Showing 2893–2904 of 7598 results
Transistors - FETs/MOSFETs - Single
Micro Commercial Co SI3404-TP
In stock
Manufacturer |
Micro Commercial Co |
---|---|
Factory Lead Time |
22 Weeks |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Current - Continuous Drain (Id) @ 25℃ |
5.8A |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Power Dissipation (Max) |
350mW |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Cut Tape (CT) |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
28m Ω @ 5.8A, 10V |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
820pF @ 15V |
Drain to Source Voltage (Vdss) |
30V |
Vgs (Max) |
±20V |
RoHS Status |
ROHS3 Compliant |
Micro Commercial Co SI3420-TP
In stock
Manufacturer |
Micro Commercial Co |
---|---|
Part Status |
Active |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Current - Continuous Drain (Id) @ 25℃ |
6A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
1.8V 10V |
Power Dissipation (Max) |
350mW Tc |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Factory Lead Time |
12 Weeks |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
ECCN Code |
EAR99 |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
24m Ω @ 6A, 10V |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
630pF @ 10V |
Drain to Source Voltage (Vdss) |
20V |
Vgs (Max) |
±12V |
RoHS Status |
ROHS3 Compliant |
Micro Commercial Components 2N7002KDWBQ-TP
In stock
Manufacturer |
Micro Commercial Components |
---|---|
Mounting Style |
SMD/SMT |
Channel Mode |
Enhancement |
Id - Continuous Drain Current |
220 mA |
Maximum Operating Temperature |
+ 150 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
240 mW |
Qg - Gate Charge |
1.75 nC |
Rds On - Drain-Source Resistance |
1.3 Ohms |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
60 V |
Vgs - Gate-Source Voltage |
– 20 V, + 20 V |
Vgs th - Gate-Source Threshold Voltage |
1.5 V |
Series |
SS-AECQ |
Technology |
Si |
Number of Channels |
1 Channel |
Micro Commercial Components MCG40N10YHE3-TP
In stock
Manufacturer |
Micro Commercial Components |
---|---|
Mounting Style |
SMD/SMT |
Channel Mode |
Enhancement |
Id - Continuous Drain Current |
40 A |
Maximum Operating Temperature |
+ 150 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
43 W |
Qg - Gate Charge |
16 nC |
Rds On - Drain-Source Resistance |
17 mOhms |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
100 V |
Vgs - Gate-Source Voltage |
– 20 V, + 20 V |
Vgs th - Gate-Source Threshold Voltage |
1.8 V |
Technology |
Si |
Number of Channels |
1 Channel |
Micro Commercial Components MCU01N60A-TP
In stock
Manufacturer |
Micro Commercial Components |
---|---|
Mounting Style |
SMD/SMT |
Channel Mode |
Enhancement |
Id - Continuous Drain Current |
1.3 A |
Maximum Operating Temperature |
+ 150 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
37.8 W |
Qg - Gate Charge |
6 nC |
Rds On - Drain-Source Resistance |
7 Ohms |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
600 V |
Vgs - Gate-Source Voltage |
– 30 V, + 30 V |
Vgs th - Gate-Source Threshold Voltage |
3.4 V |
Technology |
Si |
Number of Channels |
1 Channel |
Microchip APT106N60B2C6
In stock
Manufacturer |
Microchip |
---|---|
Package |
Tube |
Surface Mount |
NO |
Supplier Device Package |
T-MAX™ [B2] |
Number of Terminals |
3 |
Transistor Element Material |
SILICON |
Base Product Number |
APT106 |
Continuous Drain Current Id |
106 |
Drain Current-Max (ID) |
106 A |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Ihs Manufacturer |
MICROSEMI CORP |
Manufacturer Part Number |
APT106N60B2C6 |
Mfr |
Microchip Technology |
ECCN Code |
EAR99 |
Operating Temperature-Max |
150 °C |
Package Body Material |
PLASTIC/EPOXY |
Package Description |
TMAX-3 |
Package Shape |
RECTANGULAR |
Package Style |
IN-LINE |
Part Life Cycle Code |
Active |
Power Dissipation (Max) |
833W (Tc) |
Product Status |
Active |
Reflow Temperature-Max (s) |
NOT SPECIFIED |
Risk Rank |
2.42 |
Rohs Code |
No |
Operating Temperature |
-55°C ~ 150°C (TJ) |
Series |
CoolMOS™ |
Package / Case |
TO-247-3 Variant |
Mounting Type |
Through Hole |
Transistor Application |
SWITCHING |
Terminal Position |
SINGLE |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
unknown |
Pin Count |
3 |
JESD-30 Code |
R-PSIP-T3 |
Qualification Status |
Not Qualified |
Number of Elements |
1 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
833 |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
35mOhm @ 53A, 10V |
Vgs(th) (Max) @ Id |
3.5V @ 3.4mA |
Technology |
MOSFET (Metal Oxide) |
Input Capacitance (Ciss) (Max) @ Vds |
8390 pF @ 25 V |
Current - Continuous Drain (Id) @ 25°C |
106A (Tc) |
Gate Charge (Qg) (Max) @ Vgs |
308 nC @ 10 V |
Drain to Source Voltage (Vdss) |
600 V |
Vgs (Max) |
±20V |
Polarity/Channel Type |
N-CHANNEL |
Drain-source On Resistance-Max |
0.035 Ω |
Pulsed Drain Current-Max (IDM) |
318 A |
DS Breakdown Voltage-Min |
600 V |
Channel Type |
N |
Avalanche Energy Rating (Eas) |
2200 mJ |
Terminal Form |
THROUGH-HOLE |
FET Technology |
METAL-OXIDE SEMICONDUCTOR |
Microchip APT34F100B2
In stock
Manufacturer |
Microchip |
---|---|
Minimum Operating Temperature |
– 55 C |
Supplier Device Package |
T-MAX™ [B2] |
Mounting Style |
Through Hole |
Base Product Number |
APT34F100 |
Channel Mode |
Enhancement |
Continuous Drain Current Id |
35 |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Id - Continuous Drain Current |
35 A |
Maximum Operating Temperature |
+ 150 C |
Vgs th - Gate-Source Threshold Voltage |
2.5 V |
Mfr |
Microchip Technology |
Package |
Tube |
Pd - Power Dissipation |
1.135 kW |
Power Dissipation (Max) |
1135W (Tc) |
Product Status |
Active |
Qg - Gate Charge |
305 nC |
Rds On - Drain-Source Resistance |
320 mOhms |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
1 kV |
Vgs - Gate-Source Voltage |
– 30 V, + 30 V |
Package / Case |
TO-247-3 Variant |
Mounting Type |
Through Hole |
Power Dissipation |
1.135 |
Series |
POWER MOS 8™ |
Temperature Coefficient |
100 ppm/°C |
Resistance |
6.19 kΩ |
Max Operating Temperature |
155 °C |
Min Operating Temperature |
-55 °C |
Composition |
Thin Film |
Power Rating |
100 mW |
Technology |
MOSFET (Metal Oxide) |
Number of Channels |
1 Channel |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
380mOhm @ 18A, 10V |
Operating Temperature |
-55°C ~ 150°C (TJ) |
Vgs(th) (Max) @ Id |
5V @ 2.5mA |
Input Capacitance (Ciss) (Max) @ Vds |
9835 pF @ 25 V |
Current - Continuous Drain (Id) @ 25°C |
35A (Tc) |
Gate Charge (Qg) (Max) @ Vgs |
305 nC @ 10 V |
Drain to Source Voltage (Vdss) |
1000 V |
Vgs (Max) |
±30V |
Channel Type |
N |
Voltage Rating |
50 V |
Tolerance |
1 % |
Height |
550 µm |