Transistors - FETs/MOSFETs - Single

Infineon Technologies BSP322PH6327XTSA1

In stock

SKU: BSP322PH6327XTSA1-11
Manufacturer

Infineon Technologies

Pbfree Code

yes

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Cut Tape (CT)

Published

2012

Series

SIPMOS®

Element Configuration

Single

Factory Lead Time

10 Weeks

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

4

Number of Elements

1

Power Dissipation-Max

1.8W Ta

JESD-609 Code

e3

Operating Mode

ENHANCEMENT MODE

Drive Voltage (Max Rds On,Min Rds On)

4.5V 10V

Vgs (Max)

±20V

Turn On Delay Time

4.6 ns

FET Type

P-Channel

Rds On (Max) @ Id, Vgs

800m Ω @ 1A, 10V

Vgs(th) (Max) @ Id

1V @ 380μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

372pF @ 25V

Current - Continuous Drain (Id) @ 25°C

1A Tc

Gate Charge (Qg) (Max) @ Vgs

16.5nC @ 10V

Rise Time

4.3ns

Drain to Source Voltage (Vdss)

100V

Power Dissipation

1.8W

Case Connection

DRAIN

Fall Time (Typ)

8.3 ns

Turn-Off Delay Time

21.2 ns

Continuous Drain Current (ID)

1A

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

-100V

Drain Current-Max (Abs) (ID)

1A

Drain-source On Resistance-Max

0.8Ohm

Height

1.6mm

Length

6.5mm

Width

3.5mm

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies BSP324L6327HTSA1

In stock

SKU: BSP324L6327HTSA1-11
Manufacturer

Infineon Technologies

Turn Off Delay Time

17 ns

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

170mA Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

Additional Feature

LOGIC LEVEL COMPATIBLE

Mount

Surface Mount

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2008

Series

SIPMOS®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Power Dissipation (Max)

1.8W Ta

Terminal Position

DUAL

Vgs(th) (Max) @ Id

2.3V @ 94μA

Input Capacitance (Ciss) (Max) @ Vds

154pF @ 25V

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Power Dissipation

1.8W

Case Connection

DRAIN

Turn On Delay Time

4.6 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

25 Ω @ 170mA, 10V

Terminal Form

GULL WING

Pin Count

4

Gate Charge (Qg) (Max) @ Vgs

5.9nC @ 10V

Drain to Source Voltage (Vdss)

400V

Vgs (Max)

±20V

Fall Time (Typ)

68 ns

Continuous Drain Current (ID)

170mA

Gate to Source Voltage (Vgs)

20V

Pulsed Drain Current-Max (IDM)

0.68A

Radiation Hardening

No

RoHS Status

RoHS Compliant

Infineon Technologies BSP88H6327XTSA1

In stock

SKU: BSP88H6327XTSA1-11
Manufacturer

Infineon Technologies

Power Dissipation (Max)

1.8W Ta

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Supplier Device Package

PG-SOT223-4

Weight

250.212891mg

Current - Continuous Drain (Id) @ 25℃

350mA Ta

Drive Voltage (Max Rds On, Min Rds On)

2.8V 10V

Number of Channels

1

Factory Lead Time

10 Weeks

Turn Off Delay Time

17.9 ns

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2008

Series

SIPMOS®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

150°C

Min Operating Temperature

-55°C

Number of Elements

1

Power Dissipation

1.8W

Continuous Drain Current (ID)

350mA

Gate to Source Voltage (Vgs)

20V

Rds On (Max) @ Id, Vgs

6Ohm @ 350mA, 10V

Vgs(th) (Max) @ Id

1.4V @ 108μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

95pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

6.8nC @ 10V

Rise Time

3.5ns

Drain to Source Voltage (Vdss)

240V

Vgs (Max)

±20V

Fall Time (Typ)

18.9 ns

Turn On Delay Time

3.6 ns

FET Type

N-Channel

Max Dual Supply Voltage

240V

Drain to Source Breakdown Voltage

240V

Input Capacitance

76pF

Drain to Source Resistance

6Ohm

Rds On Max

600 mΩ

Height

1.6mm

Length

6.5mm

Width

3.5mm

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies BSP92PH6327XTSA1

In stock

SKU: BSP92PH6327XTSA1-11
Manufacturer

Infineon Technologies

Operating Mode

ENHANCEMENT MODE

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

4

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2002

Series

SIPMOS®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Pbfree Code

yes

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

LOGIC LEVEL COMPATIBLE

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

4

Number of Elements

1

Power Dissipation-Max

1.8W Ta

Element Configuration

Single

Contact Plating

Tin

Factory Lead Time

10 Weeks

Fall Time (Typ)

33 ns

Turn-Off Delay Time

67 ns

FET Type

P-Channel

Rds On (Max) @ Id, Vgs

12 Ω @ 260mA, 10V

Vgs(th) (Max) @ Id

2V @ 130μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

104pF @ 25V

Current - Continuous Drain (Id) @ 25°C

260mA Ta

Gate Charge (Qg) (Max) @ Vgs

5.4nC @ 10V

Rise Time

6ns

Drain to Source Voltage (Vdss)

250V

Drive Voltage (Max Rds On,Min Rds On)

2.8V 10V

Vgs (Max)

±20V

Case Connection

DRAIN

Power Dissipation

1.8W

Continuous Drain Current (ID)

260mA

Threshold Voltage

-1.5V

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

-250V

Drain Current-Max (Abs) (ID)

0.26A

Drain to Source Breakdown Voltage

-250V

Height

1.5mm

Length

6.5mm

Width

3.5mm

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Turn On Delay Time

5 ns

Lead Free

Lead Free

Infineon Technologies BSR202NL6327HTSA1

In stock

SKU: BSR202NL6327HTSA1-11
Manufacturer

Infineon Technologies

ECCN Code

EAR99

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

3.8A Ta

Drive Voltage (Max Rds On, Min Rds On)

2.5V 4.5V

Power Dissipation (Max)

500mW Ta

Operating Temperature

-55°C~150°C TJ

Number of Elements

1

Packaging

Tape & Reel (TR)

Published

2012

Series

OptiMOS™

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Contact Plating

Tin

Factory Lead Time

10 Weeks

Vgs(th) (Max) @ Id

1.2V @ 30μA

Input Capacitance (Ciss) (Max) @ Vds

1147pF @ 10V

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

3

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

21m Ω @ 3.8A, 4.5V

Terminal Position

DUAL

HTS Code

8541.21.00.95

Gate Charge (Qg) (Max) @ Vgs

8.8nC @ 4.5V

Rise Time

16.7ns

Vgs (Max)

±12V

Continuous Drain Current (ID)

3.8A

Gate to Source Voltage (Vgs)

12V

Max Dual Supply Voltage

20V

Drain-source On Resistance-Max

0.021Ohm

Feedback Cap-Max (Crss)

60 pF

Terminal Form

GULL WING

RoHS Status

ROHS3 Compliant

Infineon Technologies BSR315PH6327XTSA1

In stock

SKU: BSR315PH6327XTSA1-11
Manufacturer

Infineon Technologies

Turn On Delay Time

8 ns

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Supplier Device Package

PG-SC-59

Current - Continuous Drain (Id) @ 25℃

620mA Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Turn Off Delay Time

21 ns

Operating Temperature

-55°C~150°C TJ

Power Dissipation (Max)

500mW Ta

Packaging

Tape & Reel (TR)

Published

2013

Series

SIPMOS®

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Operating Temperature

150°C

Min Operating Temperature

-55°C

Mount

Surface Mount

Factory Lead Time

10 Weeks

Continuous Drain Current (ID)

620mA

Threshold Voltage

-1.5V

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

176pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

6nC @ 10V

Rise Time

28ns

Drain to Source Voltage (Vdss)

60V

Vgs (Max)

±20V

Fall Time (Typ)

20 ns

Rds On (Max) @ Id, Vgs

800mOhm @ 620mA, 10V

FET Type

P-Channel

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

-60V

Input Capacitance

176pF

Drain to Source Resistance

620mOhm

Rds On Max

800 mΩ

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Vgs(th) (Max) @ Id

2V @ 160μA

Lead Free

Lead Free

Infineon Technologies BSR316PL6327HTSA1

In stock

SKU: BSR316PL6327HTSA1-11
Manufacturer

Infineon Technologies

Operating Temperature

-55°C~150°C TJ

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

360mA Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

ECCN Code

EAR99

Power Dissipation (Max)

500mW Ta

Packaging

Tape & Reel (TR)

Published

2015

Series

SIPMOS®

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Mount

Surface Mount

Contact Plating

Tin

Rds On (Max) @ Id, Vgs

1.8 Ω @ 360mA, 10V

Terminal Form

GULL WING

Time@Peak Reflow Temperature-Max (s)

40

Pin Count

3

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Power Dissipation

500mW

FET Type

P-Channel

Vgs(th) (Max) @ Id

1V @ 170μA

Input Capacitance (Ciss) (Max) @ Vds

165pF @ 25V

Terminal Position

DUAL

Gate Charge (Qg) (Max) @ Vgs

7nC @ 10V

Rise Time

6ns

Drain to Source Voltage (Vdss)

100V

Vgs (Max)

±20V

Continuous Drain Current (ID)

360mA

Gate to Source Voltage (Vgs)

20V

Feedback Cap-Max (Crss)

20 pF

Peak Reflow Temperature (Cel)

260

RoHS Status

ROHS3 Compliant

Infineon Technologies BSR606NH6327XTSA1

In stock

SKU: BSR606NH6327XTSA1-11
Manufacturer

Infineon Technologies

Power Dissipation (Max)

500mW Ta

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

59

Current - Continuous Drain (Id) @ 25℃

2.3A Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

ECCN Code

EAR99

Factory Lead Time

12 Weeks

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2013

Series

Automotive, AEC-Q101, OptiMOS™

JESD-609 Code

e3

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Elements

1

Terminal Finish

Tin (Sn)

Input Capacitance (Ciss) (Max) @ Vds

657pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

5.6nC @ 5V

Element Configuration

Single

Power Dissipation

500mW

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

60m Ω @ 2.3A, 10V

Vgs(th) (Max) @ Id

2.3V @ 15μA

Halogen Free

Halogen Free

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Vgs (Max)

±20V

Continuous Drain Current (ID)

2.3A

Threshold Voltage

1.8V

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

60V

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies BSS123E6327

In stock

SKU: BSS123E6327-11
Manufacturer

Infineon Technologies

Packaging

Tape & Reel (TR)

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

170mA Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

Power Dissipation (Max)

360mW Ta

Voltage - Rated DC

100V

Mount

Surface Mount

Published

1999

Series

SIPMOS®

JESD-609 Code

e3

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn)

Additional Feature

LOGIC LEVEL COMPATIBLE

Operating Temperature

-55°C~150°C TJ

Terminal Position

DUAL

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

6 Ω @ 170mA, 10V

Current Rating

170mA

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

3

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Power Dissipation

360mW

FET Type

N-Channel

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Vgs(th) (Max) @ Id

1.8V @ 50μA

Input Capacitance (Ciss) (Max) @ Vds

69pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

2.67nC @ 10V

Rise Time

5ns

Vgs (Max)

±20V

Continuous Drain Current (ID)

170mA

Gate to Source Voltage (Vgs)

20V

Feedback Cap-Max (Crss)

6 pF

RoHS Status

RoHS Compliant

Lead Free

Contains Lead

Infineon Technologies BSS123NH6327XTSA1

In stock

SKU: BSS123NH6327XTSA1-11
Manufacturer

Infineon Technologies

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Cut Tape (CT)

Published

2012

Series

OptiMOS™

JESD-609 Code

e3

Pbfree Code

yes

Power Dissipation-Max

500mW Ta

Factory Lead Time

10 Weeks

Number of Terminations

3

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Additional Feature

LOGIC LEVEL COMPATIBLE

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

3

Number of Elements

1

Number of Channels

1

Part Status

Active

Element Configuration

Single

Fall Time (Typ)

22 ns

Turn-Off Delay Time

7.4 ns

Turn On Delay Time

2.3 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

6 Ω @ 190mA, 10V

Vgs(th) (Max) @ Id

1.8V @ 13μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

20.9pF @ 25V

Current - Continuous Drain (Id) @ 25°C

190mA Ta

Gate Charge (Qg) (Max) @ Vgs

0.9nC @ 10V

Rise Time

3.2ns

Drive Voltage (Max Rds On,Min Rds On)

4.5V 10V

Vgs (Max)

±20V

Operating Mode

ENHANCEMENT MODE

Power Dissipation

500mW

Continuous Drain Current (ID)

190mA

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

100V

Drain-source On Resistance-Max

6Ohm

Drain to Source Breakdown Voltage

100V

Max Junction Temperature (Tj)

150°C

Height

1.1mm

Length

2.9mm

Width

1.3mm

Radiation Hardening

No

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

Infineon Technologies BSS127 E6327

In stock

SKU: BSS127 E6327-11
Manufacturer

Infineon Technologies

Terminal Form

GULL WING

Surface Mount

YES

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

21mA Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

Power Dissipation (Max)

500mW Ta

Packaging

Tape & Reel (TR)

Published

2007

Operating Temperature

-55°C~150°C TJ

Series

SIPMOS®

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

HTS Code

8541.21.00.95

Terminal Position

DUAL

Package / Case

TO-236-3, SC-59, SOT-23-3

Mounting Type

Surface Mount

Vgs(th) (Max) @ Id

2.6V @ 8μA

Input Capacitance (Ciss) (Max) @ Vds

28pF @ 25V

Pin Count

3

JESD-30 Code

R-PDSO-G3

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

500 Ω @ 16mA, 10V

Reach Compliance Code

compliant

Peak Reflow Temperature (Cel)

260

Gate Charge (Qg) (Max) @ Vgs

1nC @ 10V

Drain to Source Voltage (Vdss)

600V

Vgs (Max)

±20V

Drain Current-Max (Abs) (ID)

0.021A

Drain-source On Resistance-Max

600Ohm

DS Breakdown Voltage-Min

600V

Feedback Cap-Max (Crss)

1.5 pF

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

RoHS Status

RoHS Compliant

Infineon Technologies BSS127H6327XTSA2

In stock

SKU: BSS127H6327XTSA2-11
Manufacturer

Infineon Technologies

Number of Elements

1

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2010

Series

SIPMOS®

Pbfree Code

yes

Part Status

Active

JESD-609 Code

e3

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Additional Feature

LOGIC LEVEL COMPATIBLE

Terminal Position

DUAL

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

3

Qualification Status

Not Qualified

Contact Plating

Tin

Factory Lead Time

10 Weeks

Drive Voltage (Max Rds On,Min Rds On)

4.5V 10V

Vgs (Max)

±20V

Power Dissipation

500mW

Turn On Delay Time

6.1 ns

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

500 Ω @ 16mA, 10V

Vgs(th) (Max) @ Id

2.6V @ 8μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

28pF @ 25V

Current - Continuous Drain (Id) @ 25°C

21mA Ta

Gate Charge (Qg) (Max) @ Vgs

1nC @ 10V

Rise Time

9.7ns

Element Configuration

Single

Power Dissipation-Max

500mW Ta

Turn-Off Delay Time

14 ns

Continuous Drain Current (ID)

21mA

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

600V

Drain-source On Resistance-Max

600Ohm

Height

1mm

Length

2.9mm

Width

1.3mm

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Operating Mode

ENHANCEMENT MODE

Lead Free

Lead Free