Showing 2917–2928 of 7598 results
Transistors - FETs/MOSFETs - Single
Microchip Technology DN2530N3-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Turn Off Delay Time |
15 ns |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-226-3, TO-92-3 (TO-226AA) |
Number of Pins |
3 |
Weight |
453.59237mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
175mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Number of Elements |
1 |
Terminal Position |
BOTTOM |
Factory Lead Time |
6 Weeks |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Bulk |
Published |
2013 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Power Dissipation (Max) |
740mW Ta |
Terminal Form |
WIRE |
Continuous Drain Current (ID) |
175mA |
Gate to Source Voltage (Vgs) |
20V |
Power Dissipation |
740mW |
Turn On Delay Time |
10 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
12 Ω @ 150mA, 0V |
Input Capacitance (Ciss) (Max) @ Vds |
300pF @ 25V |
Rise Time |
15ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
15 ns |
Number of Channels |
1 |
Element Configuration |
Single |
Drain to Source Breakdown Voltage |
300V |
FET Feature |
Depletion Mode |
Feedback Cap-Max (Crss) |
5 pF |
Height |
5.33mm |
Length |
5.21mm |
Width |
4.19mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Microchip Technology DN2535N3-G-P013
In stock
Manufacturer |
Microchip Technology |
---|---|
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-226-3, TO-92-3 (TO-226AA) |
Weight |
453.59237mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
120mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Number of Elements |
1 |
Power Dissipation (Max) |
1W Tc |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Box (TB) |
Published |
2013 |
Part Status |
Active |
Factory Lead Time |
5 Weeks |
ECCN Code |
EAR99 |
Number of Terminations |
3 |
Terminal Position |
BOTTOM |
JESD-30 Code |
O-PBCY-T3 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Number of Channels |
1 |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
25 Ω @ 120mA, 0V |
Input Capacitance (Ciss) (Max) @ Vds |
300pF @ 25V |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
120mA |
Drain to Source Breakdown Voltage |
350V |
FET Feature |
Depletion Mode |
Feedback Cap-Max (Crss) |
5 pF |
RoHS Status |
ROHS3 Compliant |
Microchip Technology DN2540N3-G-P003
In stock
Manufacturer |
Microchip Technology |
---|---|
Terminal Position |
BOTTOM |
Mounting Type |
Through Hole |
Package / Case |
TO-226-3, TO-92-3 (TO-226AA) |
Weight |
453.59237mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
120mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Power Dissipation (Max) |
1W Tc |
Turn Off Delay Time |
15 ns |
Number of Elements |
1 |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2013 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Mount |
Through Hole |
Factory Lead Time |
5 Weeks |
Vgs (Max) |
±20V |
Fall Time (Typ) |
20 ns |
Turn On Delay Time |
10 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
25 Ω @ 120mA, 0V |
Input Capacitance (Ciss) (Max) @ Vds |
300pF @ 25V |
Rise Time |
15ns |
Drain to Source Voltage (Vdss) |
400V |
Number of Channels |
1 |
JESD-30 Code |
O-PBCY-T3 |
Continuous Drain Current (ID) |
120mA |
Gate to Source Voltage (Vgs) |
20V |
FET Feature |
Depletion Mode |
Feedback Cap-Max (Crss) |
5 pF |
Height |
5.33mm |
Length |
5.21mm |
Width |
4.19mm |
Element Configuration |
Single |
RoHS Status |
ROHS3 Compliant |
Microchip Technology DN2540N8-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Power Dissipation (Max) |
1.6W Tc |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
TO-243AA |
Number of Pins |
3 |
Weight |
52.786812mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
170mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Terminal Form |
FLAT |
Factory Lead Time |
5 Weeks |
Turn Off Delay Time |
15 ns |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2013 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Additional Feature |
LOW THRESHOLD |
Number of Elements |
1 |
Peak Reflow Temperature (Cel) |
260 |
Rise Time |
15ns |
Vgs (Max) |
±20V |
Number of Channels |
1 |
Element Configuration |
Single |
Power Dissipation |
1.6W |
Case Connection |
DRAIN |
Turn On Delay Time |
10 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
25 Ω @ 120mA, 0V |
Input Capacitance (Ciss) (Max) @ Vds |
300pF @ 25V |
Time@Peak Reflow Temperature-Max (s) |
40 |
Qualification Status |
Not Qualified |
Fall Time (Typ) |
15 ns |
Continuous Drain Current (ID) |
170mA |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
400V |
Pulsed Drain Current-Max (IDM) |
0.5A |
FET Feature |
Depletion Mode |
Height |
1.6mm |
Length |
4.6mm |
Width |
2.6mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Microchip Technology DN2625K4-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Weight |
3.949996g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.1A Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Number of Elements |
1 |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Turn Off Delay Time |
10 ns |
Published |
2013 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Additional Feature |
LOW THRESHOLD |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Mount |
Surface Mount |
Factory Lead Time |
19 Weeks |
Rise Time |
20ns |
Vgs (Max) |
±20V |
Element Configuration |
Single |
Case Connection |
DRAIN |
Turn On Delay Time |
10 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
3.5 Ω @ 1A, 0V |
Input Capacitance (Ciss) (Max) @ Vds |
1000pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
7.04nC @ 1.5V |
Qualification Status |
Not Qualified |
JESD-30 Code |
R-PSSO-G2 |
Fall Time (Typ) |
20 ns |
Continuous Drain Current (ID) |
1.1A |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
250V |
FET Feature |
Depletion Mode |
Height |
2.39mm |
Length |
6.73mm |
Width |
6.1mm |
Number of Channels |
1 |
RoHS Status |
ROHS3 Compliant |
Microchip Technology DN3135K1-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Number of Pins |
3 |
Weight |
1.437803g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
72mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Number of Elements |
1 |
Power Dissipation (Max) |
360mW Ta |
Terminal Form |
GULL WING |
Turn Off Delay Time |
15 ns |
Packaging |
Tape & Reel (TR) |
Published |
2010 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
LOW THRESHOLD |
Terminal Position |
DUAL |
Mount |
Surface Mount |
Factory Lead Time |
17 Weeks |
Vgs (Max) |
±20V |
Time@Peak Reflow Temperature-Max (s) |
40 |
Number of Channels |
1 |
Element Configuration |
Single |
Power Dissipation |
360mW |
Turn On Delay Time |
10 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
35 Ω @ 150mA, 0V |
Input Capacitance (Ciss) (Max) @ Vds |
120pF @ 25V |
Rise Time |
15ns |
Fall Time (Typ) |
15 ns |
Continuous Drain Current (ID) |
72mA |
Peak Reflow Temperature (Cel) |
260 |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
0.072A |
Drain to Source Breakdown Voltage |
350V |
FET Feature |
Depletion Mode |
Height |
950μm |
Length |
2.9mm |
Width |
1.3mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Qualification Status |
Not Qualified |
Lead Free |
Lead Free |
Microchip Technology DN3545N3-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-226-3, TO-92-3 (TO-226AA) |
Number of Pins |
3 |
Weight |
453.59237mg |
Transistor Element Material |
SILICON |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Number of Elements |
1 |
Power Dissipation (Max) |
740mW Ta |
Terminal Form |
WIRE |
Factory Lead Time |
6 Weeks |
Packaging |
Bulk |
Published |
2010 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
HIGH INPUT IMPEDANCE |
Terminal Position |
BOTTOM |
Turn Off Delay Time |
30 ns |
Peak Reflow Temperature (Cel) |
NOT APPLICABLE |
Drain to Source Voltage (Vdss) |
450V |
Vgs (Max) |
±20V |
Number of Channels |
1 |
Element Configuration |
Single |
Power Dissipation |
740mW |
Turn On Delay Time |
20 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
20 Ω @ 150mA, 0V |
Input Capacitance (Ciss) (Max) @ Vds |
360pF @ 25V |
Rise Time |
30ns |
Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE |
Qualification Status |
Not Qualified |
Fall Time (Typ) |
30 ns |
Continuous Drain Current (ID) |
136mA |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
450V |
FET Feature |
Depletion Mode |
Height |
5.33mm |
Length |
5.21mm |
Width |
4.19mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Microchip Technology LND01K1-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Terminal Finish |
Matte Tin (Sn) |
Mounting Type |
Surface Mount |
Package / Case |
SC-74A, SOT-753 |
Number of Pins |
5 |
Weight |
29.993795mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
330mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Power Dissipation (Max) |
360mW Ta |
Turn Off Delay Time |
1 ns |
Number of Elements |
1 |
Operating Temperature |
-25°C~125°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2014 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
5 |
ECCN Code |
EAR99 |
Mount |
Surface Mount |
Factory Lead Time |
6 Weeks |
Input Capacitance (Ciss) (Max) @ Vds |
46pF @ 5V |
Rise Time |
11ns |
Time@Peak Reflow Temperature-Max (s) |
40 |
Number of Channels |
1 |
Element Configuration |
Single |
Power Dissipation |
360mW |
Turn On Delay Time |
3.8 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
1.4 Ω @ 100mA, 0V |
Terminal Form |
GULL WING |
Terminal Position |
DUAL |
Vgs (Max) |
+0.6V, -12V |
Fall Time (Typ) |
6.4 ns |
Continuous Drain Current (ID) |
330mA |
Gate to Source Voltage (Vgs) |
600mV |
Drain Current-Max (Abs) (ID) |
0.33A |
Drain to Source Breakdown Voltage |
9V |
FET Feature |
Depletion Mode |
RoHS Status |
ROHS3 Compliant |
Peak Reflow Temperature (Cel) |
260 |
Lead Free |
Lead Free |
Microchip Technology LND150N3-G-P013
In stock
Manufacturer |
Microchip Technology |
---|---|
Power Dissipation (Max) |
740mW Ta |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-226-3, TO-92-3 (TO-226AA) |
Weight |
453.59237mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
30mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
0V |
Terminal Position |
BOTTOM |
Factory Lead Time |
8 Weeks |
Turn Off Delay Time |
100 ns |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Box (TB) |
Published |
2014 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
Number of Elements |
1 |
JESD-30 Code |
O-PBCY-T3 |
Vgs (Max) |
±20V |
Fall Time (Typ) |
1.3 μs |
Turn On Delay Time |
90 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
1000 Ω @ 500μA, 0V |
Input Capacitance (Ciss) (Max) @ Vds |
10pF @ 25V |
Rise Time |
450ns |
Drain to Source Voltage (Vdss) |
500V |
Number of Channels |
1 |
Element Configuration |
Single |
Continuous Drain Current (ID) |
30mA |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
0.03A |
DS Breakdown Voltage-Min |
500V |
FET Feature |
Depletion Mode |
Height |
5.33mm |
Length |
5.21mm |
Width |
4.19mm |
RoHS Status |
ROHS3 Compliant |
Microchip Technology LP0701N3-G
In stock
Manufacturer |
Microchip Technology |
---|---|
Terminal Position |
BOTTOM |
Mounting Type |
Through Hole |
Package / Case |
TO-226-3, TO-92-3 (TO-226AA) |
Number of Pins |
3 |
Weight |
453.59237mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
500mA Tj |
Drive Voltage (Max Rds On, Min Rds On) |
2V 5V |
Number of Elements |
1 |
Turn Off Delay Time |
30 ns |
Operating Temperature |
-55°C~150°C TJ |
Power Dissipation (Max) |
1W Tc |
Packaging |
Bulk |
Published |
2013 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
LOW THRESHOLD |
Mount |
Through Hole |
Factory Lead Time |
17 Weeks |
Vgs (Max) |
±10V |
Fall Time (Typ) |
30 ns |
Power Dissipation |
1W |
Turn On Delay Time |
20 ns |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
1.5 Ω @ 300mA, 5V |
Vgs(th) (Max) @ Id |
1V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds |
250pF @ 15V |
Rise Time |
20ns |
Drain to Source Voltage (Vdss) |
16.5V |
Element Configuration |
Single |
Number of Channels |
1 |
Continuous Drain Current (ID) |
500mA |
Gate to Source Voltage (Vgs) |
10V |
Drain Current-Max (Abs) (ID) |
0.5A |
Drain to Source Breakdown Voltage |
-16.5V |
Feedback Cap-Max (Crss) |
60 pF |
Height |
5.33mm |
Length |
5.21mm |
Width |
4.19mm |
Radiation Hardening |
No |
Operating Mode |
ENHANCEMENT MODE |
RoHS Status |
ROHS3 Compliant |
Microchip Technology MCP87022T-U/MF
In stock
Manufacturer |
Microchip Technology |
---|---|
Packaging |
Tape & Reel (TR) |
Package / Case |
8-PowerTDFN |
Surface Mount |
YES |
Number of Pins |
8 |
Current - Continuous Drain (Id) @ 25℃ |
100A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Power Dissipation (Max) |
2.2W Ta |
Turn Off Delay Time |
21 ns |
Time@Peak Reflow Temperature-Max (s) |
40 |
Operating Temperature |
-55°C~150°C TJ |
Published |
2004 |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) – annealed |
Peak Reflow Temperature (Cel) |
260 |
Reach Compliance Code |
not_compliant |
Mounting Type |
Surface Mount |
Factory Lead Time |
11 Weeks |
Vgs (Max) |
+10V, -8V |
Element Configuration |
Single |
Turn On Delay Time |
7.6 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
2.3m Ω @ 25A, 10V |
Vgs(th) (Max) @ Id |
1.6V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
2310pF @ 12.5V |
Gate Charge (Qg) (Max) @ Vgs |
29nC @ 4.5V |
Rise Time |
27ns |
Fall Time (Typ) |
17 ns |
Continuous Drain Current (ID) |
100A |
Base Part Number |
MCP87022 |
Gate to Source Voltage (Vgs) |
10V |
Drain to Source Breakdown Voltage |
25V |
Nominal Vgs |
1.3 V |
Height |
1mm |
Length |
5mm |
Width |
6mm |
REACH SVHC |
No SVHC |
Power Dissipation |
2.2W |
RoHS Status |
ROHS3 Compliant |
Microchip Technology MCP87050T-U/MF
In stock
Manufacturer |
Microchip Technology |
---|---|
Packaging |
Tape & Reel (TR) |
Package / Case |
8-PowerTDFN |
Surface Mount |
YES |
Number of Pins |
8 |
Current - Continuous Drain (Id) @ 25℃ |
100A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Power Dissipation (Max) |
2.2W Ta |
Turn Off Delay Time |
11 ns |
Time@Peak Reflow Temperature-Max (s) |
40 |
Operating Temperature |
-55°C~150°C TJ |
Published |
2004 |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) – annealed |
Peak Reflow Temperature (Cel) |
260 |
Reach Compliance Code |
not_compliant |
Mounting Type |
Surface Mount |
Factory Lead Time |
5 Weeks |
Vgs (Max) |
+10V, -8V |
Element Configuration |
Single |
Turn On Delay Time |
5 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
5m Ω @ 20A, 10V |
Vgs(th) (Max) @ Id |
1.6V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1040pF @ 12.5V |
Gate Charge (Qg) (Max) @ Vgs |
15nC @ 4.5V |
Rise Time |
18ns |
Continuous Drain Current (ID) |
100A |
Gate to Source Voltage (Vgs) |
10V |
Base Part Number |
MCP87050 |
Drain to Source Breakdown Voltage |
25V |
Nominal Vgs |
1.3 V |
Height |
1mm |
Length |
5mm |
Width |
6mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Power Dissipation |
2.2W |
Lead Free |
Lead Free |