Showing 697–708 of 7598 results
Transistors - FETs/MOSFETs - Single
Diodes Incorporated ZXM64P035L3
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Pin Count |
3 |
Package / Case |
TO-220-3 |
Weight |
6.000006g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
3.3A Ta 12A Tc |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.5W Ta 20W Tc |
Turn Off Delay Time |
40 ns |
Operating Temperature |
-55°C~150°C TJ |
Published |
2006 |
JESD-609 Code |
e3 |
Packaging |
Bulk |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
Voltage - Rated DC |
-35V |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
-12A |
Time@Peak Reflow Temperature-Max (s) |
40 |
Mounting Type |
Through Hole |
Mount |
Through Hole |
Drain to Source Voltage (Vdss) |
35V |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
20W |
Turn On Delay Time |
4.4 ns |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
75m Ω @ 2.4A, 10V |
Vgs(th) (Max) @ Id |
1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
825pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
46nC @ 10V |
Rise Time |
6.2ns |
Number of Channels |
1 |
JESD-30 Code |
R-PSFM-T3 |
Fall Time (Typ) |
29.2 ns |
Continuous Drain Current (ID) |
12A |
JEDEC-95 Code |
TO-220AB |
Gate to Source Voltage (Vgs) |
20V |
Recovery Time |
30.2 ns |
Height |
4.82mm |
Length |
16.51mm |
Width |
10.66mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Element Configuration |
Single |
Lead Free |
Lead Free |
Diodes Incorporated ZXM64P03XTA
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Published |
2006 |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
8 |
Weight |
139.989945mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
3.8A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.1W Ta |
Turn Off Delay Time |
40 ns |
Operating Temperature |
-55°C~150°C TJ |
Terminal Form |
GULL WING |
Factory Lead Time |
10 Weeks |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Resistance |
75mOhm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
LOW THRESHOLD |
Voltage - Rated DC |
-30V |
Terminal Position |
DUAL |
Packaging |
Tape & Reel (TR) |
Peak Reflow Temperature (Cel) |
260 |
Gate Charge (Qg) (Max) @ Vgs |
46nC @ 10V |
Rise Time |
6.2ns |
Pin Count |
8 |
Number of Channels |
1 |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
1.8W |
Turn On Delay Time |
4.4 ns |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
75m Ω @ 2.4A, 10V |
Vgs(th) (Max) @ Id |
1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
825pF @ 25V |
Current Rating |
-3.8A |
Time@Peak Reflow Temperature-Max (s) |
40 |
Drain to Source Voltage (Vdss) |
30V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
6.2 ns |
Continuous Drain Current (ID) |
3.8A |
Gate to Source Voltage (Vgs) |
20V |
Height |
950μm |
Length |
3.1mm |
Width |
3.1mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Diodes Incorporated ZXM66N02N8TA
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Current - Continuous Drain (Id) @ 25℃ |
9A Ta |
Number of Elements |
1 |
Packaging |
Digi-Reel® |
JESD-609 Code |
e3 |
Terminal Position |
DUAL |
Mount |
Surface Mount |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Terminal Finish |
MATTE TIN |
Max Operating Temperature |
150°C |
Min Operating Temperature |
-55°C |
Voltage - Rated DC |
20V |
Max Power Dissipation |
2.5W |
Part Status |
Obsolete |
Terminal Form |
GULL WING |
Operating Mode |
ENHANCEMENT MODE |
FET Type |
N-Channel |
Current Rating |
9.9A |
Time@Peak Reflow Temperature-Max (s) |
40 |
Pin Count |
8 |
JESD-30 Code |
R-PDSO-G8 |
Qualification Status |
Not Qualified |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Peak Reflow Temperature (Cel) |
260 |
Reach Compliance Code |
unknown |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
15m Ω @ 4.1A, 4.5V |
Vgs(th) (Max) @ Id |
700mV @ 250μA |
Continuous Drain Current (ID) |
9A |
Drain Current-Max (Abs) (ID) |
9A |
Drain-source On Resistance-Max |
0.015Ohm |
RoHS Status |
Non-RoHS Compliant |
Lead Free |
Contains Lead |
Diodes Incorporated ZXM66P03N8TA
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Packaging |
Tape & Reel (TR) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Weight |
73.992255mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
6.25A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
4.5V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.56W Ta |
Turn Off Delay Time |
94.6 ns |
Peak Reflow Temperature (Cel) |
260 |
Factory Lead Time |
10 Weeks |
Published |
2006 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Resistance |
25mOhm |
Terminal Finish |
Matte Tin (Sn) |
Voltage - Rated DC |
-30V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Operating Temperature |
-55°C~150°C TJ |
Current Rating |
-7.9A |
Rise Time |
16.3ns |
Drain to Source Voltage (Vdss) |
30V |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Number of Channels |
1 |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
2.5W |
Turn On Delay Time |
7.6 ns |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
25m Ω @ 5.6A, 10V |
Vgs(th) (Max) @ Id |
1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1979pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs |
36nC @ 5V |
Time@Peak Reflow Temperature-Max (s) |
40 |
Pin Count |
8 |
Vgs (Max) |
±20V |
Fall Time (Typ) |
39.6 ns |
Continuous Drain Current (ID) |
7.9A |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
6.25A |
Drain to Source Breakdown Voltage |
-30V |
Height |
1.5mm |
Length |
5mm |
Width |
4mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Diodes Incorporated ZXMN10A08E6TA
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Packaging |
Tape & Reel (TR) |
Mounting Type |
Surface Mount |
Package / Case |
SOT-23-6 |
Number of Pins |
6 |
Weight |
14.996898mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.5A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.1W Ta |
Turn Off Delay Time |
8 ns |
Terminal Position |
DUAL |
Operating Temperature |
-55°C~150°C TJ |
Published |
2009 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
6 |
ECCN Code |
EAR99 |
Resistance |
250mOhm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
HIGH RELIABILITY |
Voltage - Rated DC |
100V |
Mount |
Surface Mount |
Factory Lead Time |
17 Weeks |
Gate Charge (Qg) (Max) @ Vgs |
7.7nC @ 10V |
Current Rating |
1.5A |
Number of Channels |
1 |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
1.7W |
Turn On Delay Time |
3.4 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
250m Ω @ 3.2A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
405pF @ 50V |
Rise Time |
2.2ns |
Vgs (Max) |
±20V |
Terminal Form |
GULL WING |
Fall Time (Typ) |
2.2 ns |
Continuous Drain Current (ID) |
3.5A |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
100V |
Height |
1.3mm |
Length |
3.1mm |
Width |
1.8mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Pin Count |
6 |
Lead Free |
Lead Free |
Diodes Incorporated ZXMN10A11KTC
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Published |
2010 |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Number of Pins |
3 |
Weight |
3.949996g |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
2.4A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
6V 10V |
Number of Elements |
1 |
Power Dissipation (Max) |
2.11W Ta |
Turn Off Delay Time |
7.4 ns |
Operating Temperature |
-55°C~150°C TJ |
Pin Count |
3 |
Factory Lead Time |
17 Weeks |
JESD-609 Code |
e3 |
Pbfree Code |
no |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
2 |
ECCN Code |
EAR99 |
Resistance |
350mOhm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
LOW THRESHOLD |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Packaging |
Tape & Reel (TR) |
JESD-30 Code |
R-PSSO-G2 |
Drain to Source Voltage (Vdss) |
100V |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
8.5W |
Case Connection |
DRAIN |
Turn On Delay Time |
2.7 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
350m Ω @ 2.6A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
274pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
5.4nC @ 10V |
Rise Time |
1.7ns |
Number of Channels |
1 |
Element Configuration |
Single |
Fall Time (Typ) |
3.5 ns |
Continuous Drain Current (ID) |
3.5A |
Threshold Voltage |
4V |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
2.4A |
Pulsed Drain Current-Max (IDM) |
9.9A |
Height |
2.39mm |
Length |
6.73mm |
Width |
6.22mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Diodes Incorporated ZXMN10A25GTA
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Time@Peak Reflow Temperature-Max (s) |
40 |
Mounting Type |
Surface Mount |
Package / Case |
TO-261-4, TO-261AA |
Weight |
7.994566mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
2.9A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
10V |
Number of Elements |
1 |
Power Dissipation (Max) |
2W Ta |
Turn Off Delay Time |
18 ns |
Operating Temperature |
-55°C~150°C TJ |
Published |
2006 |
JESD-609 Code |
e3 |
Packaging |
Tape & Reel (TR) |
Pbfree Code |
no |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Resistance |
125mOhm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
FAST SWITCHING |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Mount |
Surface Mount |
Factory Lead Time |
17 Weeks |
Rise Time |
3.7ns |
Vgs (Max) |
±20V |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
3.9W |
Case Connection |
DRAIN |
Turn On Delay Time |
4.9 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
125m Ω @ 2.9A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
859pF @ 50V |
Gate Charge (Qg) (Max) @ Vgs |
17nC @ 10V |
JESD-30 Code |
R-PDSO-G4 |
Pin Count |
4 |
Fall Time (Typ) |
9.4 ns |
Continuous Drain Current (ID) |
4A |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
2.9A |
Drain to Source Breakdown Voltage |
100V |
Height |
1.65mm |
Length |
6.7mm |
Width |
3.7mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Number of Channels |
1 |
Lead Free |
Lead Free |
Diodes Incorporated ZXMN2A01E6TA
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Terminal Form |
GULL WING |
Mounting Type |
Surface Mount |
Package / Case |
SOT-23-6 |
Number of Pins |
6 |
Weight |
14.996898mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
2.5A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
2.5V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.1W Ta |
Turn Off Delay Time |
7.47 ns |
Packaging |
Tape & Reel (TR) |
Published |
2006 |
Operating Temperature |
-55°C~150°C TJ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
6 |
ECCN Code |
EAR99 |
Resistance |
120mOhm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
LOW THRESHOLD |
Voltage - Rated DC |
20V |
Terminal Position |
DUAL |
Mount |
Surface Mount |
Factory Lead Time |
17 Weeks |
Gate Charge (Qg) (Max) @ Vgs |
3nC @ 4.5V |
Rise Time |
5.21ns |
Pin Count |
6 |
Number of Channels |
1 |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
1.7W |
Turn On Delay Time |
2.49 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
120m Ω @ 4A, 4.5V |
Vgs(th) (Max) @ Id |
700mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
303pF @ 15V |
Current Rating |
2.5A |
Peak Reflow Temperature (Cel) |
260 |
Vgs (Max) |
±12V |
Fall Time (Typ) |
5.21 ns |
Continuous Drain Current (ID) |
3.1A |
Gate to Source Voltage (Vgs) |
12V |
Drain to Source Breakdown Voltage |
20V |
Height |
1.3mm |
Length |
3.1mm |
Width |
1.8mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Time@Peak Reflow Temperature-Max (s) |
40 |
Lead Free |
Lead Free |
Diodes Incorporated ZXMN2A01FTA
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Packaging |
Tape & Reel (TR) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Number of Pins |
3 |
Weight |
7.994566mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
1.9A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
2.5V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
625mW Ta |
Turn Off Delay Time |
7.47 ns |
Peak Reflow Temperature (Cel) |
260 |
Operating Temperature |
-55°C~150°C TJ |
Published |
2002 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Resistance |
120mOhm |
Additional Feature |
LOW THRESHOLD |
Voltage - Rated DC |
20V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Contact Plating |
Tin |
Factory Lead Time |
17 Weeks |
Rise Time |
5.21ns |
Time@Peak Reflow Temperature-Max (s) |
40 |
Number of Channels |
1 |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
625mW |
Turn On Delay Time |
2.49 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
120m Ω @ 4A, 4.5V |
Vgs(th) (Max) @ Id |
700mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
303pF @ 15V |
Gate Charge (Qg) (Max) @ Vgs |
3nC @ 4.5V |
Vgs (Max) |
±12V |
Fall Time (Typ) |
5.21 ns |
Current Rating |
2.09A |
Continuous Drain Current (ID) |
2.2A |
Threshold Voltage |
700mV |
Gate to Source Voltage (Vgs) |
12V |
Drain to Source Breakdown Voltage |
20V |
Max Junction Temperature (Tj) |
150°C |
Height |
1.1mm |
Length |
3.04mm |
Width |
1.4mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Pin Count |
3 |
Lead Free |
Lead Free |
Diodes Incorporated ZXMN2A02N8TA
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Packaging |
Tape & Reel (TR) |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Weight |
73.992255mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
8.3A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
2.5V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
1.56W Ta |
Turn Off Delay Time |
33.3 ns |
Terminal Position |
DUAL |
Mount |
Surface Mount |
Published |
2012 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Resistance |
20mOhm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
LOW THRESHOLD |
Voltage - Rated DC |
20V |
Operating Temperature |
-55°C~150°C TJ |
Terminal Form |
GULL WING |
Vgs(th) (Max) @ Id |
700mV @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1900pF @ 10V |
Time@Peak Reflow Temperature-Max (s) |
40 |
Pin Count |
8 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Number of Channels |
1 |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
2.5W |
Turn On Delay Time |
7.9 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
20m Ω @ 11A, 4.5V |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
10.2A |
Gate Charge (Qg) (Max) @ Vgs |
18.9nC @ 4.5V |
Rise Time |
10ns |
Vgs (Max) |
±12V |
Fall Time (Typ) |
10 ns |
Continuous Drain Current (ID) |
10.2A |
Gate to Source Voltage (Vgs) |
12V |
Drain to Source Breakdown Voltage |
20V |
Pulsed Drain Current-Max (IDM) |
50A |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Diodes Incorporated ZXMN2AM832TA
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Current Rating |
3A |
Weight |
299.994654mg |
Number of Elements |
2 |
Turn Off Delay Time |
1.55 ns |
Packaging |
Cut Tape (CT) |
Published |
2006 |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Resistance |
120mOhm |
Number of Terminations |
8 |
Terminal Finish |
Matte Tin (Sn) |
Max Operating Temperature |
150°C |
Min Operating Temperature |
-55°C |
Additional Feature |
LOW THRESHOLD |
Voltage - Rated DC |
20V |
Max Power Dissipation |
1.7W |
Terminal Position |
DUAL |
Terminal Form |
FLAT |
Peak Reflow Temperature (Cel) |
260 |
Number of Pins |
8 |
Mount |
Surface Mount |
Continuous Drain Current (ID) |
2.9A |
Gate to Source Voltage (Vgs) |
12V |
Number of Channels |
2 |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
1.5W |
Turn On Delay Time |
2.31 ns |
Transistor Application |
SWITCHING |
Rise Time |
2.6ns |
Drain to Source Voltage (Vdss) |
20V |
Polarity/Channel Type |
N-CHANNEL |
Fall Time (Typ) |
1.31 ns |
Pin Count |
8 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Drain to Source Breakdown Voltage |
20V |
Input Capacitance |
299pF |
FET Technology |
METAL-OXIDE SEMICONDUCTOR |
Drain to Source Resistance |
120mOhm |
Rds On Max |
120 mΩ |
Height |
1mm |
Length |
3mm |
Width |
2mm |
RoHS Status |
ROHS3 Compliant |
Qualification Status |
Not Qualified |
Lead Free |
Lead Free |
Diodes Incorporated ZXMN2B01FTA
In stock
Manufacturer |
Diodes Incorporated |
---|---|
Packaging |
Tape & Reel (TR) |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Number of Pins |
3 |
Weight |
7.994566mg |
Transistor Element Material |
SILICON |
Current - Continuous Drain (Id) @ 25℃ |
2.1A Ta |
Drive Voltage (Max Rds On, Min Rds On) |
1.8V 4.5V |
Number of Elements |
1 |
Power Dissipation (Max) |
625mW Ta |
Turn Off Delay Time |
17.8 ns |
Peak Reflow Temperature (Cel) |
260 |
Operating Temperature |
-55°C~150°C TJ |
Published |
2006 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Resistance |
100mOhm |
Terminal Finish |
Matte Tin (Sn) |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Mount |
Surface Mount |
Factory Lead Time |
17 Weeks |
Rise Time |
3.6ns |
Pin Count |
3 |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
806mW |
Turn On Delay Time |
2.2 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
100m Ω @ 2.4A, 4.5V |
Vgs(th) (Max) @ Id |
1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
370pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs |
4.8nC @ 4.5V |
Drain to Source Voltage (Vdss) |
20V |
Vgs (Max) |
±8V |
Time@Peak Reflow Temperature-Max (s) |
40 |
Fall Time (Typ) |
3.6 ns |
Continuous Drain Current (ID) |
2.4A |
Gate to Source Voltage (Vgs) |
8V |
DS Breakdown Voltage-Min |
20V |
Height |
1.02mm |
Length |
3.04mm |
Width |
1.4mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Number of Channels |
1 |
Lead Free |
Lead Free |