Showing 421–432 of 7598 results
Transistors - FETs/MOSFETs - Single
Diodes Incorporated DMN2112SN-7
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Peak Reflow Temperature (Cel) |
260 |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Number of Pins |
3 |
Weight |
7.994566mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.2A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.5V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
500mW Ta |
Turn Off Delay Time |
75 ns |
Packaging |
Tape & Reel (TR) |
Published |
2014 |
Operating Temperature |
-55°C~150°C TJ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
HIGH RELIABILITY |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Mount |
Surface Mount |
Factory Lead Time |
19 Weeks |
Fall Time (Typ) |
65 ns |
Continuous Drain Current (ID) |
1.2A |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
500mW |
Turn On Delay Time |
10 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
100m Ω @ 500mA, 4.5V |
Vgs(th) (Max) @ Id |
1.2V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds |
220pF @ 10V |
Rise Time |
15ns |
Vgs (Max) |
±8V |
Pin Count |
3 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Threshold Voltage |
1.2V |
Gate to Source Voltage (Vgs) |
8V |
Drain-source On Resistance-Max |
0.25Ohm |
Drain to Source Breakdown Voltage |
20V |
Dual Supply Voltage |
20V |
Nominal Vgs |
1.2 V |
Height |
1.3mm |
Length |
3.1mm |
Width |
1.7mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
Number of Channels |
1 |
RoHS Status |
ROHS3 Compliant |
Diodes Incorporated DMN21D2UFB-7B
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Configuration |
SINGLE WITH BUILT-IN DIODE |
Mounting Type |
Surface Mount |
Package / Case |
3-UFDFN |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
760mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.5V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
380mW Ta |
Turn Off Delay Time |
19.6 ns |
Packaging |
Tape & Reel (TR) |
Published |
2012 |
Operating Temperature |
-55°C~150°C TJ |
JESD-609 Code |
e4 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Additional Feature |
HIGH RELIABILITY |
Terminal Position |
BOTTOM |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Mount |
Surface Mount |
Factory Lead Time |
15 Weeks |
Fall Time (Typ) |
9.8 ns |
Continuous Drain Current (ID) |
760mA |
Turn On Delay Time |
3.5 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
990m Ω @ 100mA, 4.5V |
Vgs(th) (Max) @ Id |
1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
27.6pF @ 16V |
Gate Charge (Qg) (Max) @ Vgs |
0.93nC @ 10V |
Rise Time |
4.2ns |
Drain to Source Voltage (Vdss) |
20V |
Vgs (Max) |
±12V |
Operating Mode |
ENHANCEMENT MODE |
Number of Channels |
1 |
Gate to Source Voltage (Vgs) |
12V |
Drain Current-Max (Abs) (ID) |
0.76A |
Drain-source On Resistance-Max |
0.99Ohm |
DS Breakdown Voltage-Min |
20V |
Height |
480μm |
Length |
1.08mm |
Width |
675μm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Case Connection |
DRAIN |
Lead Free |
Lead Free |
Diodes Incorporated DMN2250UFB-7B
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
3-UFDFN |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.35A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.8V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
500mW Ta |
Time@Peak Reflow Temperature-Max (s) |
30 |
Factory Lead Time |
6 Weeks |
Packaging |
Cut Tape (CT) |
Published |
2013 |
JESD-609 Code |
e4 |
Part Status |
Discontinued |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Additional Feature |
HIGH RELIABILITY |
Terminal Position |
BOTTOM |
Peak Reflow Temperature (Cel) |
260 |
Turn Off Delay Time |
59.4 ns |
Number of Channels |
1 |
Drain to Source Voltage (Vdss) |
20V |
Vgs (Max) |
±8V |
Case Connection |
DRAIN |
Turn On Delay Time |
4.3 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
170m Ω @ 1A, 4.5V |
Vgs(th) (Max) @ Id |
1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
94pF @ 16V |
Gate Charge (Qg) (Max) @ Vgs |
3.1nC @ 10V |
Rise Time |
6.1ns |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Fall Time (Typ) |
25.4 ns |
Continuous Drain Current (ID) |
1.35A |
Gate to Source Voltage (Vgs) |
8V |
Drain-source On Resistance-Max |
0.25Ohm |
DS Breakdown Voltage-Min |
20V |
Height |
480μm |
Length |
1.08mm |
Width |
675μm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Diodes Incorporated DMN2300UFB-7B
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Turn Off Delay Time |
21.71 ns |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
3-UFDFN |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.32A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.8V 4.5V |
Number of Elements |
1 |
Terminal Position |
BOTTOM |
Factory Lead Time |
17 Weeks |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2015 |
JESD-609 Code |
e4 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Power Dissipation (Max) |
468mW Ta |
Peak Reflow Temperature (Cel) |
260 |
Vgs(th) (Max) @ Id |
950mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
67.62pF @ 20V |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Number of Channels |
1 |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
Turn On Delay Time |
4.92 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
175m Ω @ 300mA, 4.5V |
Time@Peak Reflow Temperature-Max (s) |
40 |
Pin Count |
3 |
Gate Charge (Qg) (Max) @ Vgs |
0.89nC @ 4.5V |
Rise Time |
6.93ns |
Vgs (Max) |
±8V |
Fall Time (Typ) |
10.62 ns |
Continuous Drain Current (ID) |
1.78A |
Gate to Source Voltage (Vgs) |
8V |
Drain to Source Breakdown Voltage |
20V |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Diodes Incorporated DMN2300UFB4-7B
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Packaging |
Tape & Reel (TR) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
3-XFDFN |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.3A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.5V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
500mW Ta |
Turn Off Delay Time |
38 ns |
Pin Count |
3 |
Factory Lead Time |
16 Weeks |
Published |
2012 |
JESD-609 Code |
e4 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Resistance |
175mOhm |
Terminal Position |
BOTTOM |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Operating Temperature |
-55°C~150°C TJ |
Number of Channels |
1 |
Vgs (Max) |
±8V |
Fall Time (Typ) |
13 ns |
Power Dissipation |
500mW |
Case Connection |
DRAIN |
Turn On Delay Time |
3.5 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
175m Ω @ 300mA, 4.5V |
Vgs(th) (Max) @ Id |
950mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
64.3pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
1.6nC @ 4.5V |
Rise Time |
2.8ns |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Continuous Drain Current (ID) |
1.3A |
Threshold Voltage |
950mV |
Gate to Source Voltage (Vgs) |
8V |
Drain to Source Breakdown Voltage |
20V |
Max Junction Temperature (Tj) |
150°C |
Height |
400μm |
Length |
1.05mm |
Width |
650μm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Diodes Incorporated DMN2300UFD-7
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
3-UDFN |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.21A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.5V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
470mW Ta |
Terminal Position |
DUAL |
Factory Lead Time |
17 Weeks |
Packaging |
Tape & Reel (TR) |
Published |
2011 |
JESD-609 Code |
e4 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Additional Feature |
LOW THRESHOLD |
Turn Off Delay Time |
21.71 ns |
Peak Reflow Temperature (Cel) |
260 |
Gate Charge (Qg) (Max) @ Vgs |
2nC @ 4.5V |
Rise Time |
6.93ns |
Number of Channels |
1 |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Turn On Delay Time |
4.92 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
200m Ω @ 900mA, 4.5V |
Vgs(th) (Max) @ Id |
950mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
67.62pF @ 25V |
Time@Peak Reflow Temperature-Max (s) |
40 |
Pin Count |
3 |
Drain to Source Voltage (Vdss) |
20V |
Vgs (Max) |
±8V |
Fall Time (Typ) |
10.62 ns |
Continuous Drain Current (ID) |
1.73A |
Gate to Source Voltage (Vgs) |
8V |
Drain-source On Resistance-Max |
0.2Ohm |
DS Breakdown Voltage-Min |
20V |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Diodes Incorporated DMN2400UFD-7
In stock
Manufacturer |
Diodes Incorporated |
---|---|
ECCN Code |
EAR99 |
Mounting Type |
Surface Mount |
Package / Case |
3-UDFN |
Number of Pins |
3 |
Current - Continuous Drain (Id) @ 25℃ |
900mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.5V 4.5V |
Turn Off Delay Time |
13.74 ns |
Operating Temperature |
-55°C~150°C TJ |
Power Dissipation (Max) |
400mW Ta |
Packaging |
Cut Tape (CT) |
Published |
2012 |
JESD-609 Code |
e4 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Mount |
Surface Mount |
Factory Lead Time |
40 Weeks |
Rise Time |
7.28ns |
Vgs (Max) |
±12V |
Turn On Delay Time |
4.06 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
600m Ω @ 200mA, 4.5V |
Vgs(th) (Max) @ Id |
1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
37pF @ 16V |
Gate Charge (Qg) (Max) @ Vgs |
500nC @ 4.5V |
Time@Peak Reflow Temperature-Max (s) |
40 |
Peak Reflow Temperature (Cel) |
260 |
Fall Time (Typ) |
10.54 ns |
Continuous Drain Current (ID) |
900mA |
Gate to Source Voltage (Vgs) |
12V |
Drain to Source Breakdown Voltage |
20V |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Number of Channels |
1 |
Lead Free |
Lead Free |
Diodes Incorporated DMN2550UFA-7B
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Turn Off Delay Time |
105 ns |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
3-XFDFN |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
600mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.5V 4.5V |
Number of Elements |
1 |
Terminal Form |
NO LEAD |
Factory Lead Time |
15 Weeks |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2014 |
JESD-609 Code |
e4 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Capacitance |
52.5pF |
Power Dissipation (Max) |
360mW Ta |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Vgs(th) (Max) @ Id |
1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
52.5pF @ 16V |
Number of Channels |
1 |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
Turn On Delay Time |
7.1 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
450m Ω @ 200mA, 4.5V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
R-PSSO-N2 |
Gate Charge (Qg) (Max) @ Vgs |
0.88nC @ 4.5V |
Rise Time |
11ns |
Vgs (Max) |
±8V |
Fall Time (Typ) |
36 ns |
Continuous Drain Current (ID) |
600mA |
Gate to Source Voltage (Vgs) |
8V |
Drain Current-Max (Abs) (ID) |
0.6A |
Drain-source On Resistance-Max |
0.45Ohm |
Drain to Source Breakdown Voltage |
20V |
RoHS Status |
ROHS3 Compliant |
Diodes Incorporated DMN25D0UFA-7B
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
3-XFDFN |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
240mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
2.7V 4.5V |
Number of Elements |
1 |
Terminal Position |
SINGLE |
Factory Lead Time |
15 Weeks |
Packaging |
Tape & Reel (TR) |
Published |
2014 |
JESD-609 Code |
e4 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Additional Feature |
HIGH RELIABILITY |
Power Dissipation (Max) |
280mW Ta |
Terminal Form |
NO LEAD |
Rds On (Max) @ Id, Vgs |
4 Ω @ 400mA, 4.5V |
Vgs(th) (Max) @ Id |
1.2V @ 250μA |
Base Part Number |
DMN25D0 |
Reference Standard |
AEC-Q101 |
JESD-30 Code |
R-PSSO-N2 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Input Capacitance (Ciss) (Max) @ Vds |
27.9pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs |
0.36nC @ 4.5V |
Drain to Source Voltage (Vdss) |
25V |
Vgs (Max) |
8V |
Continuous Drain Current (ID) |
240mA |
Drain Current-Max (Abs) (ID) |
0.24A |
Drain-source On Resistance-Max |
4Ohm |
DS Breakdown Voltage-Min |
25V |
RoHS Status |
ROHS3 Compliant |
Diodes Incorporated DMN26D0UFB4-7
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Pin Count |
3 |
Mounting Type |
Surface Mount |
Package / Case |
3-XFDFN |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
230mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.5V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
350mW Ta |
Turn Off Delay Time |
13.4 ns |
Packaging |
Digi-Reel® |
Published |
2017 |
Operating Temperature |
-55°C~150°C TJ |
JESD-609 Code |
e4 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Resistance |
10Ohm |
Terminal Position |
BOTTOM |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Mount |
Surface Mount |
Factory Lead Time |
18 Weeks |
Vgs (Max) |
±10V |
Fall Time (Typ) |
15.2 ns |
Power Dissipation |
350mW |
Case Connection |
DRAIN |
Turn On Delay Time |
3.8 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
3 Ω @ 100mA, 4.5V |
Vgs(th) (Max) @ Id |
1.1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
14.1pF @ 15V |
Rise Time |
7.9ns |
Drain to Source Voltage (Vdss) |
20V |
Element Configuration |
Single |
Number of Channels |
1 |
Continuous Drain Current (ID) |
240mA |
Gate to Source Voltage (Vgs) |
10V |
Drain Current-Max (Abs) (ID) |
0.24A |
DS Breakdown Voltage-Min |
20V |
Height |
350μm |
Length |
1.05mm |
Width |
650μm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Operating Mode |
ENHANCEMENT MODE |
Lead Free |
Lead Free |
Diodes Incorporated DMN26D0UT-7
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Packaging |
Cut Tape (CT) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
SOT-523 |
Number of Pins |
3 |
Weight |
2.012816mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
230mA Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.2V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
300mW Ta |
Turn Off Delay Time |
13.4 ns |
Terminal Form |
GULL WING |
Factory Lead Time |
14 Weeks |
Published |
2009 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Resistance |
3Ohm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
HIGH RELIABILITY |
Terminal Position |
DUAL |
Operating Temperature |
-55°C~150°C TJ |
Peak Reflow Temperature (Cel) |
260 |
Vgs (Max) |
±10V |
Fall Time (Typ) |
15.2 ns |
Number of Channels |
1 |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
300mW |
Turn On Delay Time |
3.8 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
3 Ω @ 100mA, 4.5V |
Vgs(th) (Max) @ Id |
1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
14.1pF @ 15V |
Rise Time |
7.9ns |
Time@Peak Reflow Temperature-Max (s) |
40 |
Pin Count |
3 |
Continuous Drain Current (ID) |
230mA |
Threshold Voltage |
1V |
Gate to Source Voltage (Vgs) |
10V |
Drain to Source Breakdown Voltage |
20V |
Max Junction Temperature (Tj) |
150°C |
Height |
900μm |
Length |
1.7mm |
Width |
850μm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Diodes Incorporated DMN3008SFGQ-7
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Operating Temperature |
-55°C~150°C TJ |
Mounting Type |
Surface Mount |
Package / Case |
8-PowerVDFN |
Number of Pins |
8 |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
17.6A Ta 62A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Additional Feature |
HIGH RELIABILITY |
Power Dissipation (Max) |
900mW Ta |
Packaging |
Tape & Reel (TR) |
Series |
Automotive, AEC-Q101 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
5 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Mount |
Surface Mount |
Factory Lead Time |
23 Weeks |
Rds On (Max) @ Id, Vgs |
4.4m Ω @ 13.5A, 10V |
Terminal Form |
NO LEAD |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PDSO-N5 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Operating Mode |
ENHANCEMENT MODE |
Case Connection |
DRAIN |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Vgs(th) (Max) @ Id |
2.3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
3690pF @ 10V |
Terminal Position |
DUAL |
Gate Charge (Qg) (Max) @ Vgs |
86nC @ 10V |
Drain to Source Voltage (Vdss) |
30V |
Vgs (Max) |
±20V |
Continuous Drain Current (ID) |
62A |
Drain Current-Max (Abs) (ID) |
17.6A |
Drain-source On Resistance-Max |
0.0055Ohm |
DS Breakdown Voltage-Min |
30V |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
RoHS Status |
ROHS3 Compliant |