Showing 1165–1176 of 2118 results

Transistors - IGBTs - Modules

Microchip APTGF30H60T1G

In stock

SKU: APTGF30H60T1G-9
Manufacturer

Microchip

Operating Temperature-Max

125

Package / Case

SP1

Terminal Shape

WRAPAROUND

Mounting Feature

SURFACE MOUNT

Supplier Device Package

SP1

Dielectric Material

CERAMIC

Number of Terminals

2

Manufacturer Series

1812

Terminal Finish

TIN OVER NICKEL

Mounting Type

Chassis Mount

Operating Temperature-Min

-55

Package

Bulk

Package Shape

RECTANGULAR PACKAGE

Package Style

SMT

Product Status

Obsolete

Series

SIZE(MID/HIGH VOLT)

JESD-609 Code

e3

Temperature Coefficient

15%

Mfr

Microchip Technology

Capacitance

0.0012uF

Input

Standard

Current - Collector Cutoff (Max)

250 µA

Temperature Characteristics Code

X7R

Multilayer

Yes

Configuration

Full Bridge Inverter

Size Code

1812

Positive Tolerance

20

Negative Tolerance

20

Power - Max

140 W

Packing Method

TR, PLASTIC, 7 INCH

Capacitor Type

CERAMIC CAPACITOR

Voltage - Collector Emitter Breakdown (Max)

600 V

Current - Collector (Ic) (Max)

42 A

Vce(on) (Max) @ Vge, Ic

2.45V @ 15V, 30A

IGBT Type

NPT

NTC Thermistor

Yes

Input Capacitance (Cies) @ Vce

1.35 nF @ 25 V

Height

1.25

Length

4.5

Width

3.2

Microchip APTGF330A60D3G

In stock

SKU: APTGF330A60D3G-9
Manufacturer

Brady

JESD-609 Code

e1

Transistor Element Material

SILICON

Ihs Manufacturer

MICROSEMI CORP

Manufacturer Part Number

50287

Moisture Sensitivity Level

1

Operating Temperature-Max

150 °C

Package Body Material

UNSPECIFIED

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Package Description

FLANGE MOUNT, R-XUFM-X7

Part Life Cycle Code

Obsolete

Part Package Code

MODULE

Reflow Temperature-Max (s)

NOT SPECIFIED

Risk Rank

5.73

Rohs Code

Yes

Turn-off Time-Nom (toff)

325 ns

Turn-on Time-Nom (ton)

230 ns

Number of Terminals

7

Surface Mount

NO

Qualification Status

Not Qualified

Number of Elements

2

Subcategory

Insulated Gate BIP Transistors

Terminal Position

UPPER

Terminal Form

UNSPECIFIED

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Pin Count

7

JESD-30 Code

R-XUFM-X7

ECCN Code

EAR99

Pbfree Code

Yes

Case Connection

ISOLATED

Transistor Application

POWER CONTROL

Polarity/Channel Type

N-CHANNEL

Power Dissipation-Max (Abs)

1560 W

Collector Current-Max (IC)

460 A

Collector-Emitter Voltage-Max

600 V

Gate-Emitter Voltage-Max

20 V

Terminal Finish

TIN SILVER COPPER

VCEsat-Max

2.45 V

Microchip APTGF330DA60D3G

In stock

SKU: APTGF330DA60D3G-9
Manufacturer

Microchip

Microchip APTGF350DU60G

In stock

SKU: APTGF350DU60G-9
Manufacturer

Microchip

Microchip APTGF500U60D4G

In stock

SKU: APTGF500U60D4G-9
Manufacturer

Microsemi Corporation

ECCN Code

EAR99

Surface Mount

NO

Supplier Device Package

D4

Number of Terminals

4

Transistor Element Material

SILICON

Ihs Manufacturer

MICROSEMI CORP

Manufacturer Part Number

APTGF500U60D4G

Mfr

Microchip Technology

Moisture Sensitivity Level

1

Operating Temperature-Max

150 °C

Package

Bulk

Package Description

FLANGE MOUNT, R-XUFM-X4

Package Shape

RECTANGULAR

Package Body Material

UNSPECIFIED

Package Style

FLANGE MOUNT

Part Life Cycle Code

Obsolete

Part Package Code

MODULE

Product Status

Obsolete

Reflow Temperature-Max (s)

NOT SPECIFIED

Risk Rank

5.73

Rohs Code

Yes

Turn-off Time-Nom (toff)

500 ns

Turn-on Time-Nom (ton)

285 ns

JESD-609 Code

e1

Pbfree Code

Yes

Package / Case

D4

Mounting Type

Chassis Mount

Polarity/Channel Type

N-CHANNEL

Input

Standard

Terminal Form

UNSPECIFIED

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Pin Count

4

JESD-30 Code

R-XUFM-X4

Qualification Status

Not Qualified

Number of Elements

1

Configuration

Single

Case Connection

ISOLATED

Power - Max

2000 W

Transistor Application

POWER CONTROL

Subcategory

Insulated Gate BIP Transistors

Terminal Finish

TIN SILVER COPPER

Current - Collector Cutoff (Max)

500 µA

Voltage - Collector Emitter Breakdown (Max)

600 V

Current - Collector (Ic) (Max)

625 A

Power Dissipation-Max (Abs)

2200 W

Vce(on) (Max) @ Vge, Ic

2.45V @ 15V, 500A

Collector Current-Max (IC)

625 A

IGBT Type

NPT

Collector-Emitter Voltage-Max

600 V

NTC Thermistor

No

Gate-Emitter Voltage-Max

20 V

Input Capacitance (Cies) @ Vce

26 nF @ 25 V

Terminal Position

UPPER

VCEsat-Max

2.45 V

Microchip APTGF50DDA60T3G

In stock

SKU: APTGF50DDA60T3G-9
Manufacturer

Microchip

Mounting Type

Chassis Mount

Package / Case

SP3

Supplier Device Package

SP3

Mfr

Microchip Technology

Package

Bulk

Product Status

Obsolete

Configuration

Dual Boost Chopper

Power - Max

250 W

Input

Standard

Current - Collector Cutoff (Max)

250 µA

Voltage - Collector Emitter Breakdown (Max)

600 V

Current - Collector (Ic) (Max)

65 A

Vce(on) (Max) @ Vge, Ic

2.45V @ 15V, 50A

IGBT Type

NPT

NTC Thermistor

Yes

Input Capacitance (Cies) @ Vce

2.2 nF @ 25 V

Microchip APTGF50H60T3G

In stock

SKU: APTGF50H60T3G-9
Manufacturer

Microchip

Mounting Type

Chassis Mount

Package / Case

SP3

Supplier Device Package

SP3

Mfr

Microchip Technology

Package

Bulk

Product Status

Obsolete

Configuration

Full Bridge Inverter

Power - Max

250 W

Input

Standard

Current - Collector Cutoff (Max)

250 µA

Voltage - Collector Emitter Breakdown (Max)

600 V

Current - Collector (Ic) (Max)

65 A

Vce(on) (Max) @ Vge, Ic

2.45V @ 15V, 50A

IGBT Type

NPT

NTC Thermistor

Yes

Input Capacitance (Cies) @ Vce

2.2 nF @ 25 V

Microchip APTGF50VDA60T3G

In stock

SKU: APTGF50VDA60T3G-9
Manufacturer

Microchip

Mount

Chassis Mount, Through Hole

Mounting Type

Chassis Mount

Package / Case

SP3

Number of Pins

20

Supplier Device Package

SP3

Mfr

Microchip Technology

Package

Bulk

Product Status

Obsolete

Max Operating Temperature

150 °C

Min Operating Temperature

-40 °C

Max Power Dissipation

250 W

Configuration

Dual Boost Chopper

Element Configuration

Dual

Power - Max

250 W

Input

Standard

Collector Emitter Voltage (VCEO)

600 V

Max Collector Current

65 A

Current - Collector Cutoff (Max)

250 µA

Collector Emitter Breakdown Voltage

600 V

Voltage - Collector Emitter Breakdown (Max)

600 V

Current - Collector (Ic) (Max)

65 A

Input Capacitance

2.2 nF

Vce(on) (Max) @ Vge, Ic

2.45V @ 15V, 50A

IGBT Type

NPT

NTC Thermistor

Yes

Input Capacitance (Cies) @ Vce

2.2 nF @ 25 V

Microchip APTGF530U120D4G

In stock

SKU: APTGF530U120D4G-9
Manufacturer

Microchip

Series

F²MC-16LX MB90560

Package / Case

64-LQFP

Supplier Device Package

64-LQFP (12×12)

Base Product Number

MB90561

Data Converters

A/D 8×8/10b

Mfr

Infineon Technologies

Package

Tray

Product Status

Obsolete

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Number of I/O

51

Oscillator Type

External

Speed

16MHz

RAM Size

1K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Core Processor

F²MC-16LX

Peripherals

POR, WDT

Program Memory Type

Mask ROM

Core Size

16-Bit

Program Memory Size

32KB (32K x 8)

Connectivity

UART/USART

Microchip APTGL180A1202G

In stock

SKU: APTGL180A1202G-9
Manufacturer

Microsemi Corporation

Ihs Manufacturer

MICROSEMI CORP

Manufacturer Part Number

APTGL180A1202G

Operating Temperature-Max

175 °C

Package Description

,

Part Life Cycle Code

Obsolete

Risk Rank

8.62

Rohs Code

Yes

ECCN Code

EAR99

Subcategory

Insulated Gate BIP Transistors

Reach Compliance Code

compliant

Number of Elements

1

Power Dissipation-Max (Abs)

750 W

Collector Current-Max (IC)

220 A

Collector-Emitter Voltage-Max

1200 V

Gate-Emitter Voltage-Max

20 V

VCEsat-Max

2.2 V

Microchip APTGL325SK120D3G

In stock

SKU: APTGL325SK120D3G-9
Manufacturer

Microchip

Mount

Chassis Mount, Screw

Number of Pins

11

Max Operating Temperature

175 °C

Min Operating Temperature

-40 °C

Max Power Dissipation

1.5 kW

Element Configuration

Single

Input

Standard

Collector Emitter Voltage (VCEO)

1.2 kV

Max Collector Current

420 A

Collector Emitter Breakdown Voltage

1.2 kV

Input Capacitance

18.6 nF

NTC Thermistor

No

Microchip APTGT100A170D1G

In stock

SKU: APTGT100A170D1G-9
Manufacturer

Microsemi Corporation

Package Description

FLANGE MOUNT, R-XUFM-X7

Mounting Type

Surface Mount

Package / Case

4-SMD, No Lead

Surface Mount

NO

Number of Terminals

7

Transistor Element Material

SILICON

Height - Seated (Max)

0.031 (0.80mm)

Ihs Manufacturer

MICROSEMI CORP

Manufacturer Part Number

APTGT100A170D1G

Mfr

SiTime

Moisture Sensitivity Level

1

Operating Temperature-Max

150 °C

Package

Strip

JESD-609 Code

e1

Mount

Chassis Mount

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Part Life Cycle Code

Obsolete

Part Package Code

MODULE

Product Status

Active

Reflow Temperature-Max (s)

NOT SPECIFIED

Risk Rank

5.64

Rohs Code

Yes

Turn-off Time-Nom (toff)

1200 ns

Turn-on Time-Nom (ton)

400 ns

Operating Temperature

-20°C ~ 70°C

Series

SiT1602B

Package Body Material

UNSPECIFIED

Pbfree Code

Yes

Base Resonator

MEMS

Current - Supply (Max)

4.5mA

Max Power Dissipation

695 W

Voltage - Supply

2.25V ~ 3.63V

Terminal Position

UPPER

Terminal Form

UNSPECIFIED

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Frequency

18.432 MHz

Frequency Stability

±50ppm

Output

HCMOS, LVCMOS

Pin Count

7

JESD-30 Code

R-XUFM-X7

Function

Enable/Disable

Type

XO (Standard)

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Qualification Status

Not Qualified

Number of Elements

2

Case Connection

ISOLATED

Transistor Application

MOTOR CONTROL

Polarity/Channel Type

N-CHANNEL

Input

Standard

Collector Emitter Voltage (VCEO)

2.4 V

Max Collector Current

200 A

Collector Emitter Breakdown Voltage

1.7 kV

Input Capacitance

8.5 nF

Collector Current-Max (IC)

200 A

Collector-Emitter Voltage-Max

1700 V

NTC Thermistor

No