Showing 1957–1968 of 7598 results
Transistors - FETs/MOSFETs - Single
Infineon Technologies IRFPS37N50APBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Voltage - Rated DC |
500V |
Package / Case |
TO-274AA |
Number of Pins |
3 |
Supplier Device Package |
SUPER-247™ (TO-274AA) |
Current - Continuous Drain (Id) @ 25℃ |
36A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
446W Tc |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Bulk |
Series |
HEXFET® |
Part Status |
Not For New Designs |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Mounting Type |
Through Hole |
Power Dissipation |
446W |
Current Rating |
36A |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
130mOhm @ 22A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
5579pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
180nC @ 10V |
Rise Time |
98ns |
Drain to Source Voltage (Vdss) |
500V |
Vgs (Max) |
±30V |
Continuous Drain Current (ID) |
36A |
Drain to Source Breakdown Voltage |
500V |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRFR024NTRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Termination |
SMD/SMT |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2004 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Case Connection |
DRAIN |
Factory Lead Time |
12 Weeks |
ECCN Code |
EAR99 |
Resistance |
75mOhm |
Voltage - Rated DC |
55V |
Terminal Form |
GULL WING |
Current Rating |
17A |
JESD-30 Code |
R-PSSO-G2 |
Number of Elements |
1 |
Number of Channels |
1 |
Power Dissipation-Max |
45W Tc |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
38W |
Number of Terminations |
2 |
Turn On Delay Time |
4.9 ns |
JEDEC-95 Code |
TO-252AA |
Gate to Source Voltage (Vgs) |
20V |
Rds On (Max) @ Id, Vgs |
75m Ω @ 10A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
370pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
17A Tc |
Gate Charge (Qg) (Max) @ Vgs |
20nC @ 10V |
Rise Time |
34ns |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
27 ns |
Turn-Off Delay Time |
19 ns |
Continuous Drain Current (ID) |
17A |
Threshold Voltage |
4V |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Drain to Source Breakdown Voltage |
55V |
Pulsed Drain Current-Max (IDM) |
68A |
Dual Supply Voltage |
55V |
Recovery Time |
83 ns |
Max Junction Temperature (Tj) |
175°C |
Nominal Vgs |
4 V |
Height |
2.52mm |
Length |
6.7056mm |
Width |
6.22mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Contains Lead, Lead Free |
Infineon Technologies IRFR1010ZPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Series |
HEXFET® |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
42A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
140W Tc |
Turn Off Delay Time |
42 ns |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Element Configuration |
Single |
Factory Lead Time |
14 Weeks |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Voltage - Rated DC |
55V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
42A |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Published |
2004 |
Operating Mode |
ENHANCEMENT MODE |
Threshold Voltage |
4V |
JEDEC-95 Code |
TO-252AA |
Turn On Delay Time |
17 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
7.5m Ω @ 42A, 10V |
Vgs(th) (Max) @ Id |
4V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds |
2840pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
95nC @ 10V |
Rise Time |
76ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
48 ns |
Continuous Drain Current (ID) |
42A |
Power Dissipation |
140W |
Case Connection |
DRAIN |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0075Ohm |
Drain to Source Breakdown Voltage |
55V |
Dual Supply Voltage |
55V |
Avalanche Energy Rating (Eas) |
220 mJ |
Nominal Vgs |
4 V |
Height |
2.3876mm |
Length |
6.7056mm |
Width |
6.22mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRFR1205TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Termination |
SMD/SMT |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2004 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Power Dissipation |
69W |
Factory Lead Time |
12 Weeks |
ECCN Code |
EAR99 |
Resistance |
27mOhm |
Voltage - Rated DC |
55V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
37A |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Number of Elements |
1 |
Power Dissipation-Max |
107W Tc |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Number of Terminations |
2 |
Case Connection |
DRAIN |
Threshold Voltage |
4V |
JEDEC-95 Code |
TO-252AA |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
27m Ω @ 26A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1300pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
44A Tc |
Gate Charge (Qg) (Max) @ Vgs |
65nC @ 10V |
Rise Time |
69ns |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
60 ns |
Turn-Off Delay Time |
47 ns |
Continuous Drain Current (ID) |
37A |
Turn On Delay Time |
7.3 ns |
FET Type |
N-Channel |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
20A |
Drain to Source Breakdown Voltage |
55V |
Dual Supply Voltage |
55V |
Recovery Time |
98 ns |
Nominal Vgs |
4 V |
Height |
2.3876mm |
Length |
6.7056mm |
Width |
6.8mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Contains Lead, Lead Free |
Infineon Technologies IRFR12N25D
In stock
Manufacturer |
Infineon Technologies |
---|---|
Part Status |
Obsolete |
Current - Continuous Drain (Id) @ 25℃ |
14A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
144W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Published |
2001 |
Series |
HEXFET® |
Mounting Type |
Surface Mount |
ECCN Code |
EAR99 |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
260m Ω @ 8.4A, 10V |
Vgs(th) (Max) @ Id |
5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
810pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
35nC @ 10V |
Drain to Source Voltage (Vdss) |
250V |
Vgs (Max) |
±30V |
RoHS Status |
Non-RoHS Compliant |
Infineon Technologies IRFR13N20DPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Series |
HEXFET® |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
13A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
110W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Reach Compliance Code |
not_compliant |
Published |
2000 |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Surface Mount |
YES |
Mounting Type |
Surface Mount |
Input Capacitance (Ciss) (Max) @ Vds |
830pF @ 25V |
JESD-30 Code |
R-PSSO-G2 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
235m Ω @ 8A, 10V |
Vgs(th) (Max) @ Id |
5.5V @ 250μA |
Gate Charge (Qg) (Max) @ Vgs |
38nC @ 10V |
Drain to Source Voltage (Vdss) |
200V |
Time@Peak Reflow Temperature-Max (s) |
30 |
Vgs (Max) |
±30V |
JEDEC-95 Code |
TO-252AA |
Drain Current-Max (Abs) (ID) |
13A |
Drain-source On Resistance-Max |
0.235Ohm |
Pulsed Drain Current-Max (IDM) |
52A |
DS Breakdown Voltage-Min |
200V |
Avalanche Energy Rating (Eas) |
130 mJ |
Qualification Status |
Not Qualified |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies IRFR13N20DTR
In stock
Manufacturer |
Infineon Technologies |
---|---|
Series |
HEXFET® |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
13A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
110W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Reach Compliance Code |
not_compliant |
Published |
2000 |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Surface Mount |
YES |
Mounting Type |
Surface Mount |
Input Capacitance (Ciss) (Max) @ Vds |
830pF @ 25V |
JESD-30 Code |
R-PSSO-G2 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
235m Ω @ 8A, 10V |
Vgs(th) (Max) @ Id |
5.5V @ 250μA |
Gate Charge (Qg) (Max) @ Vgs |
38nC @ 10V |
Drain to Source Voltage (Vdss) |
200V |
Time@Peak Reflow Temperature-Max (s) |
30 |
Vgs (Max) |
±30V |
JEDEC-95 Code |
TO-252AA |
Drain Current-Max (Abs) (ID) |
13A |
Drain-source On Resistance-Max |
0.235Ohm |
Pulsed Drain Current-Max (IDM) |
52A |
DS Breakdown Voltage-Min |
200V |
Avalanche Energy Rating (Eas) |
130 mJ |
Qualification Status |
Not Qualified |
RoHS Status |
Non-RoHS Compliant |
Infineon Technologies IRFR220NPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Mounting Type |
Surface Mount |
Current - Continuous Drain (Id) @ 25℃ |
5A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
43W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Published |
2000 |
Series |
HEXFET® |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Reach Compliance Code |
not_compliant |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
600m Ω @ 2.9A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
300pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
23nC @ 10V |
Drain to Source Voltage (Vdss) |
200V |
Vgs (Max) |
±20V |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies IRFR220NTRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Series |
HEXFET® |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
5A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
43W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Reach Compliance Code |
not_compliant |
Published |
2000 |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Surface Mount |
YES |
Mounting Type |
Surface Mount |
Input Capacitance (Ciss) (Max) @ Vds |
300pF @ 25V |
JESD-30 Code |
R-PSSO-G2 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
600m Ω @ 2.9A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Gate Charge (Qg) (Max) @ Vgs |
23nC @ 10V |
Drain to Source Voltage (Vdss) |
200V |
Time@Peak Reflow Temperature-Max (s) |
30 |
Vgs (Max) |
±20V |
JEDEC-95 Code |
TO-252AA |
Drain Current-Max (Abs) (ID) |
5A |
Drain-source On Resistance-Max |
0.6Ohm |
Pulsed Drain Current-Max (IDM) |
20A |
DS Breakdown Voltage-Min |
200V |
Avalanche Energy Rating (Eas) |
46 mJ |
Qualification Status |
Not Qualified |
RoHS Status |
Non-RoHS Compliant |
Infineon Technologies IRFR220NTRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Turn On Delay Time |
6.4 ns |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2004 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Resistance |
600MOhm |
Termination |
SMD/SMT |
Voltage - Rated DC |
200V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
5A |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Number of Elements |
1 |
Number of Channels |
1 |
Power Dissipation-Max |
43W Tc |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
43W |
Case Connection |
DRAIN |
Contact Plating |
Tin |
Factory Lead Time |
12 Weeks |
Drain Current-Max (Abs) (ID) |
5A |
Drain to Source Breakdown Voltage |
200V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
300pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
5A Tc |
Gate Charge (Qg) (Max) @ Vgs |
23nC @ 10V |
Rise Time |
11ns |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
12 ns |
Turn-Off Delay Time |
20 ns |
Continuous Drain Current (ID) |
5A |
Threshold Voltage |
4V |
JEDEC-95 Code |
TO-252AA |
Gate to Source Voltage (Vgs) |
20V |
Transistor Application |
SWITCHING |
FET Type |
N-Channel |
Pulsed Drain Current-Max (IDM) |
20A |
Dual Supply Voltage |
200V |
Avalanche Energy Rating (Eas) |
46 mJ |
Recovery Time |
140 ns |
Max Junction Temperature (Tj) |
175°C |
Nominal Vgs |
4 V |
Switching Current |
5A |
Height |
2.52mm |
Length |
6.7056mm |
Width |
6.22mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Rds On (Max) @ Id, Vgs |
600m Ω @ 2.9A, 10V |
Lead Free |
Lead Free |
Infineon Technologies IRFR2405TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Mounting Type |
Surface Mount |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2000 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Qualification Status |
Not Qualified |
Factory Lead Time |
12 Weeks |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Part Status |
Active |
Number of Elements |
1 |
Gate Charge (Qg) (Max) @ Vgs |
110nC @ 10V |
Drain to Source Voltage (Vdss) |
55V |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
16m Ω @ 34A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
2430pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
56A Tc |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max |
110W Tc |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±20V |
JEDEC-95 Code |
TO-252AA |
Drain Current-Max (Abs) (ID) |
30A |
Drain-source On Resistance-Max |
0.016Ohm |
Pulsed Drain Current-Max (IDM) |
220A |
DS Breakdown Voltage-Min |
55V |
Avalanche Energy Rating (Eas) |
130 mJ |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies IRFR2407TRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Current Rating |
42A |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
42A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
110W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2000 |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Series |
HEXFET® |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Voltage - Rated DC |
75V |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Reach Compliance Code |
not_compliant |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Gate Charge (Qg) (Max) @ Vgs |
110nC @ 10V |
Rise Time |
90ns |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
26m Ω @ 25A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
2400pF @ 25V |
JESD-30 Code |
R-PSSO-G2 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
42A |
JEDEC-95 Code |
TO-252AA |
Drain Current-Max (Abs) (ID) |
30A |
Drain-source On Resistance-Max |
0.026Ohm |
Pulsed Drain Current-Max (IDM) |
170A |
Avalanche Energy Rating (Eas) |
130 mJ |
RoHS Status |
Non-RoHS Compliant |
Qualification Status |
Not Qualified |
Lead Free |
Contains Lead |