Transistors - FETs/MOSFETs - Single

Infineon Technologies IRFS4127TRLPBF

In stock

SKU: IRFS4127TRLPBF-11
Manufacturer

Infineon Technologies

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2008

Series

HEXFET®

JESD-609 Code

e3

Element Configuration

Single

Factory Lead Time

12 Weeks

Number of Terminations

2

ECCN Code

EAR99

Resistance

22MOhm

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Qualification Status

Not Qualified

Number of Elements

1

Power Dissipation-Max

375W Tc

Part Status

Active

Operating Mode

ENHANCEMENT MODE

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±20V

Turn On Delay Time

17 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

22m Ω @ 44A, 10V

Vgs(th) (Max) @ Id

5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

5380pF @ 50V

Current - Continuous Drain (Id) @ 25°C

72A Tc

Gate Charge (Qg) (Max) @ Vgs

150nC @ 10V

Rise Time

18ns

Power Dissipation

375W

Case Connection

DRAIN

Fall Time (Typ)

22 ns

Turn-Off Delay Time

56 ns

Continuous Drain Current (ID)

72A

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

200V

Avalanche Energy Rating (Eas)

250 mJ

Height

4.826mm

Length

10.668mm

Width

9.652mm

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies IRFS41N15DPBF

In stock

SKU: IRFS41N15DPBF-11
Manufacturer

Infineon Technologies

Published

2003

Surface Mount

YES

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

41A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

3.1W Ta

Operating Temperature

-55°C~175°C TJ

Terminal Form

GULL WING

Mounting Type

Surface Mount

Series

HEXFET®

JESD-609 Code

e3

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Additional Feature

AVALANCHE RATED

Terminal Position

SINGLE

Packaging

Tube

Peak Reflow Temperature (Cel)

260

Vgs(th) (Max) @ Id

5.5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2520pF @ 25V

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Case Connection

DRAIN

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

45m Ω @ 25A, 10V

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Gate Charge (Qg) (Max) @ Vgs

110nC @ 10V

Drain to Source Voltage (Vdss)

150V

Vgs (Max)

±30V

Drain Current-Max (Abs) (ID)

41A

Drain-source On Resistance-Max

0.045Ohm

Pulsed Drain Current-Max (IDM)

164A

DS Breakdown Voltage-Min

150V

Avalanche Energy Rating (Eas)

470 mJ

RoHS Status

ROHS3 Compliant

Infineon Technologies IRFS4227PBF

In stock

SKU: IRFS4227PBF-11
Manufacturer

Infineon Technologies

JESD-609 Code

e3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

62A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

330W Tc

Turn Off Delay Time

21 ns

Operating Temperature

-40°C~175°C TJ

Packaging

Tube

Published

2005

Power Dissipation

330W

Series

HEXFET®

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

Termination

SMD/SMT

ECCN Code

EAR99

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Mounting Type

Surface Mount

Mount

Surface Mount

Gate to Source Voltage (Vgs)

30V

Turn On Delay Time

33 ns

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

26m Ω @ 46A, 10V

Vgs(th) (Max) @ Id

5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

4600pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

98nC @ 10V

Rise Time

20ns

Vgs (Max)

±30V

Fall Time (Typ)

31 ns

Continuous Drain Current (ID)

62A

Threshold Voltage

5V

Drain-source On Resistance-Max

0.026Ohm

Drain to Source Breakdown Voltage

200V

Case Connection

DRAIN

Pulsed Drain Current-Max (IDM)

260A

Dual Supply Voltage

240V

Recovery Time

150 ns

Nominal Vgs

5 V

Height

4.826mm

Length

10.67mm

Width

9.65mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

FET Type

N-Channel

Lead Free

Lead Free

Infineon Technologies IRFS4227TRLPBF

In stock

SKU: IRFS4227TRLPBF-11
Manufacturer

Infineon Technologies

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-40°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2004

Series

HEXFET®

JESD-609 Code

e3

Power Dissipation-Max

330W Tc

Factory Lead Time

12 Weeks

Number of Terminations

2

ECCN Code

EAR99

Resistance

26MOhm

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

not_compliant

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Qualification Status

Not Qualified

Number of Elements

1

Part Status

Active

Element Configuration

Single

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±30V

Case Connection

DRAIN

Turn On Delay Time

33 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

26m Ω @ 46A, 10V

Vgs(th) (Max) @ Id

5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

4600pF @ 25V

Current - Continuous Drain (Id) @ 25°C

62A Tc

Gate Charge (Qg) (Max) @ Vgs

98nC @ 10V

Rise Time

20ns

Operating Mode

ENHANCEMENT MODE

Power Dissipation

330W

Fall Time (Typ)

31 ns

Turn-Off Delay Time

21 ns

Continuous Drain Current (ID)

62A

Gate to Source Voltage (Vgs)

30V

Drain to Source Breakdown Voltage

200V

Pulsed Drain Current-Max (IDM)

260A

Height

4.826mm

Length

10.668mm

Width

9.65mm

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies IRFS4229PBF

In stock

SKU: IRFS4229PBF-11
Manufacturer

Infineon Technologies

Packaging

Tube

Mounting Type

Surface Mount

Number of Pins

3

Current - Continuous Drain (Id) @ 25℃

45A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

330W Tc

Turn Off Delay Time

30 ns

Power Dissipation

330W

Mount

Surface Mount

Published

2008

Series

HEXFET®

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

SMD/SMT

ECCN Code

EAR99

Element Configuration

Single

Operating Temperature

-40°C~175°C TJ

Turn On Delay Time

18 ns

Drain to Source Breakdown Voltage

250V

Dual Supply Voltage

250V

Vgs(th) (Max) @ Id

5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

4560pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

110nC @ 10V

Vgs (Max)

±30V

Continuous Drain Current (ID)

45A

Threshold Voltage

5V

Gate to Source Voltage (Vgs)

30V

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

48m Ω @ 26A, 10V

Recovery Time

290 ns

Nominal Vgs

5 V

Height

4.572mm

Length

10.67mm

Width

9.65mm

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies IRFS4321-7PPBF

In stock

SKU: IRFS4321-7PPBF-11
Manufacturer

Infineon Technologies

Published

2013

Mounting Type

Surface Mount

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

86A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

350W Tc

Operating Temperature

-55°C~175°C TJ

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Mount

Surface Mount

Series

HEXFET®

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

6

ECCN Code

EAR99

Terminal Position

SINGLE

Terminal Form

GULL WING

Packaging

Tube

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Gate Charge (Qg) (Max) @ Vgs

110nC @ 10V

Drain to Source Voltage (Vdss)

150V

Operating Mode

ENHANCEMENT MODE

Case Connection

DRAIN

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

14.7m Ω @ 34A, 10V

Vgs(th) (Max) @ Id

5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

4460pF @ 50V

JESD-30 Code

R-PSSO-G6

Configuration

SINGLE WITH BUILT-IN DIODE

Vgs (Max)

±20V

Continuous Drain Current (ID)

86A

Drain-source On Resistance-Max

0.0147Ohm

Pulsed Drain Current-Max (IDM)

343A

DS Breakdown Voltage-Min

150V

Avalanche Energy Rating (Eas)

120 mJ

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies IRFS4321TRL7PP

In stock

SKU: IRFS4321TRL7PP-11
Manufacturer

Infineon Technologies

Turn Off Delay Time

25 ns

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

7

Weight

1.59999g

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

86A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

JESD-30 Code

R-PSSO-G6

Factory Lead Time

12 Weeks

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2013

Series

HEXFET®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

6

ECCN Code

EAR99

Terminal Form

GULL WING

Power Dissipation (Max)

350W Tc

Number of Channels

1

Rise Time

60ns

Drain to Source Voltage (Vdss)

150V

Case Connection

DRAIN

Turn On Delay Time

18 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

14.7m Ω @ 34A, 10V

Vgs(th) (Max) @ Id

5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

4460pF @ 50V

Gate Charge (Qg) (Max) @ Vgs

110nC @ 10V

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Vgs (Max)

±30V

Fall Time (Typ)

35 ns

Continuous Drain Current (ID)

86A

Threshold Voltage

5V

Gate to Source Voltage (Vgs)

30V

Pulsed Drain Current-Max (IDM)

343A

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies IRFS4321TRLPBF

In stock

SKU: IRFS4321TRLPBF-11
Manufacturer

Infineon Technologies

Resistance

15MOhm

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Supplier Device Package

D2PAK

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2010

Series

HEXFET®

Part Status

Active

Vgs(th) (Max) @ Id

5V @ 250μA

Factory Lead Time

12 Weeks

Max Operating Temperature

175°C

Min Operating Temperature

-55°C

Number of Elements

1

Number of Channels

1

Power Dissipation-Max

350W Tc

Element Configuration

Single

Power Dissipation

350W

Turn On Delay Time

18 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

15mOhm @ 33A, 10V

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Input Capacitance (Ciss) (Max) @ Vds

4460pF @ 25V

Drain to Source Breakdown Voltage

150V

Input Capacitance

4.46nF

Rise Time

60ns

Drain to Source Voltage (Vdss)

150V

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±30V

Fall Time (Typ)

35 ns

Turn-Off Delay Time

25 ns

Continuous Drain Current (ID)

85A

Threshold Voltage

5V

Gate to Source Voltage (Vgs)

30V

Current - Continuous Drain (Id) @ 25°C

85A Tc

Gate Charge (Qg) (Max) @ Vgs

110nC @ 10V

Max Junction Temperature (Tj)

175°C

Drain to Source Resistance

12mOhm

Rds On Max

15 mΩ

Nominal Vgs

5 V

Height

5.084mm

Length

10.668mm

Width

9.65mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies IRFS4410TRLPBF

In stock

SKU: IRFS4410TRLPBF-11
Manufacturer

Infineon Technologies

Power Dissipation

200W

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2007

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Resistance

10MOhm

Number of Terminations

2

Voltage - Rated DC

100V

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

96A

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Number of Elements

1

Number of Channels

1

Power Dissipation-Max

200W Tc

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Mount

Surface Mount

Factory Lead Time

12 Weeks

Continuous Drain Current (ID)

96A

Threshold Voltage

4V

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

10m Ω @ 58A, 10V

Vgs(th) (Max) @ Id

4V @ 150μA

Input Capacitance (Ciss) (Max) @ Vds

5150pF @ 50V

Current - Continuous Drain (Id) @ 25°C

88A Tc

Gate Charge (Qg) (Max) @ Vgs

180nC @ 10V

Rise Time

80ns

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±20V

Fall Time (Typ)

50 ns

Turn-Off Delay Time

55 ns

Turn On Delay Time

24 ns

Case Connection

DRAIN

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

75A

Drain to Source Breakdown Voltage

100V

Avalanche Energy Rating (Eas)

220 mJ

Nominal Vgs

4 V

Height

4.826mm

Length

10.668mm

Width

9.65mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

FET Type

N-Channel

Lead Free

Contains Lead

Infineon Technologies IRFS4410ZTRLPBF

In stock

SKU: IRFS4410ZTRLPBF-11
Manufacturer

Infineon Technologies

Qualification Status

Not Qualified

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2008

Series

HEXFET®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

JESD-609 Code

e3

Number of Terminations

2

ECCN Code

EAR99

Resistance

9MOhm

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

Base Part Number

IRFS4410

JESD-30 Code

R-PSSO-G2

Mount

Surface Mount

Factory Lead Time

12 Weeks

Current - Continuous Drain (Id) @ 25°C

97A Tc

Gate Charge (Qg) (Max) @ Vgs

120nC @ 10V

Operating Mode

ENHANCEMENT MODE

Power Dissipation

230W

Case Connection

DRAIN

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

9m Ω @ 58A, 10V

Vgs(th) (Max) @ Id

4V @ 150μA

Input Capacitance (Ciss) (Max) @ Vds

4820pF @ 50V

Power Dissipation-Max

230W Tc

Number of Elements

1

Rise Time

52ns

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±20V

Fall Time (Typ)

57 ns

Continuous Drain Current (ID)

97A

Drain to Source Breakdown Voltage

100V

Avalanche Energy Rating (Eas)

242 mJ

RoHS Status

ROHS3 Compliant

Element Configuration

Single

Lead Free

Lead Free

Infineon Technologies IRFS4510TRLPBF

In stock

SKU: IRFS4510TRLPBF-11
Manufacturer

Infineon Technologies

Operating Temperature

-55°C~175°C TJ

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

61A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

140W Tc

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Factory Lead Time

12 Weeks

Packaging

Tape & Reel (TR)

Published

2012

Series

HEXFET®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Position

SINGLE

Terminal Form

GULL WING

Turn Off Delay Time

28 ns

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Input Capacitance (Ciss) (Max) @ Vds

3180pF @ 50V

Gate Charge (Qg) (Max) @ Vgs

87nC @ 10V

Operating Mode

ENHANCEMENT MODE

Power Dissipation

140W

Case Connection

DRAIN

Turn On Delay Time

13 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

13.9m Ω @ 37A, 10V

Vgs(th) (Max) @ Id

4V @ 100μA

JESD-30 Code

R-PSSO-G2

Configuration

SINGLE WITH BUILT-IN DIODE

Rise Time

32ns

Vgs (Max)

±20V

Continuous Drain Current (ID)

61A

Threshold Voltage

2V

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

100V

Pulsed Drain Current-Max (IDM)

250A

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies IRFS4610PBF

In stock

SKU: IRFS4610PBF-11
Manufacturer

Infineon Technologies

Series

HEXFET®

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

73A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

190W Tc

Turn Off Delay Time

53 ns

Operating Temperature

-55°C~175°C TJ

Packaging

Tube

Power Dissipation

190W

Published

2006

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

Resistance

14mOhm

Voltage - Rated DC

100V

Terminal Form

GULL WING

Current Rating

73A

JESD-30 Code

R-PSSO-G2

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Mounting Type

Surface Mount

Mount

Surface Mount

Gate to Source Voltage (Vgs)

20V

Turn On Delay Time

18 ns

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

14m Ω @ 44A, 10V

Vgs(th) (Max) @ Id

4V @ 100μA

Input Capacitance (Ciss) (Max) @ Vds

3550pF @ 50V

Gate Charge (Qg) (Max) @ Vgs

140nC @ 10V

Rise Time

87ns

Vgs (Max)

±20V

Fall Time (Typ)

70 ns

Continuous Drain Current (ID)

73A

Drain to Source Breakdown Voltage

100V

Pulsed Drain Current-Max (IDM)

290A

Case Connection

DRAIN

Dual Supply Voltage

100V

Recovery Time

53 ns

Nominal Vgs

4 V

Height

4.826mm

Length

10.668mm

Width

9.65mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

RoHS Compliant

FET Type

N-Channel

Lead Free

Lead Free