Showing 1261–1272 of 2118 results
Transistors - IGBTs - Modules
Microchip Technology APTGT400SK120G
In stock
Manufacturer |
Microchip Technology |
---|---|
Mfr |
Microchip Technology |
Mounting Type |
Chassis Mount |
Package / Case |
SP6 |
Number of Pins |
5 |
Supplier Device Package |
SP6 |
Mounting Style |
Chassis Mount |
Base Product Number |
APTGT400 |
Min Operating Temperature |
-40 °C |
Mount |
Chassis Mount, Screw |
Minimum Operating Temperature |
– 40 C |
Package |
Bulk |
Product Status |
Active |
Operating Temperature |
-40°C ~ 150°C (TJ) |
Packaging |
Tube |
Max Operating Temperature |
150 °C |
Maximum Operating Temperature |
+ 100 C |
Max Power Dissipation |
1.785 kW |
Voltage - Collector Emitter Breakdown (Max) |
1200 V |
Current - Collector (Ic) (Max) |
560 A |
Power - Max |
1785 W |
Input |
Standard |
Collector Emitter Voltage (VCEO) |
1.2 kV |
Max Collector Current |
560 A |
Current - Collector Cutoff (Max) |
750 µA |
Collector Emitter Breakdown Voltage |
1.2 kV |
Configuration |
Single |
Element Configuration |
Single |
Input Capacitance |
28 nF |
Vce(on) (Max) @ Vge, Ic |
2.1V @ 15V, 400A |
Continuous Collector Current |
560 |
IGBT Type |
Trench Field Stop |
NTC Thermistor |
No |
Input Capacitance (Cies) @ Vce |
28 nF @ 25 V |
Radiation Hardening |
No |
Microchip Technology APTGT400U120D4G
In stock
Manufacturer |
Microchip Technology |
---|---|
Unit Weight |
12.345887 oz |
Package / Case |
D4-5 |
Number of Pins |
4 |
Supplier Device Package |
D4 |
Base Product Number |
APTGT400 |
Collector- Emitter Voltage VCEO Max |
1.2 kV |
Collector-Emitter Breakdown Voltage |
1.2 kV |
Factory Pack QuantityFactory Pack Quantity |
1 |
Maximum Gate Emitter Voltage |
20 V |
Current-Collector (Ic) (Max) |
600 A |
Maximum Operating Temperature |
+ 125 C |
Mfr |
Microchip Technology |
Minimum Operating Temperature |
– 40 C |
Mounting Styles |
Chassis Mount |
Package |
Bulk |
Pd - Power Dissipation |
1.785 kW |
Product Status |
Active |
Mounting Type |
Chassis Mount |
Mount |
Chassis Mount, Screw |
Collector Emitter Voltage (VCEO) |
1.2 kV |
Max Collector Current |
600 A |
Min Operating Temperature |
-40 °C |
Max Power Dissipation |
2.25 kW |
Configuration |
Single |
Element Configuration |
Single |
Power Dissipation |
1.785 |
Power - Max |
2250 W |
Input |
Standard |
Packaging |
Bulk |
Operating Temperature |
-40°C ~ 150°C (TJ) |
Current - Collector Cutoff (Max) |
8 mA |
Voltage - Collector Emitter Breakdown (Max) |
1200 V |
Input Capacitance |
28 nF |
Vce(on) (Max) @ Vge, Ic |
2.1V @ 15V, 400A |
Continuous Collector Current |
650 |
IGBT Type |
Trench Field Stop |
NTC Thermistor |
No |
Max Operating Temperature |
150 °C |
Input Capacitance (Cies) @ Vce |
28 nF @ 25 V |
Microchip Technology APTGT450DA60G
In stock
Manufacturer |
Microchip Technology |
---|---|
Factory Pack QuantityFactory Pack Quantity |
1 |
Mounting Type |
Chassis Mount |
Package / Case |
SP6 |
Number of Pins |
5 |
Supplier Device Package |
SP6 |
Base Product Number |
APTGT450 |
Collector- Emitter Voltage VCEO Max |
600 V |
Collector-Emitter Breakdown Voltage |
600 V |
Unit Weight |
3.880136 oz |
Mount |
Chassis Mount, Screw |
Maximum Gate Emitter Voltage |
20 V |
Maximum Operating Temperature |
+ 100 C |
Mfr |
Microchip Technology |
Minimum Operating Temperature |
– 40 C |
Mounting Styles |
Chassis Mount |
Package |
Bulk |
Pd - Power Dissipation |
1.75 kW |
Product Status |
Active |
Current-Collector (Ic) (Max) |
550 A |
Operating Temperature |
-40°C ~ 175°C (TJ) |
Collector Emitter Voltage (VCEO) |
600 V |
Max Collector Current |
550 A |
Min Operating Temperature |
-40 °C |
Max Power Dissipation |
1.75 kW |
Configuration |
Single |
Element Configuration |
Single |
Power Dissipation |
1.75 |
Power - Max |
1750 W |
Input |
Standard |
Packaging |
Tube |
Max Operating Temperature |
175 °C |
Current - Collector Cutoff (Max) |
500 µA |
Voltage - Collector Emitter Breakdown (Max) |
600 V |
Input Capacitance |
37 nF |
Vce(on) (Max) @ Vge, Ic |
1.8V @ 15V, 450A |
Continuous Collector Current |
550 |
IGBT Type |
Trench Field Stop |
NTC Thermistor |
No |
Input Capacitance (Cies) @ Vce |
37 nF @ 25 V |
Radiation Hardening |
No |
Microchip Technology APTGT50H60T1G
In stock
Manufacturer |
Microchip Technology |
---|---|
Max Power Dissipation |
176 W |
Mounting Type |
Chassis Mount |
Package / Case |
SP1-12 |
Number of Pins |
1 |
Supplier Device Package |
SP1 |
Mounting Style |
Chassis Mount |
Base Product Number |
APTGT50 |
Maximum Operating Temperature |
+ 100 C |
Mfr |
Microchip Technology |
Minimum Operating Temperature |
– 40 C |
Package |
Bulk |
Product Status |
Active |
Operating Temperature |
-40°C ~ 175°C (TJ) |
Packaging |
Tube |
Mount |
Chassis Mount, Screw |
Power - Max |
176 W |
Configuration |
Full Bridge |
Input |
Standard |
Collector Emitter Voltage (VCEO) |
1.9 V |
Max Collector Current |
80 A |
Current - Collector Cutoff (Max) |
250 µA |
Collector Emitter Breakdown Voltage |
600 V |
Voltage - Collector Emitter Breakdown (Max) |
600 V |
Current - Collector (Ic) (Max) |
80 A |
Input Capacitance |
3.15 nF |
Vce(on) (Max) @ Vge, Ic |
1.9V @ 15V, 50A |
Continuous Collector Current |
80 |
IGBT Type |
Trench Field Stop |
NTC Thermistor |
Yes |
Input Capacitance (Cies) @ Vce |
3.15 nF @ 25 V |
Radiation Hardening |
No |
Microchip Technology APTGT50SK170T1G
In stock
Manufacturer |
Microchip Technology |
---|---|
Base Product Number |
APTGT50 |
Mounting Type |
Chassis Mount |
Package / Case |
SP-1 |
Surface Mount |
NO |
Number of Pins |
12 |
Supplier Device Package |
SP1 |
Number of Terminals |
12 |
Transistor Element Material |
SILICON |
Moisture Sensitivity Levels |
1 |
Mounting Styles |
Chassis Mount |
Collector- Emitter Voltage VCEO Max |
1.7 kV |
Current-Collector (Ic) (Max) |
75 A |
Factory Pack QuantityFactory Pack Quantity |
1 |
Ihs Manufacturer |
MICROSEMI CORP |
Manufacturer Part Number |
APTGT50SK170T1G |
Maximum Gate Emitter Voltage |
20 V |
Maximum Operating Temperature |
+ 150 C |
Minimum Operating Temperature |
– 40 C |
JESD-609 Code |
e1 |
Collector-Emitter Breakdown Voltage |
1.7 kV |
Pd - Power Dissipation |
312 W |
Operating Temperature-Max |
150 °C |
Package |
Bulk |
Package Body Material |
UNSPECIFIED |
Package Description |
FLANGE MOUNT, R-XUFM-T12 |
Package Shape |
RECTANGULAR |
Package Style |
FLANGE MOUNT |
Part Life Cycle Code |
Active |
Number of Elements |
1 |
Reflow Temperature-Max (s) |
NOT SPECIFIED |
Product Status |
Active |
Risk Rank |
2.15 |
Rohs Code |
Yes |
Turn-off Time-Nom (toff) |
1100 ns |
Turn-on Time-Nom (ton) |
450 ns |
Unit Weight |
2.821917 oz |
Operating Temperature |
-40°C ~ 150°C (TJ) |
Packaging |
Tube |
Mfr |
Microchip Technology |
Mount |
Chassis Mount, Screw |
JESD-30 Code |
R-XUFM-T12 |
Reach Compliance Code |
compliant |
Polarity/Channel Type |
N-CHANNEL |
Max Operating Temperature |
150 °C |
Min Operating Temperature |
-40 °C |
Max Power Dissipation |
312 W |
Terminal Position |
UPPER |
Terminal Form |
THROUGH-HOLE |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Input |
Standard |
ECCN Code |
EAR99 |
Pin Count |
12 |
Qualification Status |
Not Qualified |
Configuration |
Single |
Element Configuration |
Single |
Power Dissipation |
312 |
Case Connection |
ISOLATED |
Power - Max |
312 W |
Transistor Application |
MOTOR CONTROL |
Collector Emitter Voltage (VCEO) |
1.7 kV |
Collector-Emitter Voltage-Max |
1700 V |
Pbfree Code |
Yes |
Collector Current-Max (IC) |
75 A |
Terminal Finish |
TIN SILVER COPPER |
Operating Temperature Range |
– 40 C to + 150 C |
Current - Collector Cutoff (Max) |
250 µA |
Voltage - Collector Emitter Breakdown (Max) |
1700 V |
Input Capacitance |
4.4 nF |
Power Dissipation-Max (Abs) |
312 W |
Vce(on) (Max) @ Vge, Ic |
2.4V @ 15V, 50A |
Continuous Collector Current |
75 |
Width |
40.8 mm |
Max Collector Current |
75 A |
IGBT Type |
Trench Field Stop |
NTC Thermistor |
Yes |
Gate-Emitter Voltage-Max |
20 V |
Input Capacitance (Cies) @ Vce |
4.4 nF @ 25 V |
VCEsat-Max |
2.4 V |
Height |
11.5 mm |
Length |
51.6 mm |
Radiation Hardening |
No |
Microchip Technology APTGT600DU60G
In stock
Manufacturer |
Microchip Technology |
---|---|
Transistor Element Material |
SILICON |
Mounting Type |
Chassis Mount |
Package / Case |
SP6 |
Surface Mount |
NO |
Number of Pins |
7 |
Supplier Device Package |
SP6 |
Number of Terminals |
7 |
Mfr |
Microchip Technology |
Minimum Operating Temperature |
– 40 C |
Base Product Number |
APTGT600 |
Collector-Emitter Breakdown Voltage |
600 V |
Current-Collector (Ic) (Max) |
700 A |
Factory Pack QuantityFactory Pack Quantity |
1 |
Ihs Manufacturer |
MICROSEMI CORP |
Manufacturer Part Number |
APTGT600DU60G |
Maximum Gate Emitter Voltage |
20 V |
Maximum Operating Temperature |
+ 100 C |
Turn-on Time-Nom (ton) |
205 ns |
Mount |
Chassis Mount, Screw |
Package Shape |
RECTANGULAR |
Mounting Styles |
Chassis Mount |
Number of Elements |
2 |
Operating Temperature-Max |
175 °C |
Package |
Bulk |
Package Body Material |
UNSPECIFIED |
Package Description |
FLANGE MOUNT, R-XUFM-X7 |
Moisture Sensitivity Levels |
1 |
Part Life Cycle Code |
Active |
Package Style |
FLANGE MOUNT |
Pd - Power Dissipation |
2.3 kW |
Product Status |
Active |
Reflow Temperature-Max (s) |
NOT SPECIFIED |
Risk Rank |
5.22 |
Rohs Code |
Yes |
Turn-off Time-Nom (toff) |
400 ns |
Collector- Emitter Voltage VCEO Max |
600 V |
Unit Weight |
3.880136 oz |
Terminal Position |
UPPER |
Additional Feature |
AVALANCHE RATED |
JESD-609 Code |
e1 |
Pbfree Code |
Yes |
ECCN Code |
EAR99 |
Terminal Finish |
TIN SILVER COPPER |
Max Operating Temperature |
175 °C |
Min Operating Temperature |
-40 °C |
Element Configuration |
Dual |
Power Dissipation |
2.3 |
Max Power Dissipation |
2.3 kW |
Terminal Form |
UNSPECIFIED |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
compliant |
Pin Count |
7 |
JESD-30 Code |
R-XUFM-X7 |
Qualification Status |
Not Qualified |
Configuration |
Dual |
Operating Temperature |
-40°C ~ 175°C (TJ) |
Packaging |
Tube |
Current - Collector Cutoff (Max) |
750 µA |
Power - Max |
2300 W |
Transistor Application |
POWER CONTROL |
Polarity/Channel Type |
N-CHANNEL |
Input |
Standard |
Collector Emitter Voltage (VCEO) |
600 V |
Max Collector Current |
700 A |
Case Connection |
ISOLATED |
Input Capacitance |
49 nF |
Voltage - Collector Emitter Breakdown (Max) |
600 V |
Vce(on) (Max) @ Vge, Ic |
1.8V @ 15V, 600A |
Collector Current-Max (IC) |
500 A |
Continuous Collector Current |
700 |
IGBT Type |
Trench Field Stop |
Collector-Emitter Voltage-Max |
600 V |
NTC Thermistor |
No |
Input Capacitance (Cies) @ Vce |
49 nF @ 25 V |
Microchip Technology APTGT600U170D4G
In stock
Manufacturer |
Microchip Technology |
---|---|
Pd - Power Dissipation |
2.9 kW |
Package / Case |
D4-5 |
Supplier Device Package |
D4 |
Base Product Number |
APTGT600 |
Collector- Emitter Voltage VCEO Max |
1.7 kV |
Current-Collector (Ic) (Max) |
1100 A |
Factory Pack QuantityFactory Pack Quantity |
1 |
Maximum Gate Emitter Voltage |
20 V |
Maximum Operating Temperature |
+ 125 C |
Mfr |
Microchip Technology |
Minimum Operating Temperature |
– 40 C |
Mounting Styles |
Chassis Mount |
Package |
Bulk |
Mounting Type |
Chassis Mount |
Unit Weight |
12.345887 oz |
Product Status |
Active |
Operating Temperature |
-40°C ~ 150°C (TJ) |
Packaging |
Bulk |
Configuration |
Single |
Power Dissipation |
2.9 |
Power - Max |
2900 W |
Input |
Standard |
Current - Collector Cutoff (Max) |
1 mA |
Voltage - Collector Emitter Breakdown (Max) |
1700 V |
Vce(on) (Max) @ Vge, Ic |
2.4V @ 15V, 600A |
Continuous Collector Current |
1.1 |
IGBT Type |
Trench Field Stop |
NTC Thermistor |
No |
Input Capacitance (Cies) @ Vce |
51 nF @ 25 V |
Microchip Technology APTGT75H120TG
In stock
Manufacturer |
Microchip Technology |
---|---|
Pd - Power Dissipation |
357 W |
Package / Case |
SP4 |
Supplier Device Package |
SP4 |
Base Product Number |
APTGT75 |
Collector- Emitter Voltage VCEO Max |
1.2 kV |
Current-Collector (Ic) (Max) |
110 A |
Factory Pack QuantityFactory Pack Quantity |
1 |
Maximum Gate Emitter Voltage |
20 V |
Maximum Operating Temperature |
+ 125 C |
Mfr |
Microchip Technology |
Minimum Operating Temperature |
– 40 C |
Mounting Styles |
Chassis Mount |
Package |
Bulk |
Mounting Type |
Chassis Mount |
Unit Weight |
3.880136 oz |
Product Status |
Active |
Operating Temperature |
-40°C ~ 150°C (TJ) |
Packaging |
Tube |
Configuration |
Full Bridge |
Power Dissipation |
357 |
Power - Max |
357 W |
Input |
Standard |
Current - Collector Cutoff (Max) |
250 µA |
Voltage - Collector Emitter Breakdown (Max) |
1200 V |
Vce(on) (Max) @ Vge, Ic |
2.1V @ 15V, 75A |
Continuous Collector Current |
110 |
IGBT Type |
Trench Field Stop |
NTC Thermistor |
Yes |
Input Capacitance (Cies) @ Vce |
5.34 nF @ 25 V |
Microchip Technology APTGT75TL60T3G
In stock
Manufacturer |
Microchip Technology |
---|---|
Operating Temperature |
-40°C ~ 175°C (TJ) |
Package / Case |
SP3-32 |
Supplier Device Package |
SP3 |
Mounting Style |
Chassis Mount |
Base Product Number |
APTGT75 |
Maximum Operating Temperature |
+ 100 C |
Mfr |
Microchip Technology |
Minimum Operating Temperature |
– 40 C |
Package |
Tube |
Product Status |
Active |
Mounting Type |
Chassis Mount |
Configuration |
Three Level Inverter |
Packaging |
Tube |
Power - Max |
250 W |
Input |
Standard |
Current - Collector Cutoff (Max) |
250 µA |
Voltage - Collector Emitter Breakdown (Max) |
600 V |
Current - Collector (Ic) (Max) |
100 A |
Vce(on) (Max) @ Vge, Ic |
1.9V @ 15V, 75A |
Continuous Collector Current |
75 |
IGBT Type |
Trench Field Stop |
NTC Thermistor |
Yes |
Input Capacitance (Cies) @ Vce |
4.62 nF @ 25 V |
Microchip Technology APTLGT400A608G
In stock
Manufacturer |
Microchip Technology |
---|---|
Maximum Operating Temperature |
+ 85 C |
Part Life Cycle Code |
Active |
Package |
Bulk |
Operating Temperature-Max |
150 °C |
Number of Elements |
1 |
Mounting Styles |
Chassis Mount |
Minimum Operating Temperature |
– 40 C |
Pd - Power Dissipation |
1.25 kW |
Mfr |
Microchip Technology |
Manufacturer Part Number |
APTLGT400A608G |
Ihs Manufacturer |
MICROSEMI CORP |
Factory Pack QuantityFactory Pack Quantity |
1 |
Collector- Emitter Voltage VCEO Max |
600 V |
Base Product Number |
APTLGT400 |
Package / Case |
LP8 |
Mounting Type |
Through Hole |
Risk Rank |
5.7 |
Voltage |
600 V |
Collector-Emitter Voltage-Max |
600 V |
Continuous Collector Current |
600 |
Collector Current-Max (IC) |
600 A |
Power Dissipation-Max (Abs) |
1250 W |
Power Dissipation |
1.25 |
Current |
600 A |
Configuration |
Dual |
Product Status |
Active |
Voltage - Isolation |
2500Vrms |
Reach Compliance Code |
compliant |
Type |
IGBT |
ECCN Code |
EAR99 |
Packaging |
Bulk |
Rohs Code |
Yes |
VCEsat-Max |
1.9 V |
Microchip Technology MSCGL40X120T3AG
In stock
Manufacturer |
Microchip |
---|---|
Mounting Type |
Chassis Mount |
Package / Case |
Module |
Supplier Device Package |
SP3F |
Base Product Number |
MSCGL40 |
Brand |
Microchip Technology / Atmel |
Mfr |
Microchip Technology |
Package |
Tube |
Product Status |
Active |
Packaging |
Tube |
Series |
MSC |
Type |
Three Phase |
Subcategory |
Discrete Semiconductor Modules |
Technology |
Si |
Configuration |
Full Bridge |
Input |
Standard |
Product Type |
Discrete Semiconductor Modules |
Current - Collector Cutoff (Max) |
40 A |
Voltage - Collector Emitter Breakdown (Max) |
1200 V |
Current - Collector (Ic) (Max) |
40 A |
IGBT Type |
Trench |
NTC Thermistor |
Yes |
Product Category |
Discrete Semiconductor Modules |