ 33A, 10V |
Lead Free |
Lead Free |
Infineon Technologies IRF7204
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
5.3A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
2.5W Tc |
Additional Feature |
LOGIC LEVEL COMPATIBLE |
Mounting Type |
Surface Mount |
Published |
1997 |
Series |
HEXFET® |
JESD-609 Code |
e0 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Operating Temperature |
-55°C~150°C TJ |
HTS Code |
8541.29.00.95 |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
60m Ω @ 5.3A, 10V |
Peak Reflow Temperature (Cel) |
245 |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PDSO-G8 |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
FET Type |
P-Channel |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Vgs(th) (Max) @ Id |
2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
860pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs |
25nC @ 10V |
Drain to Source Voltage (Vdss) |
20V |
Vgs (Max) |
±12V |
Drain Current-Max (Abs) (ID) |
5.3A |
Drain-source On Resistance-Max |
0.06Ohm |
DS Breakdown Voltage-Min |
20V |
RoHS Status |
Non-RoHS Compliant |
Infineon Technologies IRF7204TR
In stock
Manufacturer |
Infineon Technologies |
---|---|
Terminal Position |
DUAL |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
5.3A Ta |
Number of Elements |
1 |
Packaging |
Cut Tape (CT) |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Published |
1997 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
LOGIC LEVEL COMPATIBLE |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Mounting Type |
Surface Mount |
Rds On (Max) @ Id, Vgs |
60m Ω @ 5.3A, 10V |
Vgs(th) (Max) @ Id |
2.5V @ 250μA |
JESD-30 Code |
R-PDSO-G8 |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Terminal Form |
GULL WING |
Input Capacitance (Ciss) (Max) @ Vds |
860pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs |
25nC @ 10V |
Drain to Source Voltage (Vdss) |
20V |
Drain Current-Max (Abs) (ID) |
5.3A |
Drain-source On Resistance-Max |
0.06Ohm |
DS Breakdown Voltage-Min |
20V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
RoHS Status |
Non-RoHS Compliant |
Infineon Technologies IRF7204TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Resistance |
60mOhm |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
1997 |
Series |
HEXFET® |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Turn On Delay Time |
14 ns |
Number of Terminations |
8 |
Additional Feature |
LOGIC LEVEL COMPATIBLE |
Voltage - Rated DC |
-20V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Current Rating |
-5.3A |
Number of Elements |
1 |
Power Dissipation-Max |
2.5W Tc |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
2.5W |
Output Current |
5.3A |
Mount |
Surface Mount |
Factory Lead Time |
12 Weeks |
Continuous Drain Current (ID) |
-5.3A |
Transistor Application |
SWITCHING |
Vgs(th) (Max) @ Id |
2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
860pF @ 10V |
Current - Continuous Drain (Id) @ 25°C |
5.3A Ta |
Gate Charge (Qg) (Max) @ Vgs |
25nC @ 10V |
Rise Time |
26ns |
Drain to Source Voltage (Vdss) |
20V |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±12V |
Fall Time (Typ) |
68 ns |
Turn-Off Delay Time |
100 ns |
Threshold Voltage |
-2.5V |
Gate to Source Voltage (Vgs) |
12V |
FET Type |
P-Channel |
Drain to Source Breakdown Voltage |
-20V |
Dual Supply Voltage |
-20V |
Recovery Time |
100 ns |
Nominal Vgs |
-2.5 V |
Height |
1.4986mm |
Length |
4.9784mm |
Width |
3.9878mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Rds On (Max) @ Id, Vgs |
60m Ω @ 5.3A, 10V |
Lead Free |
Contains Lead, Lead Free |
Infineon Technologies IRF7205TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
ECCN Code |
EAR99 |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
1997 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Operating Mode |
ENHANCEMENT MODE |
Number of Terminations |
8 |
Resistance |
70mOhm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
LOGIC LEVEL COMPATIBLE |
Voltage - Rated DC |
-30V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
-5.3A |
Time@Peak Reflow Temperature-Max (s) |
30 |
Number of Elements |
1 |
Power Dissipation-Max |
2.5W Tc |
Element Configuration |
Single |
Mount |
Surface Mount |
Factory Lead Time |
12 Weeks |
Turn-Off Delay Time |
97 ns |
Turn On Delay Time |
14 ns |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
70m Ω @ 4.6A, 10V |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
870pF @ 10V |
Current - Continuous Drain (Id) @ 25°C |
4.6A Ta |
Gate Charge (Qg) (Max) @ Vgs |
40nC @ 10V |
Rise Time |
21ns |
Drain to Source Voltage (Vdss) |
30V |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
71 ns |
Continuous Drain Current (ID) |
-4.6A |
Threshold Voltage |
-3V |
Power Dissipation |
2.5W |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
-30V |
Dual Supply Voltage |
-30V |
Recovery Time |
100 ns |
Nominal Vgs |
-3 V |
Height |
1.4986mm |
Length |
4.9784mm |
Width |
3.9878mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
FET Type |
P-Channel |
Lead Free |
Lead Free |
Infineon Technologies IRF7207PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Supplier Device Package |
8-SO |
Current - Continuous Drain (Id) @ 25℃ |
5.4A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
2.7V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
2.5W Tc |
Current Rating |
-5.4A |
Mount |
Surface Mount |
Packaging |
Tube |
Published |
2004 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Max Operating Temperature |
150°C |
Min Operating Temperature |
-55°C |
Voltage - Rated DC |
-20V |
Turn Off Delay Time |
43 ns |
Power Dissipation |
2.5W |
Continuous Drain Current (ID) |
-5.4A |
Threshold Voltage |
-700mV |
Rds On (Max) @ Id, Vgs |
60mOhm @ 5.4A, 4.5V |
Vgs(th) (Max) @ Id |
700mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
780pF @ 15V |
Gate Charge (Qg) (Max) @ Vgs |
22nC @ 4.5V |
Rise Time |
24ns |
Drain to Source Voltage (Vdss) |
20V |
Vgs (Max) |
±12V |
Fall Time (Typ) |
41 ns |
Turn On Delay Time |
11 ns |
FET Type |
P-Channel |
Gate to Source Voltage (Vgs) |
12V |
Drain to Source Breakdown Voltage |
-20V |
Input Capacitance |
780pF |
Drain to Source Resistance |
60mOhm |
Rds On Max |
60 mΩ |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRF7220GTRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Min Operating Temperature |
-55°C |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Supplier Device Package |
8-SO |
Current - Continuous Drain (Id) @ 25℃ |
11A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
2.5V 4.5V |
Power Dissipation (Max) |
2.5W Ta |
Operating Temperature |
-55°C~150°C TJ |
Number of Elements |
1 |
Packaging |
Tape & Reel (TR) |
Published |
2009 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Max Operating Temperature |
150°C |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Vgs (Max) |
±12V |
Fall Time (Typ) |
1.04 μs |
Rds On (Max) @ Id, Vgs |
12mOhm @ 11A, 4.5V |
Vgs(th) (Max) @ Id |
600mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
8075pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs |
125nC @ 5V |
Rise Time |
420ns |
Drain to Source Voltage (Vdss) |
14V |
Power Dissipation |
2.5W |
Element Configuration |
Single |
Continuous Drain Current (ID) |
11A |
Gate to Source Voltage (Vgs) |
12V |
Drain to Source Breakdown Voltage |
-14V |
Input Capacitance |
8.075nF |
Drain to Source Resistance |
12mOhm |
Rds On Max |
12 mΩ |
FET Type |
P-Channel |
RoHS Status |
RoHS Compliant |
Infineon Technologies IRF7240PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tube |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
10.5A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
2.5W Ta |
Terminal Position |
DUAL |
Operating Temperature |
-55°C~150°C TJ |
Published |
2005 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Mounting Type |
Surface Mount |
Factory Lead Time |
26 Weeks |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
JESD-30 Code |
R-PDSO-G8 |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
15m Ω @ 10.5A, 10V |
Input Capacitance (Ciss) (Max) @ Vds |
9250pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
110nC @ 10V |
Terminal Form |
GULL WING |
Drain to Source Voltage (Vdss) |
40V |
Vgs (Max) |
±20V |
JEDEC-95 Code |
MS-012AA |
Drain Current-Max (Abs) (ID) |
10.5A |
Drain-source On Resistance-Max |
0.015Ohm |
Pulsed Drain Current-Max (IDM) |
43A |
DS Breakdown Voltage-Min |
40V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies IRF7241TR
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tape & Reel (TR) |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
6.2A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
2.5W Ta |
Terminal Finish |
Matte Tin (Sn) |
Operating Temperature |
-55°C~150°C TJ |
Published |
2008 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Mounting Type |
Surface Mount |
Transistor Application |
SWITCHING |
Terminal Position |
DUAL |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PDSO-G8 |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
FET Type |
P-Channel |
Rds On (Max) @ Id, Vgs |
41m Ω @ 6.2A, 10V |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Additional Feature |
HIGH RELIABILITY |
Input Capacitance (Ciss) (Max) @ Vds |
3220pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
80nC @ 10V |
Drain to Source Voltage (Vdss) |
40V |
Vgs (Max) |
±20V |
JEDEC-95 Code |
MS-012AA |
Drain Current-Max (Abs) (ID) |
6.2A |
Terminal Form |
GULL WING |
RoHS Status |
Non-RoHS Compliant |
Infineon Technologies IRF7402TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Current Rating |
6.8A |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
6.8A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
2.7V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
2.5W Ta |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Turn Off Delay Time |
24 ns |
Published |
1999 |
Series |
HEXFET® |
Part Status |
Not For New Designs |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
Additional Feature |
FAST SWITCHING |
Voltage - Rated DC |
20V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Mount |
Surface Mount |
Factory Lead Time |
12 Weeks |
Fall Time (Typ) |
32 ns |
Continuous Drain Current (ID) |
6.8A |
Turn On Delay Time |
5.1 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
35m Ω @ 4.1A, 4.5V |
Vgs(th) (Max) @ Id |
700mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
650pF @ 15V |
Gate Charge (Qg) (Max) @ Vgs |
22nC @ 4.5V |
Rise Time |
47ns |
Vgs (Max) |
±12V |
Operating Mode |
ENHANCEMENT MODE |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Gate to Source Voltage (Vgs) |
12V |
Drain-source On Resistance-Max |
0.035Ohm |
Drain to Source Breakdown Voltage |
20V |
Pulsed Drain Current-Max (IDM) |
54A |
Height |
1.4986mm |
Length |
4.9784mm |
Width |
3.9878mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Power Dissipation |
2.5W |
Lead Free |
Contains Lead, Lead Free |