Showing 529–540 of 1266 results
Transistors - JFETs
NXP USA Inc. J108,126
In stock
Manufacturer |
NXP USA Inc. |
---|---|
Mounting Type |
Through Hole |
Operating Temperature |
150°C TJ |
Packaging |
Tape & Box (TB) |
Published |
1996 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Base Part Number |
J108 |
Power - Max |
400mW |
FET Type |
N-Channel |
Input Capacitance (Ciss) (Max) @ Vds |
30pF @ 0V |
Current - Drain (Idss) @ Vds (Vgs=0) |
80mA @ 5V |
Voltage - Cutoff (VGS off) @ Id |
10V @ 1μA |
Voltage - Breakdown (V(BR)GSS) |
25V |
Resistance - RDS(On) |
8Ohm |
RoHS Status |
ROHS3 Compliant |
NXP USA Inc. J109,126
In stock
Manufacturer |
NXP USA Inc. |
---|---|
Number of Terminations |
3 |
Surface Mount |
NO |
Transistor Element Material |
SILICON |
Operating Temperature |
150°C TJ |
Packaging |
Tape & Box (TB) |
Published |
1996 |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Base Part Number |
J109 |
Mounting Type |
Through Hole |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
HTS Code |
8541.21.00.95 |
Terminal Position |
BOTTOM |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
unknown |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Pin Count |
3 |
DS Breakdown Voltage-Min |
25V |
FET Technology |
JUNCTION |
Configuration |
SINGLE |
Operating Mode |
DEPLETION MODE |
Power - Max |
400mW |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Input Capacitance (Ciss) (Max) @ Vds |
30pF @ 10V VGS |
Drain-source On Resistance-Max |
12Ohm |
JESD-30 Code |
O-PBCY-T3 |
Qualification Status |
Not Qualified |
Power Dissipation-Max (Abs) |
0.4W |
Feedback Cap-Max (Crss) |
15 pF |
Source Url Status Check Date |
2013-06-14 00:00:00 |
Current - Drain (Idss) @ Vds (Vgs=0) |
80mA @ 15V |
Voltage - Cutoff (VGS off) @ Id |
2V @ 1μA |
Voltage - Breakdown (V(BR)GSS) |
25V |
Resistance - RDS(On) |
12Ohm |
RoHS Status |
ROHS3 Compliant |
NXP USA Inc. J110,126
In stock
Manufacturer |
NXP USA Inc. |
---|---|
Mounting Type |
Through Hole |
Operating Temperature |
150°C TJ |
Packaging |
Tape & Box (TB) |
Published |
1996 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Base Part Number |
J110 |
Power - Max |
400mW |
FET Type |
N-Channel |
Input Capacitance (Ciss) (Max) @ Vds |
30pF @ 0V |
Current - Drain (Idss) @ Vds (Vgs=0) |
10mA @ 5V |
Voltage - Cutoff (VGS off) @ Id |
4V @ 1μA |
Voltage - Breakdown (V(BR)GSS) |
25V |
Resistance - RDS(On) |
18Ohm |
RoHS Status |
ROHS3 Compliant |
NXP USA Inc. J111,126
In stock
Manufacturer |
NXP USA Inc. |
---|---|
Mounting Type |
Through Hole |
Operating Temperature |
150°C TJ |
Packaging |
Tape & Box (TB) |
Published |
1997 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Base Part Number |
J111 |
Power - Max |
400mW |
FET Type |
N-Channel |
Input Capacitance (Ciss) (Max) @ Vds |
6pF @ 10V VGS |
Current - Drain (Idss) @ Vds (Vgs=0) |
20mA @ 15V |
Voltage - Cutoff (VGS off) @ Id |
10V @ 1μA |
Voltage - Breakdown (V(BR)GSS) |
40V |
Resistance - RDS(On) |
30Ohm |
RoHS Status |
ROHS3 Compliant |
NXP USA Inc. J113,126
In stock
Manufacturer |
NXP USA Inc. |
---|---|
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Surface Mount |
NO |
Transistor Element Material |
SILICON |
Number of Elements |
1 |
Operating Temperature |
150°C TJ |
Packaging |
Tape & Box (TB) |
Published |
1997 |
JESD-609 Code |
e3 |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Mounting Type |
Through Hole |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
HTS Code |
8541.21.00.95 |
Terminal Position |
BOTTOM |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
unknown |
Part Status |
Obsolete |
Base Part Number |
J113 |
Drain-source On Resistance-Max |
100Ohm |
DS Breakdown Voltage-Min |
40V |
Qualification Status |
Not Qualified |
Configuration |
SINGLE |
Operating Mode |
DEPLETION MODE |
Power - Max |
400mW |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Input Capacitance (Ciss) (Max) @ Vds |
6pF @ 10V VGS |
Pin Count |
3 |
JESD-30 Code |
O-PBCY-T3 |
FET Technology |
JUNCTION |
Power Dissipation-Max (Abs) |
0.4W |
Source Url Status Check Date |
2013-06-14 00:00:00 |
Current - Drain (Idss) @ Vds (Vgs=0) |
2mA @ 15V |
Voltage - Cutoff (VGS off) @ Id |
500mV @ 1μA |
Voltage - Breakdown (V(BR)GSS) |
40V |
Resistance - RDS(On) |
100Ohm |
RoHS Status |
ROHS3 Compliant |
NXP USA Inc. J174,126
In stock
Manufacturer |
NXP USA Inc. |
---|---|
Base Part Number |
J174 |
Supplier Device Package |
TO-92 |
Operating Temperature |
150°C TJ |
Packaging |
Tape & Box (TB) |
Published |
1997 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Mounting Type |
Through Hole |
FET Type |
P-Channel |
Power - Max |
400mW |
Input Capacitance (Ciss) (Max) @ Vds |
8pF @ 10V VGS |
Drain to Source Voltage (Vdss) |
30V |
Current - Drain (Idss) @ Vds (Vgs=0) |
20mA @ 15V |
Voltage - Cutoff (VGS off) @ Id |
5V @ 10nA |
Voltage - Breakdown (V(BR)GSS) |
30V |
Resistance - RDS(On) |
85Ohms |
RoHS Status |
ROHS3 Compliant |
NXP USA Inc. J175,116
In stock
Manufacturer |
NXP USA Inc. |
---|---|
Number of Terminations |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
150°C TJ |
Packaging |
Tape & Box (TB) |
Published |
1997 |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
HTS Code |
8541.21.00.95 |
Terminal Position |
BOTTOM |
Terminal Form |
WIRE |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
unknown |
Surface Mount |
NO |
Mounting Type |
Through Hole |
Input Capacitance (Ciss) (Max) @ Vds |
8pF @ 10V VGS |
Pin Count |
3 |
Qualification Status |
Not Qualified |
Configuration |
SINGLE |
Operating Mode |
DEPLETION MODE |
Power - Max |
400mW |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Drain-source On Resistance-Max |
125Ohm |
DS Breakdown Voltage-Min |
30V |
Base Part Number |
J175 |
FET Technology |
JUNCTION |
Power Dissipation-Max (Abs) |
0.4W |
Current - Drain (Idss) @ Vds (Vgs=0) |
7mA @ 15V |
Voltage - Cutoff (VGS off) @ Id |
3V @ 10nA |
Voltage - Breakdown (V(BR)GSS) |
30V |
Resistance - RDS(On) |
125Ohm |
JESD-30 Code |
O-PBCY-W3 |
RoHS Status |
ROHS3 Compliant |
NXP USA Inc. J176,126
In stock
Manufacturer |
NXP USA Inc. |
---|---|
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Surface Mount |
NO |
Transistor Element Material |
SILICON |
Number of Elements |
1 |
Operating Temperature |
150°C TJ |
Packaging |
Tape & Box (TB) |
Published |
1997 |
JESD-609 Code |
e3 |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Mounting Type |
Through Hole |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) |
HTS Code |
8541.21.00.95 |
Terminal Position |
BOTTOM |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
unknown |
Part Status |
Obsolete |
Base Part Number |
J176 |
Drain-source On Resistance-Max |
250Ohm |
DS Breakdown Voltage-Min |
30V |
Qualification Status |
Not Qualified |
Configuration |
SINGLE |
Operating Mode |
DEPLETION MODE |
Power - Max |
400mW |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Input Capacitance (Ciss) (Max) @ Vds |
8pF @ 10V VGS |
Pin Count |
3 |
JESD-30 Code |
O-PBCY-T3 |
FET Technology |
JUNCTION |
Power Dissipation-Max (Abs) |
0.4W |
Source Url Status Check Date |
2013-06-14 00:00:00 |
Current - Drain (Idss) @ Vds (Vgs=0) |
2mA @ 15V |
Voltage - Cutoff (VGS off) @ Id |
1V @ 10nA |
Voltage - Breakdown (V(BR)GSS) |
30V |
Resistance - RDS(On) |
250Ohm |
RoHS Status |
ROHS3 Compliant |