Transistors - FETs/MOSFETs - Single

Infineon Technologies AUIRF2804STRL7P

In stock

SKU: AUIRF2804STRL7P-11
Manufacturer

Infineon Technologies

Packaging

Tape & Reel (TR)

Mounting Type

Surface Mount

Surface Mount

YES

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

240A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

330W Tc

Terminal Form

GULL WING

Factory Lead Time

16 Weeks

Published

2010

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

6

ECCN Code

EAR99

Terminal Position

SINGLE

Operating Temperature

-55°C~175°C TJ

Peak Reflow Temperature (Cel)

260

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

6930pF @ 25V

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Case Connection

DRAIN

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

1.6m Ω @ 160A, 10V

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G6

Gate Charge (Qg) (Max) @ Vgs

260nC @ 10V

Drain to Source Voltage (Vdss)

40V

Vgs (Max)

±20V

Drain Current-Max (Abs) (ID)

240A

Drain-source On Resistance-Max

0.0016Ohm

Pulsed Drain Current-Max (IDM)

1360A

DS Breakdown Voltage-Min

40V

Avalanche Energy Rating (Eas)

1050 mJ

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRF2804WL

In stock

SKU: AUIRF2804WL-11
Manufacturer

Infineon Technologies

Turn Off Delay Time

71 ns

Mounting Type

Through Hole

Package / Case

TO-262-3 Wide Leads

Number of Pins

3

Current - Continuous Drain (Id) @ 25℃

240A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Element Configuration

Single

Power Dissipation (Max)

300W Tc

Operating Temperature

-55°C~175°C TJ

Packaging

Tube

Published

2010

Series

HEXFET®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Mount

Through Hole

Factory Lead Time

16 Weeks

Fall Time (Typ)

100 ns

Turn On Delay Time

19 ns

Rds On (Max) @ Id, Vgs

1.8m Ω @ 187A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

7978pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

225nC @ 10V

Rise Time

241ns

Vgs (Max)

±20V

Continuous Drain Current (ID)

295A

Gate to Source Voltage (Vgs)

20V

Power Dissipation

300W

Drain Current-Max (Abs) (ID)

240A

Drain to Source Breakdown Voltage

40V

Height

9.65mm

Length

10.67mm

Width

4.83mm

Radiation Hardening

No

FET Type

N-Channel

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRF2903ZL

In stock

SKU: AUIRF2903ZL-11
Manufacturer

Infineon Technologies

Packaging

Tube

Mount

Through Hole

Mounting Type

Through Hole

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

160A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

231W Tc

Turn Off Delay Time

48 ns

Operating Mode

ENHANCEMENT MODE

Factory Lead Time

13 Weeks

Published

2007

Series

HEXFET®

JESD-609 Code

e3

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Terminal Position

SINGLE

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Temperature

-55°C~175°C TJ

Power Dissipation

231W

Continuous Drain Current (ID)

160A

Threshold Voltage

2V

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

2.4m Ω @ 75A, 10V

Vgs(th) (Max) @ Id

4V @ 150μA

Input Capacitance (Ciss) (Max) @ Vds

6320pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

240nC @ 10V

Rise Time

100ns

Vgs (Max)

±20V

Fall Time (Typ)

37 ns

Case Connection

DRAIN

Turn On Delay Time

24 ns

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.0024Ohm

Drain to Source Breakdown Voltage

30V

Nominal Vgs

2 V

Height

9.65mm

Length

10.67mm

Width

4.83mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

RoHS Compliant

Infineon Technologies AUIRF2903ZS

In stock

SKU: AUIRF2903ZS-11
Manufacturer

Infineon Technologies

Packaging

Tube

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

160A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

231W Tc

Turn Off Delay Time

48 ns

JESD-30 Code

R-PSSO-G2

Operating Temperature

-55°C~175°C TJ

Published

2010

Series

HEXFET®

JESD-609 Code

e3

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

Contact Plating

Tin

Factory Lead Time

16 Weeks

Vgs (Max)

±20V

Operating Mode

ENHANCEMENT MODE

Case Connection

DRAIN

Turn On Delay Time

24 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

2.4m Ω @ 75A, 10V

Vgs(th) (Max) @ Id

4V @ 150μA

Input Capacitance (Ciss) (Max) @ Vds

6320pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

240nC @ 10V

Rise Time

100ns

Fall Time (Typ)

37 ns

Continuous Drain Current (ID)

160A

Element Configuration

Single

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.0024Ohm

Drain to Source Breakdown Voltage

30V

Nominal Vgs

2 V

Height

4.83mm

Length

10.67mm

Width

9.65mm

Radiation Hardening

No

REACH SVHC

No SVHC

Power Dissipation

231W

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRF2903ZSTRL

In stock

SKU: AUIRF2903ZSTRL-11
Manufacturer

Infineon Technologies

Packaging

Tape & Reel (TR)

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

160A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

231W Tc

Turn Off Delay Time

48 ns

Peak Reflow Temperature (Cel)

260

Operating Temperature

-55°C~175°C TJ

Published

2013

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Position

SINGLE

Terminal Form

GULL WING

Mount

Surface Mount

Factory Lead Time

16 Weeks

Input Capacitance (Ciss) (Max) @ Vds

6320pF @ 25V

JESD-30 Code

R-PSSO-G2

Operating Mode

ENHANCEMENT MODE

Power Dissipation

231W

Case Connection

DRAIN

Turn On Delay Time

24 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

2.4m Ω @ 75A, 10V

Vgs(th) (Max) @ Id

4V @ 150μA

Gate Charge (Qg) (Max) @ Vgs

240nC @ 10V

Rise Time

100ns

Time@Peak Reflow Temperature-Max (s)

30

Vgs (Max)

±20V

Fall Time (Typ)

37 ns

Continuous Drain Current (ID)

160A

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.0024Ohm

Drain to Source Breakdown Voltage

30V

Pulsed Drain Current-Max (IDM)

1020A

Radiation Hardening

No

Configuration

SINGLE WITH BUILT-IN DIODE

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRF3004WL

In stock

SKU: AUIRF3004WL-11
Manufacturer

Infineon Technologies

Operating Mode

ENHANCEMENT MODE

Mount

Surface Mount, Through Hole

Mounting Type

Surface Mount

Package / Case

TO-262-3 Wide Leads

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

240A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Turn Off Delay Time

90 ns

Operating Temperature

-55°C~175°C TJ

Power Dissipation (Max)

375W Tc

Packaging

Tube

Published

2011

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Element Configuration

Single

Contact Plating

Tin

Factory Lead Time

16 Weeks

Threshold Voltage

2V

JEDEC-95 Code

TO-262AA

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

1.4m Ω @ 195A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

9450pF @ 32V

Gate Charge (Qg) (Max) @ Vgs

210nC @ 10V

Rise Time

220ns

Vgs (Max)

±20V

Fall Time (Typ)

130 ns

Continuous Drain Current (ID)

240A

Turn On Delay Time

19 ns

Power Dissipation

375W

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

40V

Avalanche Energy Rating (Eas)

470 mJ

Nominal Vgs

2 V

Height

11.3mm

Length

10.67mm

Width

4.83mm

Radiation Hardening

No

REACH SVHC

No SVHC

FET Type

N-Channel

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRF3007

In stock

SKU: AUIRF3007-11
Manufacturer

Infineon Technologies

Element Configuration

Single

Mounting Type

Through Hole

Package / Case

TO-220-3

Number of Pins

3

Current - Continuous Drain (Id) @ 25℃

75A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Turn Off Delay Time

55 ns

Operating Temperature

-55°C~175°C TJ

Power Dissipation (Max)

200W Tc

Packaging

Tube

Published

2010

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Mount

Through Hole

Factory Lead Time

8 Weeks

Fall Time (Typ)

49 ns

Continuous Drain Current (ID)

75A

Rds On (Max) @ Id, Vgs

12.6m Ω @ 48A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

3270pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

130nC @ 10V

Rise Time

80ns

Vgs (Max)

±20V

Turn On Delay Time

12 ns

Power Dissipation

200W

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

75V

Height

9.02mm

Length

10.67mm

Width

4.83mm

Radiation Hardening

No

FET Type

N-Channel

RoHS Status

RoHS Compliant

Infineon Technologies AUIRF3205ZS

In stock

SKU: AUIRF3205ZS-11
Manufacturer

Infineon Technologies

Packaging

Tube

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

75A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

170W Tc

Turn Off Delay Time

45 ns

Element Configuration

Single

Factory Lead Time

16 Weeks

Published

2010

Series

HEXFET®

JESD-609 Code

e3

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Operating Temperature

-55°C~175°C TJ

Operating Mode

ENHANCEMENT MODE

Continuous Drain Current (ID)

110A

Threshold Voltage

2V

Turn On Delay Time

18 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

6.5m Ω @ 66A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

3450pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

110nC @ 10V

Rise Time

95ns

Vgs (Max)

±20V

Fall Time (Typ)

67 ns

Power Dissipation

170W

Case Connection

DRAIN

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

75A

Drain-source On Resistance-Max

0.0065Ohm

Drain to Source Breakdown Voltage

55V

Pulsed Drain Current-Max (IDM)

440A

Avalanche Energy Rating (Eas)

250 mJ

Height

4.83mm

Length

10.67mm

Width

11.3mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRF3415

In stock

SKU: AUIRF3415-11
Manufacturer

Infineon Technologies

Case Connection

DRAIN

Mounting Type

Through Hole

Package / Case

TO-220-3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

43A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

200W Tc

Operating Temperature

-55°C~175°C TJ

Packaging

Tube

Turn Off Delay Time

71 ns

Published

2011

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Power Dissipation

200W

Mount

Through Hole

Factory Lead Time

8 Weeks

JEDEC-95 Code

TO-220AB

Gate to Source Voltage (Vgs)

20V

Rds On (Max) @ Id, Vgs

42m Ω @ 22A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2400pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

200nC @ 10V

Rise Time

55ns

Vgs (Max)

±20V

Fall Time (Typ)

69 ns

Continuous Drain Current (ID)

43A

Threshold Voltage

2V

FET Type

N-Channel

Turn On Delay Time

12 ns

Drain-source On Resistance-Max

0.042Ohm

Drain to Source Breakdown Voltage

150V

Avalanche Energy Rating (Eas)

590 mJ

Nominal Vgs

2 V

Height

16.51mm

Length

10.66mm

Width

4.82mm

Radiation Hardening

No

REACH SVHC

No SVHC

Transistor Application

SWITCHING

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRF3710Z

In stock

SKU: AUIRF3710Z-11
Manufacturer

Infineon Technologies

Operating Temperature

-55°C~175°C TJ

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

TO-220-3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

59A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

160W Tc

Power Dissipation

160W

Factory Lead Time

13 Weeks

Packaging

Tube

Published

2010

Series

HEXFET®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Turn Off Delay Time

41 ns

Turn On Delay Time

17 ns

JEDEC-95 Code

TO-220AB

Gate to Source Voltage (Vgs)

20V

Rds On (Max) @ Id, Vgs

18m Ω @ 35A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2900pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

120nC @ 10V

Rise Time

77ns

Vgs (Max)

±20V

Fall Time (Typ)

56 ns

Continuous Drain Current (ID)

59A

Threshold Voltage

2V

FET Type

N-Channel

Transistor Application

SWITCHING

Drain to Source Breakdown Voltage

100V

Pulsed Drain Current-Max (IDM)

240A

Avalanche Energy Rating (Eas)

200 mJ

Nominal Vgs

2 V

Height

9.017mm

Length

10.6426mm

Width

4.82mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

RoHS Compliant

Infineon Technologies AUIRF3710ZSTRL

In stock

SKU: AUIRF3710ZSTRL-11
Manufacturer

Infineon Technologies

JESD-30 Code

R-XSSO-G2

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

59A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

160W Tc

Turn Off Delay Time

41 ns

Packaging

Tape & Reel (TR)

Published

2010

Operating Temperature

-55°C~175°C TJ

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

ECCN Code

EAR99

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

Mount

Surface Mount

Factory Lead Time

16 Weeks

Fall Time (Typ)

56 ns

Continuous Drain Current (ID)

59A

Turn On Delay Time

17 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

18m Ω @ 35A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2900pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

120nC @ 10V

Rise Time

77ns

Vgs (Max)

±20V

Operating Mode

ENHANCEMENT MODE

Element Configuration

Single

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.018Ohm

Drain to Source Breakdown Voltage

100V

Pulsed Drain Current-Max (IDM)

240A

Avalanche Energy Rating (Eas)

200 mJ

Height

4.826mm

Length

10.668mm

Width

9.65mm

Radiation Hardening

No

Power Dissipation

160W

RoHS Status

ROHS3 Compliant

Infineon Technologies AUIRF3805L-7P

In stock

SKU: AUIRF3805L-7P-11
Manufacturer

Infineon Technologies

Packaging

Tube

Mounting Type

Through Hole

Package / Case

TO-262-7

Number of Pins

7

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

160A Tc

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

300W Tc

Turn Off Delay Time

80 ns

Configuration

SINGLE WITH BUILT-IN DIODE

Mount

Through Hole

Published

2010

Series

HEXFET®

JESD-609 Code

e3

Part Status

Not For New Designs

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

7

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn)

Terminal Position

SINGLE

Operating Temperature

-55°C~175°C TJ

Operating Mode

ENHANCEMENT MODE

Fall Time (Typ)

52 ns

Continuous Drain Current (ID)

240A

Turn On Delay Time

23 ns

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

2.6m Ω @ 140A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

7820pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

200nC @ 10V

Rise Time

130ns

Vgs (Max)

±20V

Power Dissipation

300W

Case Connection

DRAIN

Threshold Voltage

2V

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

55V

Avalanche Energy Rating (Eas)

680 mJ

Height

11.3mm

Length

10.67mm

Width

4.83mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant