Showing 2905–2916 of 7598 results
Transistors - FETs/MOSFETs - Single
Microchip APT60M75JVR
In stock
Manufacturer |
Microchip |
---|---|
Mounting Type |
Chassis Mount |
Package / Case |
SOT-227-4, miniBLOC |
Supplier Device Package |
ISOTOP® |
Base Product Number |
APT60M75 |
Brand |
Microchip Technology |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Factory Pack Quantity:Factory Pack Quantity |
1 |
Mfr |
Microchip Technology |
Package |
Tube |
Power Dissipation (Max) |
700W (Tc) |
Product Status |
Active |
Operating Temperature |
-55°C ~ 150°C (TJ) |
Packaging |
Tube |
Series |
POWER MOS V® |
Subcategory |
Discrete Semiconductor Modules |
Technology |
MOSFET (Metal Oxide) |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
75mOhm @ 500mA, 10V |
Vgs(th) (Max) @ Id |
4V @ 5mA |
Input Capacitance (Ciss) (Max) @ Vds |
19800 pF @ 25 V |
Current - Continuous Drain (Id) @ 25°C |
62A (Tc) |
Gate Charge (Qg) (Max) @ Vgs |
1050 nC @ 10 V |
Drain to Source Voltage (Vdss) |
600 V |
Vgs (Max) |
±30V |
Product Type |
Discrete Semiconductor Modules |
Product Category |
Discrete Semiconductor Modules |
Microchip APT8020JFLL
In stock
Manufacturer |
Microchip |
---|---|
Id - Continuous Drain Current |
33 A |
Rds On - Drain-Source Resistance |
220 mOhms |
Product Status |
Active |
Pd - Power Dissipation |
520 W |
Package |
Tube |
Minimum Operating Temperature |
– 55 C |
Mfr |
Microchip Technology |
Transistor Polarity |
N-Channel |
Maximum Operating Temperature |
+ 150 C |
Factory Pack Quantity:Factory Pack Quantity |
1 |
Brand |
Microchip Technology |
Base Product Number |
APT8020 |
Mounting Style |
Chassis Mount |
Supplier Device Package |
ISOTOP® |
Package / Case |
SOT-227-4, miniBLOC |
Mounting Type |
Chassis Mount |
Operating Temperature |
-55°C ~ 150°C (TJ) |
Rds On (Max) @ Id, Vgs |
220mOhm @ 16.5A, 10V |
Product Type |
Discrete Semiconductor Modules |
Drain to Source Voltage (Vdss) |
800 V |
Gate Charge (Qg) (Max) @ Vgs |
195 nC @ 10 V |
Current - Continuous Drain (Id) @ 25°C |
33A (Tc) |
Input Capacitance (Ciss) (Max) @ Vds |
5200 pF @ 25 V |
Vgs(th) (Max) @ Id |
5V @ 2.5mA |
FET Type |
N-Channel |
Vgs - Gate-Source Voltage |
– 30 V, + 30 V |
Number of Channels |
1 Channel |
Configuration |
Single |
Technology |
MOSFET (Metal Oxide) |
Subcategory |
Discrete Semiconductor Modules |
Series |
POWER MOS 7® |
Packaging |
Tube |
Product Category |
Discrete Semiconductor Modules |
Microchip Technology 2N6661
In stock
Manufacturer |
Microchip Technology |
---|---|
Power Dissipation (Max) |
6.25W Tc |
Contact Plating |
Gold |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-205AD, TO-39-3 Metal Can |
Number of Pins |
3 |
Supplier Device Package |
TO-39 |
Current - Continuous Drain (Id) @ 25℃ |
350mA Tj |
Min Operating Temperature |
-55°C |
Factory Lead Time |
14 Weeks |
Turn Off Delay Time |
10 ns |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Bulk |
Published |
2010 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Max Operating Temperature |
150°C |
Drive Voltage (Max Rds On, Min Rds On) |
5V 10V |
Number of Channels |
1 |
Continuous Drain Current (ID) |
350mA |
Threshold Voltage |
800mV |
Turn On Delay Time |
10 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
4Ohm @ 1A, 10V |
Vgs(th) (Max) @ Id |
2V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds |
50pF @ 24V |
Drain to Source Voltage (Vdss) |
90V |
Vgs (Max) |
±20V |
Element Configuration |
Single |
Power Dissipation |
6.25W |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
90V |
Input Capacitance |
50pF |
Drain to Source Resistance |
4Ohm |
Rds On Max |
4 Ω |
Ambient Temperature Range High |
150°C |
Height |
6.604mm |
RoHS Status |
Non-RoHS Compliant |
Microchip Technology DN1509K1-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Power Dissipation (Max) |
490mW Ta |
Mounting Type |
Surface Mount |
Package / Case |
SC-74A, SOT-753 |
Number of Pins |
5 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
200mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
ECCN Code |
EAR99 |
Number of Elements |
1 |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2013 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
5 |
Mount |
Surface Mount |
Factory Lead Time |
6 Weeks |
Rds On (Max) @ Id, Vgs |
6 Ω @ 200mA, 0V |
Terminal Position |
DUAL |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Power Dissipation |
490mW |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Input Capacitance (Ciss) (Max) @ Vds |
150pF @ 25V |
Drain to Source Voltage (Vdss) |
90V |
Terminal Finish |
Matte Tin (Sn) |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
200mA |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
0.2A |
Drain-source On Resistance-Max |
6Ohm |
FET Feature |
Depletion Mode |
Terminal Form |
GULL WING |
RoHS Status |
ROHS3 Compliant |
Microchip Technology DN1509N8-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mounting Type |
Surface Mount |
Package / Case |
TO-243AA |
Number of Pins |
3 |
Weight |
52.786812mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
360mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.6W Ta |
Time@Peak Reflow Temperature-Max (s) |
40 |
Turn Off Delay Time |
15 ns |
Packaging |
Tape & Reel (TR) |
Published |
2005 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Terminal Form |
FLAT |
Peak Reflow Temperature (Cel) |
260 |
Mount |
Surface Mount |
Factory Lead Time |
6 Weeks |
Fall Time (Typ) |
16 ns |
Element Configuration |
Single |
Power Dissipation |
1.6W |
Case Connection |
DRAIN |
Turn On Delay Time |
12 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
6 Ω @ 200mA, 0V |
Input Capacitance (Ciss) (Max) @ Vds |
150pF @ 25V |
Rise Time |
16ns |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
360mA |
Gate to Source Voltage (Vgs) |
20V |
Number of Channels |
1 |
Drain-source On Resistance-Max |
6Ohm |
Drain to Source Breakdown Voltage |
90V |
FET Feature |
Depletion Mode |
Height |
1.6mm |
Length |
4.6mm |
Width |
2.6mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Operating Mode |
ENHANCEMENT MODE |
Lead Free |
Lead Free |
Microchip Technology DN2450K4-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Terminal Position |
SINGLE |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Weight |
3.949996g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
350mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Number of Elements |
1 |
Turn Off Delay Time |
15 ns |
Operating Temperature |
-55°C~150°C TJ |
Power Dissipation (Max) |
2.5W Ta |
Packaging |
Tape & Reel (TR) |
Published |
2009 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Additional Feature |
LOW THRESHOLD |
HTS Code |
8541.90.00.00 |
Contact Plating |
Tin |
Factory Lead Time |
10 Weeks |
Rise Time |
20ns |
Vgs (Max) |
±20V |
JESD-30 Code |
R-PSSO-G2 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Power Dissipation |
2.5W |
Case Connection |
DRAIN |
Turn On Delay Time |
15 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
10 Ω @ 300mA, 0V |
Input Capacitance (Ciss) (Max) @ Vds |
200pF @ 25V |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Terminal Form |
GULL WING |
Fall Time (Typ) |
15 ns |
Continuous Drain Current (ID) |
350mA |
JEDEC-95 Code |
TO-252AA |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
500V |
Pulsed Drain Current-Max (IDM) |
1A |
FET Feature |
Depletion Mode |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Lead Free |
Lead Free |
Microchip Technology DN2450N8-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Power Dissipation (Max) |
1.6W Ta |
Mounting Type |
Surface Mount |
Package / Case |
TO-243AA |
Number of Pins |
3 |
Weight |
52.786812mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
230mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Terminal Finish |
Matte Tin (Sn) |
Number of Elements |
1 |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2013 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Mount |
Surface Mount |
Factory Lead Time |
9 Weeks |
Rds On (Max) @ Id, Vgs |
10 Ω @ 300mA, 0V |
Terminal Position |
SINGLE |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Power Dissipation |
1.6W |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Input Capacitance (Ciss) (Max) @ Vds |
200pF @ 25V |
Vgs (Max) |
±20V |
Additional Feature |
LOW THRESHOLD |
Continuous Drain Current (ID) |
230mA |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
500V |
Pulsed Drain Current-Max (IDM) |
0.9A |
FET Feature |
Depletion Mode |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Terminal Form |
FLAT |
Lead Free |
Lead Free |