Showing 1993–2004 of 7598 results
Transistors - FETs/MOSFETs - Single
Infineon Technologies IRFR7540TRLPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Current - Continuous Drain (Id) @ 25℃ |
90A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Power Dissipation (Max) |
140W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2013 |
Series |
HEXFET®, StrongIRFET™ |
JESD-609 Code |
e3 |
Part Status |
Not For New Designs |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Reach Compliance Code |
not_compliant |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
4.8m Ω @ 66A, 10V |
Vgs(th) (Max) @ Id |
3.7V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds |
4360pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
130nC @ 10V |
Drain to Source Voltage (Vdss) |
60V |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
90A |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRFR7546TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tape & Reel (TR) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Weight |
3.949996g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
56A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
99W Tc |
Turn Off Delay Time |
36 ns |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Factory Lead Time |
12 Weeks |
Published |
2007 |
Series |
StrongIRFET™ |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
not_compliant |
Operating Temperature |
-55°C~175°C TJ |
JESD-30 Code |
R-PSSO-G2 |
Drain to Source Voltage (Vdss) |
60V |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
Turn On Delay Time |
8.1 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
7.9m Ω @ 43A, 10V |
Vgs(th) (Max) @ Id |
3.7V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds |
3020pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
87nC @ 10V |
Rise Time |
28ns |
Number of Channels |
1 |
Element Configuration |
Single |
Fall Time (Typ) |
20 ns |
Continuous Drain Current (ID) |
56A |
Threshold Voltage |
3.7V |
JEDEC-95 Code |
TO-252AA |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0079Ohm |
Pulsed Drain Current-Max (IDM) |
280A |
DS Breakdown Voltage-Min |
60V |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRFR7740TRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Packaging |
Tape & Reel (TR) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Weight |
3.949996g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
87A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
140W Tc |
Turn Off Delay Time |
55 ns |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Factory Lead Time |
12 Weeks |
Published |
2004 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
not_compliant |
Operating Temperature |
-55°C~175°C TJ |
JESD-30 Code |
R-PSSO-G2 |
Drain to Source Voltage (Vdss) |
75V |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
Turn On Delay Time |
10 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
7.2m Ω @ 52A, 10V |
Vgs(th) (Max) @ Id |
3.7V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds |
4430pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
126nC @ 10V |
Rise Time |
36ns |
Number of Channels |
1 |
Element Configuration |
Single |
Fall Time (Typ) |
30 ns |
Continuous Drain Current (ID) |
87A |
Threshold Voltage |
3.7V |
JEDEC-95 Code |
TO-252AA |
Gate to Source Voltage (Vgs) |
20V |
Drain-source On Resistance-Max |
0.0072Ohm |
DS Breakdown Voltage-Min |
75V |
Avalanche Energy Rating (Eas) |
242 mJ |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Infineon Technologies IRFR812PBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Operating Mode |
ENHANCEMENT MODE |
Number of Pins |
3 |
Current - Continuous Drain (Id) @ 25℃ |
3.6A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
78W Tc |
Turn Off Delay Time |
24 ns |
Packaging |
Tube |
Published |
2004 |
Operating Temperature |
-55°C~150°C TJ |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Reach Compliance Code |
not_compliant |
Element Configuration |
Single |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Continuous Drain Current (ID) |
3.6A |
Threshold Voltage |
3V |
Rds On (Max) @ Id, Vgs |
2.2 Ω @ 2.2A, 10V |
Vgs(th) (Max) @ Id |
5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
810pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
20nC @ 10V |
Rise Time |
22ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
17 ns |
Turn On Delay Time |
14 ns |
Power Dissipation |
78W |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
500V |
Recovery Time |
110 ns |
Height |
2.39mm |
Length |
6.73mm |
Width |
6.22mm |
REACH SVHC |
No SVHC |
FET Type |
N-Channel |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies IRFR9024NPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Series |
HEXFET® |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
11A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
38W Tc |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tube |
Reach Compliance Code |
not_compliant |
Published |
1997 |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Surface Mount |
YES |
Mounting Type |
Surface Mount |
Input Capacitance (Ciss) (Max) @ Vds |
350pF @ 25V |
JESD-30 Code |
R-PSSO-G2 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
175m Ω @ 6.6A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Gate Charge (Qg) (Max) @ Vgs |
19nC @ 10V |
Drain to Source Voltage (Vdss) |
55V |
Time@Peak Reflow Temperature-Max (s) |
30 |
Vgs (Max) |
±20V |
JEDEC-95 Code |
TO-252AA |
Drain Current-Max (Abs) (ID) |
11A |
Drain-source On Resistance-Max |
0.175Ohm |
Pulsed Drain Current-Max (IDM) |
44A |
DS Breakdown Voltage-Min |
55V |
Avalanche Energy Rating (Eas) |
62 mJ |
Qualification Status |
Not Qualified |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies IRFR9024NTRRPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Series |
HEXFET® |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
11A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Power Dissipation (Max) |
38W Tc |
Turn Off Delay Time |
23 ns |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Mount |
Surface Mount |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Published |
2004 |
Operating Mode |
ENHANCEMENT MODE |
Vgs (Max) |
±20V |
Fall Time (Typ) |
37 ns |
Turn On Delay Time |
13 ns |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
175m Ω @ 6.6A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
350pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
19nC @ 10V |
Rise Time |
55ns |
Drain to Source Voltage (Vdss) |
55V |
Power Dissipation |
38W |
Case Connection |
DRAIN |
Continuous Drain Current (ID) |
-11A |
JEDEC-95 Code |
TO-252AA |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
-55V |
Pulsed Drain Current-Max (IDM) |
44A |
Avalanche Energy Rating (Eas) |
62 mJ |
Height |
2.3876mm |
Length |
6.7056mm |
Width |
6.22mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies IRFR9120NPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Peak Reflow Temperature (Cel) |
260 |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
6.6A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
40W Tc |
Operating Temperature |
-55°C~150°C TJ |
Published |
1998 |
Series |
HEXFET® |
Packaging |
Tube |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
HTS Code |
8541.29.00.95 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Mounting Type |
Surface Mount |
Factory Lead Time |
20 Weeks |
Input Capacitance (Ciss) (Max) @ Vds |
350pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
27nC @ 10V |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
480m Ω @ 3.9A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Time@Peak Reflow Temperature-Max (s) |
30 |
Reach Compliance Code |
not_compliant |
Drain to Source Voltage (Vdss) |
100V |
Vgs (Max) |
±20V |
JEDEC-95 Code |
TO-252AA |
Drain Current-Max (Abs) (ID) |
6.6A |
Drain-source On Resistance-Max |
0.48Ohm |
Pulsed Drain Current-Max (IDM) |
26A |
DS Breakdown Voltage-Min |
100V |
Avalanche Energy Rating (Eas) |
100 mJ |
JESD-30 Code |
R-PSSO-G2 |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies IRFR9120NTRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Series |
HEXFET® |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
6.6A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
40W Tc |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Reach Compliance Code |
not_compliant |
Published |
1998 |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Surface Mount |
YES |
Mounting Type |
Surface Mount |
Input Capacitance (Ciss) (Max) @ Vds |
350pF @ 25V |
JESD-30 Code |
R-PSSO-G2 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
480m Ω @ 3.9A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Gate Charge (Qg) (Max) @ Vgs |
27nC @ 10V |
Drain to Source Voltage (Vdss) |
100V |
Time@Peak Reflow Temperature-Max (s) |
30 |
Vgs (Max) |
±20V |
JEDEC-95 Code |
TO-252AA |
Drain Current-Max (Abs) (ID) |
6.6A |
Drain-source On Resistance-Max |
0.48Ohm |
Pulsed Drain Current-Max (IDM) |
26A |
DS Breakdown Voltage-Min |
100V |
Avalanche Energy Rating (Eas) |
100 mJ |
Qualification Status |
Not Qualified |
RoHS Status |
Non-RoHS Compliant |
Infineon Technologies IRFR9N20DPBF
In stock
Manufacturer |
Infineon Technologies |
---|---|
Published |
2000 |
Mounting Type |
Surface Mount |
Surface Mount |
YES |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
9.4A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
86W Tc |
Operating Temperature |
-55°C~175°C TJ |
Peak Reflow Temperature (Cel) |
260 |
Factory Lead Time |
14 Weeks |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Packaging |
Tube |
Reach Compliance Code |
not_compliant |
Input Capacitance (Ciss) (Max) @ Vds |
560pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
27nC @ 10V |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
380m Ω @ 5.6A, 10V |
Vgs(th) (Max) @ Id |
5.5V @ 250μA |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Drain to Source Voltage (Vdss) |
200V |
Vgs (Max) |
±30V |
JEDEC-95 Code |
TO-252AA |
Drain Current-Max (Abs) (ID) |
9.4A |
Drain-source On Resistance-Max |
0.38Ohm |
Pulsed Drain Current-Max (IDM) |
38A |
DS Breakdown Voltage-Min |
200V |
Avalanche Energy Rating (Eas) |
100 mJ |
RoHS Status |
ROHS3 Compliant |
Infineon Technologies IRFR9N20DTRL
In stock
Manufacturer |
Infineon Technologies |
---|---|
Reach Compliance Code |
not_compliant |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
9.4A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
86W Tc |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Published |
2000 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Voltage - Rated DC |
200V |
Terminal Position |
SINGLE |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Mounting Type |
Surface Mount |
Mount |
Surface Mount |
Input Capacitance (Ciss) (Max) @ Vds |
560pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
27nC @ 10V |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
380m Ω @ 5.6A, 10V |
Vgs(th) (Max) @ Id |
5.5V @ 250μA |
Time@Peak Reflow Temperature-Max (s) |
30 |
Current Rating |
9.4A |
Rise Time |
16ns |
Vgs (Max) |
±30V |
Continuous Drain Current (ID) |
9.4A |
JEDEC-95 Code |
TO-252AA |
Drain-source On Resistance-Max |
0.38Ohm |
Pulsed Drain Current-Max (IDM) |
38A |
Avalanche Energy Rating (Eas) |
100 mJ |
RoHS Status |
Non-RoHS Compliant |
JESD-30 Code |
R-PSSO-G2 |
Lead Free |
Contains Lead |
Infineon Technologies IRFS17N20DTRLP
In stock
Manufacturer |
Infineon Technologies |
---|---|
Turn Off Delay Time |
18 ns |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Supplier Device Package |
D2PAK |
Current - Continuous Drain (Id) @ 25℃ |
16A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Max Operating Temperature |
175°C |
Mount |
Surface Mount |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2004 |
Series |
HEXFET® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Power Dissipation (Max) |
3.8W Ta 140W Tc |
Min Operating Temperature |
-55°C |
Drain to Source Voltage (Vdss) |
200V |
Vgs (Max) |
±30V |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
170mOhm @ 9.8A, 10V |
Vgs(th) (Max) @ Id |
5.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1100pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
50nC @ 10V |
Rise Time |
19ns |
Element Configuration |
Single |
Power Dissipation |
140W |
Fall Time (Typ) |
6.6 ns |
Continuous Drain Current (ID) |
16A |
Gate to Source Voltage (Vgs) |
30V |
Drain to Source Breakdown Voltage |
200V |
Input Capacitance |
1.1nF |
Rds On Max |
170 mΩ |
RoHS Status |
RoHS Compliant |
Infineon Technologies IRFS23N20DTRLP
In stock
Manufacturer |
Infineon Technologies |
---|---|
Termination |
SMD/SMT |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2004 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Not For New Designs |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Power Dissipation |
3.8W |
Factory Lead Time |
14 Weeks |
ECCN Code |
EAR99 |
Resistance |
100mOhm |
Voltage - Rated DC |
200V |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
24A |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PSSO-G2 |
Number of Elements |
1 |
Power Dissipation-Max |
3.8W Ta 170W Tc |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Number of Terminations |
2 |
Case Connection |
DRAIN |
Continuous Drain Current (ID) |
24A |
Threshold Voltage |
5.5V |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
100m Ω @ 14A, 10V |
Vgs(th) (Max) @ Id |
5.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1960pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
24A Tc |
Gate Charge (Qg) (Max) @ Vgs |
86nC @ 10V |
Rise Time |
32ns |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±30V |
Fall Time (Typ) |
16 ns |
Turn-Off Delay Time |
26 ns |
Turn On Delay Time |
14 ns |
FET Type |
N-Channel |
Gate to Source Voltage (Vgs) |
30V |
Drain to Source Breakdown Voltage |
200V |
Pulsed Drain Current-Max (IDM) |
96A |
Dual Supply Voltage |
200V |
Avalanche Energy Rating (Eas) |
250 mJ |
Nominal Vgs |
5.5 V |
Height |
4.826mm |
Length |
10.668mm |
Width |
9.65mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Contains Lead, Lead Free |