Transistors - FETs/MOSFETs - Single

Infineon Technologies IRFR2905ZTRLPBF

In stock

SKU: IRFR2905ZTRLPBF-11
Manufacturer

Infineon Technologies

Series

HEXFET®

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

42A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

110W Tc

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Reach Compliance Code

not_compliant

Published

2003

JESD-609 Code

e3

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Position

SINGLE

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Surface Mount

YES

Mounting Type

Surface Mount

Input Capacitance (Ciss) (Max) @ Vds

1380pF @ 25V

JESD-30 Code

R-PSSO-G2

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Case Connection

DRAIN

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

14.5m Ω @ 36A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Gate Charge (Qg) (Max) @ Vgs

44nC @ 10V

Drain to Source Voltage (Vdss)

55V

Time@Peak Reflow Temperature-Max (s)

30

Vgs (Max)

±20V

JEDEC-95 Code

TO-252AA

Drain Current-Max (Abs) (ID)

42A

Drain-source On Resistance-Max

0.0145Ohm

Pulsed Drain Current-Max (IDM)

240A

DS Breakdown Voltage-Min

55V

Avalanche Energy Rating (Eas)

82 mJ

Qualification Status

Not Qualified

RoHS Status

ROHS3 Compliant

Infineon Technologies IRFR2905ZTRPBF

In stock

SKU: IRFR2905ZTRPBF-11
Manufacturer

Infineon Technologies

ECCN Code

EAR99

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2010

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Case Connection

DRAIN

Number of Terminations

2

Resistance

14.5MOhm

Voltage - Rated DC

55V

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

42A

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Number of Elements

1

Power Dissipation-Max

110W Tc

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Power Dissipation

110W

Contact Plating

Tin

Factory Lead Time

12 Weeks

Threshold Voltage

4V

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

14.5m Ω @ 36A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1380pF @ 25V

Current - Continuous Drain (Id) @ 25°C

42A Tc

Gate Charge (Qg) (Max) @ Vgs

44nC @ 10V

Rise Time

66ns

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±20V

Fall Time (Typ)

35 ns

Turn-Off Delay Time

31 ns

Continuous Drain Current (ID)

59A

JEDEC-95 Code

TO-252AA

Gate to Source Voltage (Vgs)

20V

Turn On Delay Time

14 ns

Drain to Source Breakdown Voltage

55V

Pulsed Drain Current-Max (IDM)

240A

Avalanche Energy Rating (Eas)

82 mJ

Max Junction Temperature (Tj)

175°C

Nominal Vgs

4 V

Height

2.39mm

Length

6.7056mm

Width

6.22mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Transistor Application

SWITCHING

Lead Free

Contains Lead, Lead Free

Infineon Technologies IRFR3410PBF

In stock

SKU: IRFR3410PBF-11
Manufacturer

Infineon Technologies

Part Status

Discontinued

Mounting Type

Surface Mount

Current - Continuous Drain (Id) @ 25℃

31A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Power Dissipation (Max)

3W Ta 110W Tc

Operating Temperature

-55°C~175°C TJ

Packaging

Tube

Published

2004

Series

HEXFET®

Factory Lead Time

20 Weeks

ECCN Code

EAR99

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Reach Compliance Code

not_compliant

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

39m Ω @ 18A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1690pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

56nC @ 10V

Drain to Source Voltage (Vdss)

100V

Vgs (Max)

±20V

RoHS Status

ROHS3 Compliant

Infineon Technologies IRFR3410TRLPBF

In stock

SKU: IRFR3410TRLPBF-11
Manufacturer

Infineon Technologies

Published

2004

Mounting Type

Surface Mount

Surface Mount

YES

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

31A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

3W Ta 110W Tc

Operating Temperature

-55°C~175°C TJ

Peak Reflow Temperature (Cel)

260

Factory Lead Time

12 Weeks

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Position

SINGLE

Terminal Form

GULL WING

Packaging

Tape & Reel (TR)

Reach Compliance Code

not_compliant

Input Capacitance (Ciss) (Max) @ Vds

1690pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

56nC @ 10V

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Case Connection

DRAIN

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

39m Ω @ 18A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Drain to Source Voltage (Vdss)

100V

Vgs (Max)

±20V

JEDEC-95 Code

TO-252AA

Drain Current-Max (Abs) (ID)

30A

Drain-source On Resistance-Max

0.039Ohm

Pulsed Drain Current-Max (IDM)

125A

DS Breakdown Voltage-Min

100V

Avalanche Energy Rating (Eas)

140 mJ

RoHS Status

ROHS3 Compliant

Infineon Technologies IRFR3410TRRPBF

In stock

SKU: IRFR3410TRRPBF-11
Manufacturer

Infineon Technologies

Turn On Delay Time

12 ns

Number of Pins

3

Supplier Device Package

D-Pak

Current - Continuous Drain (Id) @ 25℃

31A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Power Dissipation (Max)

3W Ta 110W Tc

Turn Off Delay Time

40 ns

Packaging

Tape & Reel (TR)

Published

2004

Operating Temperature

-55°C~175°C TJ

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

175°C

Min Operating Temperature

-55°C

Element Configuration

Single

Power Dissipation

110W

Mounting Type

Surface Mount

Mount

Surface Mount

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

100V

Input Capacitance (Ciss) (Max) @ Vds

1690pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

56nC @ 10V

Rise Time

27ns

Drain to Source Voltage (Vdss)

100V

Vgs (Max)

±20V

Fall Time (Typ)

13 ns

Continuous Drain Current (ID)

31A

Rds On (Max) @ Id, Vgs

39mOhm @ 18A, 10V

FET Type

N-Channel

Input Capacitance

1.69nF

Drain to Source Resistance

39mOhm

Rds On Max

39 mΩ

Height

2.3876mm

Length

6.7056mm

Width

6.22mm

Radiation Hardening

No

Vgs(th) (Max) @ Id

4V @ 250μA

RoHS Status

RoHS Compliant

Infineon Technologies IRFR3418PBF

In stock

SKU: IRFR3418PBF-11
Manufacturer

Infineon Technologies

Mounting Type

Surface Mount

Supplier Device Package

D-Pak

Current - Continuous Drain (Id) @ 25℃

70A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Power Dissipation (Max)

3.8W Ta 140W Tc

Operating Temperature

-55°C~175°C TJ

Packaging

Tube

Published

2004

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

14mOhm @ 18A, 10V

Vgs(th) (Max) @ Id

5.5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

3510pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

94nC @ 10V

Drain to Source Voltage (Vdss)

80V

Vgs (Max)

±20V

Infineon Technologies IRFR3504ZTRPBF

In stock

SKU: IRFR3504ZTRPBF-11
Manufacturer

Infineon Technologies

ECCN Code

EAR99

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2005

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Current

42A

Number of Terminations

2

Resistance

9MOhm

Voltage - Rated DC

40V

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

42A

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Number of Elements

1

Voltage

40V

Power Dissipation-Max

90W Tc

Element Configuration

Single

Mount

Surface Mount

Factory Lead Time

12 Weeks

Vgs (Max)

±20V

Power Dissipation

90W

Turn On Delay Time

15 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

9m Ω @ 42A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1510pF @ 25V

Current - Continuous Drain (Id) @ 25°C

42A Tc

Gate Charge (Qg) (Max) @ Vgs

45nC @ 10V

Rise Time

74ns

Drive Voltage (Max Rds On,Min Rds On)

10V

Fall Time (Typ)

38 ns

Turn-Off Delay Time

30 ns

Operating Mode

ENHANCEMENT MODE

Continuous Drain Current (ID)

77A

JEDEC-95 Code

TO-252AA

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

40V

Avalanche Energy Rating (Eas)

77 mJ

Height

2.26mm

Length

6.7056mm

Width

6.22mm

Radiation Hardening

No

RoHS Status

ROHS3 Compliant

Case Connection

DRAIN

Lead Free

Lead Free

Infineon Technologies IRFR3704TRPBF

In stock

SKU: IRFR3704TRPBF-11
Manufacturer

Infineon Technologies

Packaging

Tape & Reel (TR)

Mounting Type

Surface Mount

Number of Pins

3

Supplier Device Package

D-Pak

Current - Continuous Drain (Id) @ 25℃

75A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Power Dissipation (Max)

90W Tc

Voltage - Rated DC

20V

Mount

Surface Mount

Published

2004

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

175°C

Min Operating Temperature

-55°C

Operating Temperature

-55°C~175°C TJ

Current Rating

75A

Vgs (Max)

±20V

Continuous Drain Current (ID)

75A

Rds On (Max) @ Id, Vgs

9.5mOhm @ 15A, 10V

Vgs(th) (Max) @ Id

3V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1996pF @ 10V

Gate Charge (Qg) (Max) @ Vgs

19nC @ 4.5V

Rise Time

98ns

Drain to Source Voltage (Vdss)

20V

Power Dissipation

90W

FET Type

N-Channel

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

20V

Input Capacitance

1.996nF

Drain to Source Resistance

14mOhm

Rds On Max

9.5 mΩ

RoHS Status

RoHS Compliant

Lead Free

Lead Free

Infineon Technologies IRFR3704ZPBF

In stock

SKU: IRFR3704ZPBF-11
Manufacturer

Infineon Technologies

ECCN Code

EAR99

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tube

Published

2004

Series

HEXFET®

JESD-609 Code

e3

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Case Connection

DRAIN

Contact Plating

Tin

Voltage - Rated DC

20V

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

60A

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Number of Elements

1

Power Dissipation-Max

48W Tc

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Power Dissipation

48W

Number of Terminations

2

Turn On Delay Time

41 ns

Threshold Voltage

2.1V

JEDEC-95 Code

TO-252AA

Rds On (Max) @ Id, Vgs

8.4m Ω @ 15A, 10V

Vgs(th) (Max) @ Id

2.55V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1190pF @ 10V

Current - Continuous Drain (Id) @ 25°C

60A Tc

Gate Charge (Qg) (Max) @ Vgs

14nC @ 4.5V

Rise Time

8.9ns

Drive Voltage (Max Rds On,Min Rds On)

4.5V 10V

Vgs (Max)

±20V

Fall Time (Typ)

12 ns

Turn-Off Delay Time

4.9 ns

Continuous Drain Current (ID)

60A

FET Type

N-Channel

Transistor Application

SWITCHING

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.0084Ohm

Drain to Source Breakdown Voltage

20V

Pulsed Drain Current-Max (IDM)

240A

Recovery Time

19 ns

Height

2.26mm

Length

6.73mm

Width

6.22mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

RoHS Compliant

Lead Free

Lead Free

Infineon Technologies IRFR3706PBF

In stock

SKU: IRFR3706PBF-11
Manufacturer

Infineon Technologies

Published

2004

Number of Pins

3

Supplier Device Package

D-Pak

Current - Continuous Drain (Id) @ 25℃

75A Tc

Drive Voltage (Max Rds On, Min Rds On)

2.8V 10V

Number of Elements

1

Power Dissipation (Max)

88W Tc

Turn Off Delay Time

17 ns

Operating Temperature

-55°C~175°C TJ

Power Dissipation

88W

Packaging

Tube

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Resistance

9MOhm

Max Operating Temperature

175°C

Min Operating Temperature

-55°C

Voltage - Rated DC

20V

Current Rating

75A

Element Configuration

Single

Mounting Type

Surface Mount

Mount

Surface Mount

Threshold Voltage

2V

FET Type

N-Channel

Vgs(th) (Max) @ Id

2V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2410pF @ 10V

Gate Charge (Qg) (Max) @ Vgs

35nC @ 4.5V

Rise Time

87ns

Drain to Source Voltage (Vdss)

20V

Vgs (Max)

±12V

Fall Time (Typ)

4.8 ns

Continuous Drain Current (ID)

75A

Gate to Source Voltage (Vgs)

12V

Drain to Source Breakdown Voltage

20V

Turn On Delay Time

6.8 ns

Dual Supply Voltage

20V

Input Capacitance

2.41nF

Drain to Source Resistance

11mOhm

Rds On Max

9 mΩ

Nominal Vgs

2 V

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

RoHS Compliant

Rds On (Max) @ Id, Vgs

9mOhm @ 15A, 10V

Lead Free

Lead Free

Infineon Technologies IRFR3707PBF

In stock

SKU: IRFR3707PBF-11
Manufacturer

Infineon Technologies

Packaging

Tube

Mounting Type

Surface Mount

Number of Pins

3

Supplier Device Package

D-Pak

Current - Continuous Drain (Id) @ 25℃

61A Tc

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Power Dissipation (Max)

87W Tc

Turn Off Delay Time

11.8 ns

Current Rating

61A

Mount

Surface Mount

Published

2004

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Resistance

13MOhm

Max Operating Temperature

175°C

Min Operating Temperature

-55°C

Voltage - Rated DC

30V

Operating Temperature

-55°C~175°C TJ

Element Configuration

Single

Vgs (Max)

±20V

Fall Time (Typ)

3.3 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

13mOhm @ 15A, 10V

Vgs(th) (Max) @ Id

3V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

1990pF @ 15V

Gate Charge (Qg) (Max) @ Vgs

19nC @ 4.5V

Rise Time

78ns

Drain to Source Voltage (Vdss)

30V

Power Dissipation

87W

Turn On Delay Time

8.5 ns

Continuous Drain Current (ID)

61A

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

30V

Input Capacitance

1.99nF

Drain to Source Resistance

17.5mOhm

Rds On Max

13 mΩ

Radiation Hardening

No

RoHS Status

RoHS Compliant

Lead Free

Lead Free

Infineon Technologies IRFR3707ZTRPBF

In stock

SKU: IRFR3707ZTRPBF-11
Manufacturer

Infineon Technologies

Termination

SMD/SMT

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2008

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Power Dissipation

50W

Factory Lead Time

12 Weeks

ECCN Code

EAR99

Resistance

9.5MOhm

Voltage - Rated DC

30V

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

56A

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Number of Elements

1

Power Dissipation-Max

50W Tc

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Number of Terminations

2

Case Connection

DRAIN

Threshold Voltage

1.8V

JEDEC-95 Code

TO-252AA

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

9.5m Ω @ 15A, 10V

Vgs(th) (Max) @ Id

2.25V @ 25μA

Input Capacitance (Ciss) (Max) @ Vds

1150pF @ 15V

Current - Continuous Drain (Id) @ 25°C

56A Tc

Gate Charge (Qg) (Max) @ Vgs

14nC @ 4.5V

Rise Time

11ns

Drive Voltage (Max Rds On,Min Rds On)

4.5V 10V

Vgs (Max)

±20V

Fall Time (Typ)

3.3 ns

Turn-Off Delay Time

12 ns

Continuous Drain Current (ID)

56A

Turn On Delay Time

8 ns

FET Type

N-Channel

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

30V

Pulsed Drain Current-Max (IDM)

220A

Dual Supply Voltage

30V

Avalanche Energy Rating (Eas)

42 mJ

Nominal Vgs

1.8 V

Height

2.26mm

Length

6.7056mm

Width

6.22mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Contains Lead, Lead Free