Showing 517–528 of 1266 results
NXP Semiconductors BSR56,215-RP100*3902397
In stock
| Manufacturer |
NXP Semiconductors |
|---|---|
| Minimum Operating Temperature (°C) |
-65 |
| Automotive |
No |
| ECCN (US) |
EAR99 |
| Lead Shape |
Gull-wing |
| Maximum Continuous Drain Current (mA) |
50 |
| Maximum Drain Gate Voltage (V) |
40 |
| Maximum Drain Source Voltage (V) |
40 |
| Maximum Gate Source Voltage (V) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Maximum Power Dissipation (mW) |
250 |
| Military |
No |
| Material |
Si |
| Package Height |
1(Max) |
| Mounting |
Surface Mount |
| Package Length |
3(Max) |
| Package Width |
1.4(Max) |
| PCB changed |
3 |
| Standard Package Name |
SOT-23 |
| Supplier Package |
TO-236AB |
| Packaging |
Tape and Reel |
| Part Status |
Obsolete |
| Pin Count |
3 |
| Configuration |
Single |
| Channel Type |
N |
| RoHS Status |
RoHS Compliant |
NXP USA Inc. BF545B
In stock
| Manufacturer |
NXP Semiconductors |
|---|---|
| Surface Mount |
YES |
| Number of Terminals |
3 |
| Transistor Element Material |
SILICON |
| Package Shape |
RECTANGULAR |
| JESD-609 Code |
e3 |
| Pbfree Code |
Yes |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Subcategory |
Other Transistors |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
260 |
| Reach Compliance Code |
compliant |
| Pin Count |
3 |
| JESD-30 Code |
R-PDSO-G3 |
| Qualification Status |
Not Qualified |
| Number of Elements |
1 |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Transistor Application |
SWITCHING |
| Polarity/Channel Type |
N-CHANNEL |
| JEDEC-95 Code |
TO-236AB |
| DS Breakdown Voltage-Min |
30 V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.25 W |
| Highest Frequency Band |
VERY HIGH FREQUENCY BAND |
NXP USA Inc. BFR30,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Peak Reflow Temperature (Cel) |
260 |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| JESD-609 Code |
e3 |
| Part Status |
Obsolete |
| Published |
1997 |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Mounting Type |
Surface Mount |
| Factory Lead Time |
8 Weeks |
| Input Capacitance (Ciss) (Max) @ Vds |
4pF @ 10V |
| Drain to Source Voltage (Vdss) |
25V |
| JESD-30 Code |
R-PDSO-G3 |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
250mW |
| FET Type |
N-Channel |
| Transistor Application |
AMPLIFIER |
| Base Part Number |
BFR30 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| DS Breakdown Voltage-Min |
25V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.3W |
| Feedback Cap-Max (Crss) |
1.5 pF |
| Current - Drain (Idss) @ Vds (Vgs=0) |
4mA @ 10V |
| Voltage - Cutoff (VGS off) @ Id |
5V @ 0.5nA |
| Current Drain (Id) - Max |
10mA |
| Pin Count |
3 |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. BFR30,235
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Base Part Number |
BFR30 |
| Mounting Type |
Surface Mount |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
1997 |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Factory Lead Time |
8 Weeks |
| Power - Max |
250mW |
| Pin Count |
3 |
| FET Type |
N-Channel |
| Input Capacitance (Ciss) (Max) @ Vds |
4pF @ 10V |
| Drain to Source Voltage (Vdss) |
25V |
| Source Url Status Check Date |
2013-06-14 00:00:00 |
| Current - Drain (Idss) @ Vds (Vgs=0) |
4mA @ 10V |
| Voltage - Cutoff (VGS off) @ Id |
5V @ 0.5nA |
| Current Drain (Id) - Max |
10mA |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. BFR31,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Peak Reflow Temperature (Cel) |
260 |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| JESD-609 Code |
e3 |
| Part Status |
Obsolete |
| Published |
1997 |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Mounting Type |
Surface Mount |
| Factory Lead Time |
8 Weeks |
| Input Capacitance (Ciss) (Max) @ Vds |
4pF @ 10V |
| Drain to Source Voltage (Vdss) |
25V |
| JESD-30 Code |
R-PDSO-G3 |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
250mW |
| FET Type |
N-Channel |
| Transistor Application |
AMPLIFIER |
| Base Part Number |
BFR31 |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| DS Breakdown Voltage-Min |
25V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.3W |
| Feedback Cap-Max (Crss) |
1.5 pF |
| Current - Drain (Idss) @ Vds (Vgs=0) |
1mA @ 10V |
| Voltage - Cutoff (VGS off) @ Id |
2.5V @ 0.5nA |
| Current Drain (Id) - Max |
10mA |
| Pin Count |
3 |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. BFR31,235
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Factory Lead Time |
8 Weeks |
| Mounting Type |
Surface Mount |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Surface Mount |
YES |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
1997 |
| JESD-609 Code |
e3 |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Terminal Finish |
Tin (Sn) |
| Base Part Number |
BFR31 |
| Pin Count |
3 |
| Power - Max |
250mW |
| FET Type |
N-Channel |
| Input Capacitance (Ciss) (Max) @ Vds |
4pF @ 10V |
| Drain to Source Voltage (Vdss) |
25V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.3W |
| Source Url Status Check Date |
2013-06-14 00:00:00 |
| Current - Drain (Idss) @ Vds (Vgs=0) |
1mA @ 10V |
| Voltage - Cutoff (VGS off) @ Id |
2.5V @ 0.5nA |
| Current Drain (Id) - Max |
10mA |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. BFT46
In stock
| Manufacturer |
Philips Semiconductors |
|---|---|
| Reach Compliance Code |
unknown |
| Surface Mount |
YES |
| Number of Pins |
3 |
| Packaging |
Cut Tape |
| JESD-609 Code |
e3 |
| Terminal Finish |
Matte Tin (Sn) |
| Max Operating Temperature |
150 °C |
| Min Operating Temperature |
-65 °C |
| Subcategory |
Other Transistors |
| Mount |
Surface Mount |
| Power Dissipation |
250 mW |
| Element Configuration |
Single |
| Polarity/Channel Type |
N-CHANNEL |
| Continuous Drain Current (ID) |
10 mA |
| Gate to Source Voltage (Vgs) |
2 V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.25 W |
| Height |
1 mm |
| Length |
3 mm |
| Width |
1.4 mm |
| REACH SVHC |
No SVHC |
NXP USA Inc. BFT46,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Terminal Form |
260 |
| Mounting Type |
TO-236-3, SC-59, SOT-23-3 |
| Package / Case |
YES |
| Weight |
SILICON |
| Mfr |
1 |
| Product Status |
150°C TJ |
| Operating Temperature |
Tape & Reel (TR) |
| Series |
e3 |
| Pbfree Code |
Obsolete |
| Packaging |
1997 |
| Part Status |
1 (Unlimited) |
| Moisture Sensitivity Level (MSL) |
3 |
| Termination |
EAR99 |
| Type |
Tin (Sn) |
| Additional Feature |
8541.21.00.95 |
| Max Power Dissipation |
DUAL |
| Terminal Position |
GULL WING |
| Mount |
Surface Mount |
| Factory Lead Time |
8 Weeks |
| Transistor Application |
5pF @ 10V |
| Input Capacitance (Ciss) (Max) @ Vds |
25V |
| Pin Count |
R-PDSO-G3 |
| JESD-30 Code |
Not Qualified |
| Qualification Status |
SINGLE |
| Element Configuration |
DEPLETION MODE |
| Power Dissipation |
250mW |
| Power - Max |
N-Channel |
| FET Type |
AMPLIFIER |
| Time@Peak Reflow Temperature-Max (s) |
BFT46 |
| Current Rating |
40 |
| Input Capacitance |
25V |
| DS Breakdown Voltage-Min |
JUNCTION |
| FET Technology |
0.25W |
| Drain to Source Resistance |
1.5 pF |
| Highest Frequency Band |
200μA @ 10V |
| Current - Drain (Idss) @ Vds (Vgs=0) |
1.2V @ 0.5nA |
| Power Gain-Min (Gp) |
10mA |
| Base Part Number |
3 |
| REACH SVHC |
ROHS3 Compliant |
NXP USA Inc. BSR56,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
1997 |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| JESD-609 Code |
e3 |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
260 |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Mounting Type |
Surface Mount |
| DS Breakdown Voltage-Min |
40V |
| FET Technology |
JUNCTION |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
250mW |
| FET Type |
N-Channel |
| Transistor Application |
SWITCHING |
| Drain-source On Resistance-Max |
25Ohm |
| Pin Count |
3 |
| Base Part Number |
BSR56 |
| Power Dissipation-Max (Abs) |
0.3W |
| Feedback Cap-Max (Crss) |
5 pF |
| Current - Drain (Idss) @ Vds (Vgs=0) |
50mA @ 15V |
| Voltage - Cutoff (VGS off) @ Id |
4V @ 0.5nA |
| Voltage - Breakdown (V(BR)GSS) |
40V |
| Resistance - RDS(On) |
25Ohm |
| Current Drain (Id) - Max |
20mA |
| JESD-30 Code |
R-PDSO-G3 |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. BSR58,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
1997 |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| JESD-609 Code |
e3 |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
260 |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Mounting Type |
Surface Mount |
| Drain-source On Resistance-Max |
60Ohm |
| DS Breakdown Voltage-Min |
40V |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
250mW |
| FET Type |
N-Channel |
| Transistor Application |
SWITCHING |
| Drain Current-Max (Abs) (ID) |
0.005A |
| Pin Count |
3 |
| Base Part Number |
BSR58 |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.225W |
| Feedback Cap-Max (Crss) |
5 pF |
| Current - Drain (Idss) @ Vds (Vgs=0) |
8mA @ 15V |
| Voltage - Cutoff (VGS off) @ Id |
800mV @ 0.5nA |
| Voltage - Breakdown (V(BR)GSS) |
40V |
| Resistance - RDS(On) |
60Ohm |
| JESD-30 Code |
R-PDSO-G3 |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. CLF1G0035-100,112
In stock
| Manufacturer |
Ampleon |
|---|---|
| Package / Case |
SOT-467C |
| Surface Mount |
YES |
| Supplier Device Package |
SOT467C |
| Number of Terminals |
2 |
| Transistor Element Material |
GALLIUM NITRIDE |
| Mfr |
NXP USA Inc. |
| Number of Elements |
1 |
| Package |
Bulk |
| Package Shape |
RECTANGULAR |
| Product Status |
Active |
| ECCN Code |
EAR99 |
| Voltage - Rated |
150 V |
| Terminal Position |
DUAL |
| Terminal Form |
FLAT |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Reach Compliance Code |
unknown |
| Frequency |
3GHz |
| Reference Standard |
IEC-60134 |
| JESD-30 Code |
R-CDFM-F2 |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Case Connection |
SOURCE |
| Current - Test |
330 mA |
| Transistor Application |
AMPLIFIER |
| Polarity/Channel Type |
N-CHANNEL |
| Transistor Type |
GaN HEMT |
| Gain |
12dB |
| DS Breakdown Voltage-Min |
150 V |
| Power - Output |
100W |
| FET Technology |
HIGH ELECTRON MOBILITY |
| Voltage - Test |
50 V |
| Highest Frequency Band |
S BAND |