Showing 1153–1164 of 2118 results
Microchip APTGF150A120T3WG
In stock
| Manufacturer |
Microsemi Corporation |
|---|---|
| Package Shape |
RECTANGULAR |
| Number of Terminals |
9 |
| Transistor Element Material |
SILICON |
| Ihs Manufacturer |
MICROSEMI CORP |
| Manufacturer Part Number |
APTGF150A120T3WG |
| Operating Temp Range |
-40C to 85C |
| Operating Temperature-Max |
150 °C |
| Package Body Material |
UNSPECIFIED |
| Turn-on Time-Nom (ton) |
190 ns |
| Package Description |
FLANGE MOUNT, R-XUFM-X9 |
| Package Style |
FLANGE MOUNT |
| Part Life Cycle Code |
Obsolete |
| Product Depth (mm) |
2.5(mm) |
| Rad Hardened |
No |
| Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Risk Rank |
5.73 |
| Rohs Code |
Yes |
| Turn-off Time-Nom (toff) |
390 ns |
| Surface Mount |
NO |
| Package / Case |
CSON |
| Case Connection |
ISOLATED |
| Subcategory |
Insulated Gate BIP Transistors |
| Terminal Form |
UNSPECIFIED |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Reach Compliance Code |
compliant |
| Pin Count |
25 |
| JESD-30 Code |
R-XUFM-X9 |
| Qualification Status |
Not Qualified |
| Number of Elements |
2 |
| Transistor Application |
POWER CONTROL |
| Polarity/Channel Type |
N-CHANNEL |
| ECCN Code |
EAR99 |
| Screening Level |
Industrial |
| Power Dissipation-Max (Abs) |
961 W |
| Collector Current-Max (IC) |
210 A |
| Collector-Emitter Voltage-Max |
1200 V |
| Gate-Emitter Voltage-Max |
20 V |
| VCEsat-Max |
3.7 V |
| Product Length (mm) |
3.2(mm) |
| Terminal Position |
UPPER |
| Product Height (mm) |
1.05(mm) |
Microchip APTGF150A120TG
In stock
| Manufacturer |
Microsemi Corporation |
|---|---|
| Package Description |
FLANGE MOUNT, R-XUFM-X12 |
| Package / Case |
SP4 |
| Surface Mount |
NO |
| Supplier Device Package |
SP4 |
| Number of Terminals |
12 |
| Transistor Element Material |
SILICON |
| Ihs Manufacturer |
MICROSEMI CORP |
| Manufacturer Part Number |
APTGF150A120TG |
| Mfr |
Omron Automation and Safety |
| Moisture Sensitivity Level |
1 |
| Operating Temperature-Max |
150 °C |
| Package |
Bulk |
| Pbfree Code |
Yes |
| Mounting Type |
Chassis Mount |
| Package Shape |
RECTANGULAR |
| Package Style |
FLANGE MOUNT |
| Part Life Cycle Code |
Obsolete |
| Part Package Code |
MODULE |
| Product Status |
Active |
| Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Risk Rank |
5.71 |
| Rohs Code |
Yes |
| Turn-off Time-Nom (toff) |
390 ns |
| Turn-on Time-Nom (ton) |
190 ns |
| Series |
* |
| JESD-609 Code |
e1 |
| Package Body Material |
UNSPECIFIED |
| ECCN Code |
EAR99 |
| Transistor Application |
MOTOR CONTROL |
| Polarity/Channel Type |
N-CHANNEL |
| Terminal Position |
UPPER |
| Terminal Form |
UNSPECIFIED |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Reach Compliance Code |
compliant |
| Pin Count |
12 |
| JESD-30 Code |
R-XUFM-X12 |
| Qualification Status |
Not Qualified |
| Number of Elements |
2 |
| Configuration |
Half Bridge |
| Case Connection |
ISOLATED |
| Power - Max |
961 W |
| Terminal Finish |
TIN SILVER COPPER |
| Subcategory |
Insulated Gate BIP Transistors |
| Input |
Standard |
| Current - Collector Cutoff (Max) |
350 µA |
| Voltage - Collector Emitter Breakdown (Max) |
1200 V |
| Current - Collector (Ic) (Max) |
200 A |
| Power Dissipation-Max (Abs) |
961 W |
| Vce(on) (Max) @ Vge, Ic |
3.7V @ 15V, 150A |
| Collector Current-Max (IC) |
200 A |
| IGBT Type |
NPT |
| Collector-Emitter Voltage-Max |
1200 V |
| NTC Thermistor |
Yes |
| Gate-Emitter Voltage-Max |
20 V |
| Input Capacitance (Cies) @ Vce |
10.2 nF @ 25 V |
| VCEsat-Max |
3.7 V |
Microchip APTGF165SK60D1G
In stock
| Manufacturer |
Microchip |
|---|---|
| Contact Material |
Copper Alloy |
| Contact Plating |
50 microinches Gold Plate |
| Mount |
Chassis Mount, Screw |
| Number of Pins |
5 |
| Shell Material |
Stainless Steel |
| Insert Material |
Hard Dielectric |
| Insert Arrangement |
C98 |
| Service Rating |
I |
| Max Operating Temperature |
150 °C |
| Min Operating Temperature |
-40 °C |
| Max Power Dissipation |
730 W |
| Shielding |
Yes |
| Contact Style |
Socket |
| Contact Size |
10#20 |
| Sealing |
Meets IP67 |
| Element Configuration |
Single |
| Input |
Standard |
| Collector Emitter Voltage (VCEO) |
600 V |
| Max Collector Current |
230 A |
| Collector Emitter Breakdown Voltage |
600 V |
| Input Capacitance |
9 nF |
| Shell Plating |
Passivated |
| NTC Thermistor |
No |
| Radiation Hardening |
No |
Microchip APTGF180DU60TG
In stock
| Manufacturer |
Royalohm |
|---|---|
| Min Operating Temperature |
-40 °C |
| Mounting Style |
PCB Mount |
| Brand |
Royalohm |
| Case Code - in |
0402 |
| Case Code - mm |
1005 |
| Factory Pack Quantity:Factory Pack Quantity |
10000 |
| Minimum Operating Temperature |
– 55 C |
| Unit Weight |
0.000020 oz |
| Maximum Operating Temperature |
+ 155 C |
| Packaging |
Reel |
| Series |
High Precision Thin Film |
| Tolerance |
0.25 % |
| Temperature Coefficient |
50 PPM / C |
| Resistance |
3.83 kOhms |
| Max Operating Temperature |
150 °C |
| Number of Pins |
20 |
| Mount |
Chassis Mount, Screw |
| Max Collector Current |
220 A |
| Collector Emitter Breakdown Voltage |
600 V |
| Technology |
Thin Film |
| Termination Style |
SMD/SMT |
| Element Configuration |
Dual |
| Input |
Standard |
| Product Type |
Thin Film Resistors |
| Collector Emitter Voltage (VCEO) |
600 V |
| Power Rating |
62.5 mW (1/16 W) |
| Subcategory |
Resistors |
| Input Capacitance |
8.6 nF |
| NTC Thermistor |
Yes |
| Voltage Rating |
25 V |
| Product Category |
Thin Film Resistors – SMD |
| Height |
0.35 mm |
| Length |
1 mm |
| Max Power Dissipation |
833 W |
| Width |
0.5 mm |
Microchip APTGF180H60G
In stock
| Manufacturer |
Cooper |
|---|---|
| Mount |
Chassis Mount, Screw |
| Mounting Type |
Chassis Mount |
| Package / Case |
SP6 |
| Number of Pins |
12 |
| Supplier Device Package |
SP6 |
| Manufacturer Part Number |
79903817054 |
| Mfr |
Microchip Technology |
| Package |
Bulk |
| Product Status |
Obsolete |
| Max Operating Temperature |
150 °C |
| Min Operating Temperature |
-40 °C |
| Max Power Dissipation |
833 W |
| Configuration |
Full Bridge Inverter |
| Power - Max |
833 W |
| Input |
Standard |
| Collector Emitter Voltage (VCEO) |
600 V |
| Max Collector Current |
220 A |
| Current - Collector Cutoff (Max) |
300 µA |
| Collector Emitter Breakdown Voltage |
600 V |
| Voltage - Collector Emitter Breakdown (Max) |
600 V |
| Current - Collector (Ic) (Max) |
220 A |
| Input Capacitance |
8.6 nF |
| Vce(on) (Max) @ Vge, Ic |
2.5V @ 15V, 180A |
| IGBT Type |
NPT |
| NTC Thermistor |
No |
| Input Capacitance (Cies) @ Vce |
8.6 nF @ 25 V |
| Radiation Hardening |
No |
| Lead Free |
Lead Free |
Microchip APTGF200DA120D3G
In stock
| Manufacturer |
Microchip |
|---|---|
| Mount |
Chassis Mount, Screw |
| Number of Pins |
11 |
| Max Operating Temperature |
150 °C |
| Min Operating Temperature |
-40 °C |
| Max Power Dissipation |
1.4 kW |
| Element Configuration |
Single |
| Input |
Standard |
| Collector Emitter Voltage (VCEO) |
1.2 kV |
| Max Collector Current |
300 A |
| Collector Emitter Breakdown Voltage |
1.2 kV |
| Input Capacitance |
13 nF |
| NTC Thermistor |
No |
Microchip APTGF200SK120D3G
In stock
| Manufacturer |
Microchip |
|---|---|
| Mount |
Chassis Mount, Screw |
| Number of Pins |
11 |
| Mfr |
PEI-Genesis |
| Package |
Bulk |
| Product Status |
Active |
| Series |
* |
| Max Operating Temperature |
150 °C |
| Min Operating Temperature |
-40 °C |
| Max Power Dissipation |
1.4 kW |
| Element Configuration |
Single |
| Input |
Standard |
| Collector Emitter Voltage (VCEO) |
1.2 kV |
| Max Collector Current |
300 A |
| Collector Emitter Breakdown Voltage |
1.2 kV |
| Input Capacitance |
13 nF |
| NTC Thermistor |
No |
Microchip APTGF200U120DG
In stock
| Manufacturer |
Honeywell-Microswitch |
|---|---|
| Package Style |
FLANGE MOUNT |
| Surface Mount |
NO |
| Number of Pins |
5 |
| Number of Terminals |
5 |
| Transistor Element Material |
SILICON |
| Ihs Manufacturer |
MICROSEMI CORP |
| Manufacturer Part Number |
APTGF200U120DG |
| Moisture Sensitivity Level |
1 |
| Operating Temperature-Max |
150 °C |
| Package Body Material |
UNSPECIFIED |
| Package Description |
FLANGE MOUNT, R-XUFM-X5 |
| Max Operating Temperature |
150 °C |
| Mount |
Chassis Mount, Screw |
| Part Life Cycle Code |
Obsolete |
| Part Package Code |
MODULE |
| Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Risk Rank |
5.72 |
| Rohs Code |
Yes |
| Turn-off Time-Nom (toff) |
400 ns |
| Turn-on Time-Nom (ton) |
100 ns |
| JESD-609 Code |
e1 |
| Pbfree Code |
Yes |
| ECCN Code |
EAR99 |
| Terminal Finish |
TIN SILVER COPPER |
| Package Shape |
RECTANGULAR |
| Min Operating Temperature |
-40 °C |
| Case Connection |
ISOLATED |
| Transistor Application |
GENERAL PURPOSE SWITCHING |
| Terminal Position |
UPPER |
| Terminal Form |
UNSPECIFIED |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Reach Compliance Code |
compliant |
| Pin Count |
5 |
| JESD-30 Code |
R-XUFM-X5 |
| Qualification Status |
Not Qualified |
| Number of Elements |
1 |
| Configuration |
SINGLE WITH BUILT-IN DIODE |
| Element Configuration |
Single |
| Subcategory |
Insulated Gate BIP Transistors |
| Max Power Dissipation |
1.136 kW |
| Polarity/Channel Type |
N-CHANNEL |
| Input |
Standard |
| Collector Emitter Voltage (VCEO) |
1.2 kV |
| Max Collector Current |
275 A |
| Collector Emitter Breakdown Voltage |
1.2 kV |
| Input Capacitance |
13.8 nF |
| Power Dissipation-Max (Abs) |
1130 W |
| Collector Current-Max (IC) |
275 A |
| Collector-Emitter Voltage-Max |
1200 V |
| NTC Thermistor |
No |
| Gate-Emitter Voltage-Max |
20 V |
| VCEsat-Max |
3.7 V |
Microchip APTGF25DSK120T3G
In stock
| Manufacturer |
Microsemi Corporation |
|---|---|
| JESD-609 Code |
e1 |
| Transistor Element Material |
SILICON |
| Ihs Manufacturer |
MICROSEMI CORP |
| Manufacturer Part Number |
APTGF25DSK120T3G |
| Moisture Sensitivity Level |
1 |
| Operating Temperature-Max |
150 °C |
| Package Body Material |
UNSPECIFIED |
| Package Shape |
RECTANGULAR |
| Package Style |
FLANGE MOUNT |
| Package Description |
FLANGE MOUNT, R-XUFM-X25 |
| Part Life Cycle Code |
Obsolete |
| Part Package Code |
MODULE |
| Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Risk Rank |
5.73 |
| Rohs Code |
Yes |
| Turn-off Time-Nom (toff) |
386 ns |
| Turn-on Time-Nom (ton) |
110 ns |
| Number of Terminals |
25 |
| Surface Mount |
NO |
| Qualification Status |
Not Qualified |
| Number of Elements |
2 |
| Subcategory |
Insulated Gate BIP Transistors |
| Terminal Position |
UPPER |
| Terminal Form |
UNSPECIFIED |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Reach Compliance Code |
compliant |
| Pin Count |
25 |
| JESD-30 Code |
R-XUFM-X25 |
| ECCN Code |
EAR99 |
| Pbfree Code |
Yes |
| Case Connection |
ISOLATED |
| Transistor Application |
MOTOR CONTROL |
| Polarity/Channel Type |
N-CHANNEL |
| Power Dissipation-Max (Abs) |
208 W |
| Collector Current-Max (IC) |
40 A |
| Collector-Emitter Voltage-Max |
1200 V |
| Gate-Emitter Voltage-Max |
20 V |
| Terminal Finish |
TIN SILVER COPPER |
| VCEsat-Max |
3.7 V |
Microchip APTGF300DU120G
In stock
| Manufacturer |
Microsemi Corporation |
|---|---|
| Package Shape |
RECTANGULAR |
| Surface Mount |
NO |
| Number of Terminals |
7 |
| Transistor Element Material |
SILICON |
| Ihs Manufacturer |
MICROSEMI CORP |
| Manufacturer Part Number |
APTGF300DU120G |
| Moisture Sensitivity Level |
1 |
| Operating Temp Range |
-20C to 70C |
| Operating Temperature-Max |
150 °C |
| Package Body Material |
UNSPECIFIED |
| Turn-on Time-Nom (ton) |
190 ns |
| Package / Case |
CSON |
| Package Style |
FLANGE MOUNT |
| Part Life Cycle Code |
Obsolete |
| Part Package Code |
MODULE |
| Product Depth (mm) |
2.5(mm) |
| Rad Hardened |
No |
| Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Risk Rank |
5.73 |
| Rohs Code |
Yes |
| Turn-off Time-Nom (toff) |
400 ns |
| Package Description |
FLANGE MOUNT, R-XUFM-X7 |
| JESD-609 Code |
e1 |
| Number of Elements |
2 |
| Case Connection |
ISOLATED |
| Terminal Finish |
TIN SILVER COPPER |
| Subcategory |
Insulated Gate BIP Transistors |
| Terminal Position |
UPPER |
| Terminal Form |
UNSPECIFIED |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Reach Compliance Code |
compliant |
| Pin Count |
7 |
| JESD-30 Code |
R-XUFM-X7 |
| Qualification Status |
Not Qualified |
| Pbfree Code |
Yes |
| ECCN Code |
EAR99 |
| Transistor Application |
POWER CONTROL |
| Polarity/Channel Type |
N-CHANNEL |
| Screening Level |
COMMERCIALC |
| Power Dissipation-Max (Abs) |
1780 W |
| Collector Current-Max (IC) |
400 A |
| Collector-Emitter Voltage-Max |
1200 V |
| Gate-Emitter Voltage-Max |
20 V |
| VCEsat-Max |
3.9 V |
| Product Length (mm) |
3.2(mm) |
| Product Height (mm) |
1.05(mm) |
Microchip APTGF300SK120G
In stock
| Manufacturer |
Microchip |
|---|---|
| Capacitance |
390pF |
| Supplier Device Package |
SP6 |
| Dielectric Material |
CERAMIC |
| Number of Terminals |
2 |
| Manufacturer Series |
1210 |
| Mfr |
Microchip Technology |
| Operating Temperature-Min |
-55 |
| Package |
Bulk |
| Operating Temperature-Max |
125 |
| Package Style |
SMT |
| Product Status |
Obsolete |
| Series |
SIZE(MID/HIGH VOLT) |
| JESD-609 Code |
e2 |
| Temperature Coefficient |
-/+30ppm/Cel |
| Terminal Finish |
Tin/Nickel/Copper (Sn/Ni/Cu) |
| Package / Case |
SP6 |
| Mounting Type |
Chassis Mount |
| Voltage - Collector Emitter Breakdown (Max) |
1200 V |
| Current - Collector (Ic) (Max) |
400 A |
| Multilayer |
Yes |
| Configuration |
Single |
| Size Code |
1210 |
| Power - Max |
1780 W |
| Input |
Standard |
| Current - Collector Cutoff (Max) |
500 µA |
| Capacitor Type |
CERAMIC CAPACITOR |
| Packing Method |
TR, Plastic, 7 Inch |
| Vce(on) (Max) @ Vge, Ic |
3.9V @ 15V, 300A |
| IGBT Type |
NPT |
| NTC Thermistor |
No |
| Input Capacitance (Cies) @ Vce |
21 nF @ 25 V |
| Height |
0.95 |
| Length |
3.2 |
| Temperature Characteristics Code |
NP0 |
| Width |
2.5 |