Showing 1885–1896 of 7598 results
Transistors - FETs/MOSFETs - Single
Infineon Technologies IRFB7537PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Operating Temperature |
-55°C~175°C TJ |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Weight |
6.000006g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
173A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
230W Tc |
Element Configuration |
Single |
Turn Off Delay Time |
82 ns |
Packaging |
Tube |
Published |
2008 |
Series |
HEXFET®, StrongIRFET™ |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of Channels |
1 |
Mount |
Through Hole |
Factory Lead Time |
12 Weeks |
Continuous Drain Current (ID) |
173A |
Power Dissipation |
230W |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
3.3m Ω @ 100A, 10V |
Vgs(th) (Max) @ Id |
3.7V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds |
7020pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
210nC @ 10V |
Rise Time |
105ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
84 ns |
Threshold Voltage |
3.7V |
JEDEC-95 Code |
TO-220AB |
Operating Mode |
ENHANCEMENT MODE |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
60V |
Pulsed Drain Current-Max (IDM) |
700A |
Avalanche Energy Rating (Eas) |
554 mJ |
Height |
16.51mm |
Length |
10.67mm |
Width |
4.83mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Turn On Delay Time |
15 ns |
Lead Free |
Lead Free |
Infineon Technologies IRFB812PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
3.6A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
78W Tc |
Power Dissipation |
78W |
Turn Off Delay Time |
24 ns |
Packaging |
Tube |
Published |
2008 |
Series |
HEXFET® |
Part Status |
Not For New Designs |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
Resistance |
2.2Ohm |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Mount |
Through Hole |
Factory Lead Time |
15 Weeks |
Threshold Voltage |
3V |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
2.2 Ω @ 2.2A, 10V |
Vgs(th) (Max) @ Id |
5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
810pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
20nC @ 10V |
Rise Time |
22ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
17 ns |
Continuous Drain Current (ID) |
3.6A |
JEDEC-95 Code |
TO-220AB |
Gate to Source Voltage (Vgs) |
20V |
Turn On Delay Time |
14 ns |
Drain to Source Breakdown Voltage |
500V |
Recovery Time |
110 ns |
Height |
16.51mm |
Length |
10.67mm |
Width |
4.83mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Transistor Application |
SWITCHING |
Lead Free |
Lead Free |
Infineon Technologies IRFH3702TR2PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
FET Type |
N-Channel |
Package / Case |
8-PowerVDFN |
Number of Pins |
8 |
Supplier Device Package |
8-PQFN (3×3) |
Current - Continuous Drain (Id) @ 25℃ |
16A Ta 42A Tc |
Number of Elements |
1 |
Turn Off Delay Time |
11 ns |
Packaging |
Cut Tape (CT) |
Series |
HEXFET® |
Part Status |
Obsolete |
Published |
2010 |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Resistance |
7.1MOhm |
Max Operating Temperature |
150°C |
Min Operating Temperature |
-55°C |
Max Power Dissipation |
2.8W |
Element Configuration |
Single |
Power Dissipation |
2.8W |
Turn On Delay Time |
9.6 ns |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Recovery Time |
26 ns |
Drain to Source Resistance |
7.1mOhm |
Gate Charge (Qg) (Max) @ Vgs |
14nC @ 4.5V |
Rise Time |
15ns |
Drain to Source Voltage (Vdss) |
30V |
Fall Time (Typ) |
5.8 ns |
Continuous Drain Current (ID) |
16A |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
30V |
Input Capacitance |
1.51nF |
Vgs(th) (Max) @ Id |
2.35V @ 25μA |
Rds On (Max) @ Id, Vgs |
7.1mOhm @ 16A, 10V |
Rds On Max |
7.1 mΩ |
Nominal Vgs |
1.8 V |
Height |
939.8μm |
Length |
2.9972mm |
Width |
2.9972mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds |
1510pF @ 15V |
Lead Free |
Lead Free |
Infineon Technologies IRFH3707TR2PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
FET Type |
N-Channel |
Package / Case |
8-PowerVDFN |
Number of Pins |
8 |
Supplier Device Package |
8-PQFN (3×3) |
Current - Continuous Drain (Id) @ 25℃ |
12A Ta 29A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
2.8W Ta |
Turn Off Delay Time |
9.9 ns |
Packaging |
Tape & Reel (TR) |
Published |
2010 |
Operating Temperature |
-55°C~150°C TJ |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Resistance |
12.4MOhm |
Max Operating Temperature |
150°C |
Min Operating Temperature |
-55°C |
Element Configuration |
Single |
Power Dissipation |
2.8W |
Turn On Delay Time |
7.8 ns |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Input Capacitance |
755pF |
Recovery Time |
30 ns |
Gate Charge (Qg) (Max) @ Vgs |
8.1nC @ 4.5V |
Rise Time |
11ns |
Drain to Source Voltage (Vdss) |
30V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
5.6 ns |
Continuous Drain Current (ID) |
12A |
Threshold Voltage |
1.8V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
30V |
Vgs(th) (Max) @ Id |
2.35V @ 25μA |
Rds On (Max) @ Id, Vgs |
12.4mOhm @ 12A, 10V |
Drain to Source Resistance |
12.4mOhm |
Rds On Max |
12.4 mΩ |
Nominal Vgs |
1.8 V |
Height |
939.8μm |
Length |
2.9972mm |
Width |
2.9972mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds |
755pF @ 15V |
Lead Free |
Lead Free |
Infineon Technologies IRFH4234TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Turn Off Delay Time |
8 ns |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
8-PowerTDFN |
Number of Pins |
5 |
Current - Continuous Drain (Id) @ 25℃ |
22A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation |
3.5W |
Contact Plating |
Copper, Silver, Tin |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Cut Tape (CT) |
Published |
2013 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Element Configuration |
Single |
Power Dissipation (Max) |
3.5W Ta 27W Tc |
Turn On Delay Time |
7.8 ns |
Continuous Drain Current (ID) |
22A |
Threshold Voltage |
1.6V |
Vgs(th) (Max) @ Id |
2.1V @ 25μA |
Input Capacitance (Ciss) (Max) @ Vds |
1011pF @ 13V |
Gate Charge (Qg) (Max) @ Vgs |
17nC @ 10V |
Rise Time |
30ns |
Drain to Source Voltage (Vdss) |
25V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
5.3 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
4.6m Ω @ 30A |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
60A |
Height |
900μm |
Length |
6mm |
Width |
5mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRFH5015TR2PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
FET Type |
N-Channel |
Package / Case |
8-PowerVDFN |
Number of Pins |
8 |
Supplier Device Package |
8-PQFN (5×6) |
Current - Continuous Drain (Id) @ 25℃ |
10A Ta 56A Tc |
Number of Elements |
1 |
Turn Off Delay Time |
14 ns |
Packaging |
Cut Tape (CT) |
Series |
HEXFET® |
Part Status |
Obsolete |
Published |
2013 |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Resistance |
31MOhm |
Max Operating Temperature |
150°C |
Min Operating Temperature |
-55°C |
Max Power Dissipation |
3.6W |
Element Configuration |
Single |
Power Dissipation |
3.6W |
Turn On Delay Time |
9.4 ns |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Input Capacitance |
2.3nF |
Recovery Time |
78 ns |
Gate Charge (Qg) (Max) @ Vgs |
50nC @ 10V |
Rise Time |
9.7ns |
Drain to Source Voltage (Vdss) |
150V |
Fall Time (Typ) |
3.4 ns |
Continuous Drain Current (ID) |
56A |
Threshold Voltage |
5V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
150V |
Vgs(th) (Max) @ Id |
5V @ 150μA |
Rds On (Max) @ Id, Vgs |
31mOhm @ 34A, 10V |
Drain to Source Resistance |
31mOhm |
Rds On Max |
31 mΩ |
Nominal Vgs |
5 V |
Height |
990.6μm |
Length |
6.1468mm |
Width |
5.15mm |
REACH SVHC |
No SVHC |
RoHS Status |
RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds |
2300pF @ 50V |
Lead Free |
Lead Free |
Infineon Technologies IRFH5020TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Case Connection |
DRAIN |
Mounting Type |
Surface Mount |
Package / Case |
8-PowerTDFN |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2012 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Number of Terminations |
5 |
ECCN Code |
EAR99 |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Resistance |
55MOhm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
HIGH RELIABILITY |
Terminal Position |
DUAL |
JESD-30 Code |
R-PDSO-N5 |
Number of Elements |
1 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Number of Channels |
1 |
Power Dissipation-Max |
3.6W Ta 8.3W Tc |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
3.6W |
Mount |
Surface Mount |
Factory Lead Time |
12 Weeks |
Threshold Voltage |
5V |
Gate to Source Voltage (Vgs) |
20V |
Rds On (Max) @ Id, Vgs |
55m Ω @ 7.5A, 10V |
Vgs(th) (Max) @ Id |
5V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds |
2290pF @ 100V |
Current - Continuous Drain (Id) @ 25°C |
5.1A Ta |
Gate Charge (Qg) (Max) @ Vgs |
54nC @ 10V |
Rise Time |
7.7ns |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
6 ns |
Turn-Off Delay Time |
21 ns |
Continuous Drain Current (ID) |
5.1A |
FET Type |
N-Channel |
Turn On Delay Time |
9.3 ns |
Drain Current-Max (Abs) (ID) |
43A |
Drain to Source Breakdown Voltage |
200V |
Pulsed Drain Current-Max (IDM) |
63A |
Avalanche Energy Rating (Eas) |
320 mJ |
Max Junction Temperature (Tj) |
150°C |
Height |
1.05mm |
Length |
6mm |
Width |
5mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Transistor Application |
SWITCHING |
Lead Free |
Lead Free |
Infineon Technologies IRFH5053TR2PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Turn On Delay Time |
8.6 ns |
Package / Case |
8-PowerVDFN |
Number of Pins |
8 |
Supplier Device Package |
PQFN (5×6) Single Die |
Current - Continuous Drain (Id) @ 25℃ |
9.3A Ta 46A Tc |
Number of Elements |
1 |
Turn Off Delay Time |
18 ns |
Published |
2008 |
Series |
HEXFET® |
Packaging |
Cut Tape (CT) |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Max Operating Temperature |
150°C |
Min Operating Temperature |
-55°C |
Max Power Dissipation |
3.1W |
Element Configuration |
Single |
Power Dissipation |
3.1W |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Drain to Source Breakdown Voltage |
100V |
Input Capacitance |
1.51nF |
Input Capacitance (Ciss) (Max) @ Vds |
1510pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
36nC @ 10V |
Rise Time |
7.5ns |
Drain to Source Voltage (Vdss) |
100V |
Fall Time (Typ) |
4.1 ns |
Continuous Drain Current (ID) |
9.3A |
Gate to Source Voltage (Vgs) |
20V |
Rds On (Max) @ Id, Vgs |
18mOhm @ 9.3A, 10V |
FET Type |
N-Channel |
Drain to Source Resistance |
18mOhm |
Rds On Max |
18 mΩ |
Height |
939.8μm |
Length |
5.9944mm |
Width |
5mm |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Vgs(th) (Max) @ Id |
4.9V @ 100μA |
Lead Free |
Lead Free |
Infineon Technologies IRFH5106TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Series |
HEXFET® |
Package / Case |
8-PowerVDFN |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
21A Ta 100A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
3.6W Ta 114W Tc |
Turn Off Delay Time |
23 ns |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Operating Mode |
ENHANCEMENT MODE |
Published |
2010 |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
5 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Terminal Position |
DUAL |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
JESD-30 Code |
R-PDSO-N5 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Threshold Voltage |
2V |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
5.6m Ω @ 50A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
3090pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
75nC @ 10V |
Rise Time |
13ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
9.5 ns |
Continuous Drain Current (ID) |
100A |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0056Ohm |
Power Dissipation |
114W |
Drain to Source Breakdown Voltage |
60V |
Pulsed Drain Current-Max (IDM) |
400A |
Avalanche Energy Rating (Eas) |
96 mJ |
Nominal Vgs |
2 V |
Height |
838.2μm |
Length |
5.9944mm |
Width |
5mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
RoHS Compliant |
Turn On Delay Time |
8.1 ns |
Lead Free |
Lead Free |
Infineon Technologies IRFH5204TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Configuration |
SINGLE WITH BUILT-IN DIODE |
Package / Case |
8-VQFN Exposed Pad |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
22A Ta 100A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
3.6W Ta 105W Tc |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Turn Off Delay Time |
18 ns |
Published |
2011 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
5 |
ECCN Code |
EAR99 |
Terminal Position |
DUAL |
JESD-30 Code |
R-PDSO-N5 |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Vgs (Max) |
±20V |
Fall Time (Typ) |
8.3 ns |
Turn On Delay Time |
8.4 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
4.3m Ω @ 50A, 10V |
Vgs(th) (Max) @ Id |
4V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds |
2460pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
65nC @ 10V |
Rise Time |
14ns |
Power Dissipation |
105W |
Operating Mode |
ENHANCEMENT MODE |
Continuous Drain Current (ID) |
22A |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0043Ohm |
Drain to Source Breakdown Voltage |
40V |
Pulsed Drain Current-Max (IDM) |
400A |
Nominal Vgs |
4 V |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
Case Connection |
DRAIN |
RoHS Status |
RoHS Compliant |