Showing 565–576 of 1266 results
NXP USA Inc. PMBF4391,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Base Part Number |
MBF4391 |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
1997 |
| Part Status |
Not For New Designs |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| JESD-609 Code |
e3 |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
260 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Mounting Type |
Surface Mount |
| Factory Lead Time |
8 Weeks |
| DS Breakdown Voltage-Min |
40V |
| FET Technology |
JUNCTION |
| Configuration |
SINGLE WITH BUILT-IN DIODE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
250mW |
| FET Type |
N-Channel |
| Transistor Application |
SWITCHING |
| Input Capacitance (Ciss) (Max) @ Vds |
14pF @ 20V |
| Drain Current-Max (Abs) (ID) |
0.012A |
| Drain-source On Resistance-Max |
30Ohm |
| JESD-30 Code |
R-PDSO-F3 |
| Pin Count |
3 |
| Power Dissipation-Max (Abs) |
0.25W |
| Feedback Cap-Max (Crss) |
3.5 pF |
| Turn Off Time-Max (toff) |
20ns |
| Turn On Time-Max (ton) |
80ns |
| Current - Drain (Idss) @ Vds (Vgs=0) |
50mA @ 20V |
| Voltage - Cutoff (VGS off) @ Id |
4V @ 1nA |
| Voltage - Breakdown (V(BR)GSS) |
40V |
| Resistance - RDS(On) |
30Ohm |
| Qualification Status |
Not Qualified |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. PMBF4392,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
1997 |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| JESD-609 Code |
e3 |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
260 |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Mounting Type |
Surface Mount |
| Drain Current-Max (Abs) (ID) |
0.006A |
| Drain-source On Resistance-Max |
60Ohm |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
250mW |
| FET Type |
N-Channel |
| Transistor Application |
SWITCHING |
| Input Capacitance (Ciss) (Max) @ Vds |
14pF @ 20V |
| Pin Count |
3 |
| Base Part Number |
MBF4392 |
| DS Breakdown Voltage-Min |
40V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.25W |
| Feedback Cap-Max (Crss) |
3.5 pF |
| Current - Drain (Idss) @ Vds (Vgs=0) |
25mA @ 20V |
| Voltage - Cutoff (VGS off) @ Id |
2V @ 1nA |
| Voltage - Breakdown (V(BR)GSS) |
40V |
| JESD-30 Code |
R-PDSO-G3 |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. PMBFJ108,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Part Status |
Obsolete |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2001 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| JESD-609 Code |
e3 |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
260 |
| Mounting Type |
Surface Mount |
| Factory Lead Time |
8 Weeks |
| JEDEC-95 Code |
TO-236AB |
| Pin Count |
3 |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
250mW |
| FET Type |
N-Channel |
| Transistor Application |
SWITCHING |
| Input Capacitance (Ciss) (Max) @ Vds |
30pF @ 10V VGS |
| Drain-source On Resistance-Max |
8Ohm |
| DS Breakdown Voltage-Min |
25V |
| Base Part Number |
MBFJ108 |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.25W |
| Feedback Cap-Max (Crss) |
15 pF |
| Current - Drain (Idss) @ Vds (Vgs=0) |
80mA @ 15V |
| Voltage - Cutoff (VGS off) @ Id |
10V @ 1μA |
| Voltage - Breakdown (V(BR)GSS) |
25V |
| Resistance - RDS(On) |
8Ohm |
| JESD-30 Code |
R-PDSO-G3 |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. PMBFJ109,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Part Status |
Obsolete |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2001 |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| JESD-609 Code |
e3 |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
TIN |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
260 |
| Mounting Type |
Surface Mount |
| Factory Lead Time |
8 Weeks |
| JEDEC-95 Code |
TO-236AB |
| Pin Count |
3 |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
250mW |
| FET Type |
N-Channel |
| Transistor Application |
SWITCHING |
| Input Capacitance (Ciss) (Max) @ Vds |
30pF @ 10V VGS |
| Drain-source On Resistance-Max |
12Ohm |
| DS Breakdown Voltage-Min |
25V |
| Base Part Number |
MBFJ109 |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.25W |
| Feedback Cap-Max (Crss) |
15 pF |
| Current - Drain (Idss) @ Vds (Vgs=0) |
40mA @ 15V |
| Voltage - Cutoff (VGS off) @ Id |
6V @ 1μA |
| Voltage - Breakdown (V(BR)GSS) |
25V |
| Resistance - RDS(On) |
12Ohm |
| JESD-30 Code |
R-PDSO-G3 |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. PMBFJ111,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2001 |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| JESD-609 Code |
e3 |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
260 |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Mounting Type |
Surface Mount |
| JEDEC-95 Code |
TO-236AB |
| Drain-source On Resistance-Max |
30Ohm |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
300mW |
| FET Type |
N-Channel |
| Transistor Application |
SWITCHING |
| Input Capacitance (Ciss) (Max) @ Vds |
6pF @ 10V VGS |
| Pin Count |
3 |
| Base Part Number |
MBFJ111 |
| DS Breakdown Voltage-Min |
40V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.3W |
| Current - Drain (Idss) @ Vds (Vgs=0) |
20mA @ 15V |
| Voltage - Cutoff (VGS off) @ Id |
10V @ 1μA |
| Voltage - Breakdown (V(BR)GSS) |
40V |
| Resistance - RDS(On) |
30Ohm |
| JESD-30 Code |
R-PDSO-G3 |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. PMBFJ112,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2001 |
| JESD-609 Code |
e3 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Mounting Type |
Surface Mount |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
260 |
| Part Status |
Obsolete |
| Base Part Number |
MBFJ112 |
| JEDEC-95 Code |
TO-236AB |
| Drain-source On Resistance-Max |
50Ohm |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
300mW |
| FET Type |
N-Channel |
| Transistor Application |
SWITCHING |
| Input Capacitance (Ciss) (Max) @ Vds |
6pF @ 10V VGS |
| Pin Count |
3 |
| JESD-30 Code |
R-PDSO-G3 |
| DS Breakdown Voltage-Min |
40V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.3W |
| Current - Drain (Idss) @ Vds (Vgs=0) |
5mA @ 15V |
| Voltage - Cutoff (VGS off) @ Id |
5V @ 1μA |
| Voltage - Breakdown (V(BR)GSS) |
40V |
| Resistance - RDS(On) |
50Ohm |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. PMBFJ113,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
1997 |
| JESD-609 Code |
e3 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Mounting Type |
Surface Mount |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
260 |
| Part Status |
Obsolete |
| Base Part Number |
MBFJ113 |
| JEDEC-95 Code |
TO-236AB |
| Drain-source On Resistance-Max |
100Ohm |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
300mW |
| FET Type |
N-Channel |
| Transistor Application |
SWITCHING |
| Input Capacitance (Ciss) (Max) @ Vds |
6pF @ 10V VGS |
| Pin Count |
3 |
| JESD-30 Code |
R-PDSO-G3 |
| DS Breakdown Voltage-Min |
40V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.3W |
| Current - Drain (Idss) @ Vds (Vgs=0) |
2mA @ 15V |
| Voltage - Cutoff (VGS off) @ Id |
3V @ 1μA |
| Voltage - Breakdown (V(BR)GSS) |
40V |
| Resistance - RDS(On) |
100Ohm |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. PMBFJ174,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Part Status |
Obsolete |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
1997 |
| Peak Reflow Temperature (Cel) |
260 |
| Mounting Type |
Surface Mount |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| JESD-609 Code |
e3 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Input Capacitance (Ciss) (Max) @ Vds |
8pF @ 10V VGS |
| Drain-source On Resistance-Max |
85Ohm |
| JESD-30 Code |
R-PDSO-G3 |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
300mW |
| FET Type |
P-Channel |
| Transistor Application |
SWITCHING |
| Base Part Number |
MBFJ174 |
| Pin Count |
3 |
| DS Breakdown Voltage-Min |
30V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.3W |
| Current - Drain (Idss) @ Vds (Vgs=0) |
20mA @ 15V |
| Voltage - Cutoff (VGS off) @ Id |
5V @ 10nA |
| Voltage - Breakdown (V(BR)GSS) |
30V |
| Resistance - RDS(On) |
85Ohm |
| RoHS Status |
ROHS3 Compliant |
NXP USA Inc. PMBFJ175,215
In stock
| Manufacturer |
NXP USA Inc. |
|---|---|
| Part Status |
Obsolete |
| Package / Case |
TO-236-3, SC-59, SOT-23-3 |
| Surface Mount |
YES |
| Transistor Element Material |
SILICON |
| Number of Elements |
1 |
| Operating Temperature |
150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
1997 |
| Peak Reflow Temperature (Cel) |
260 |
| Mounting Type |
Surface Mount |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Number of Terminations |
3 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.21.00.95 |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| JESD-609 Code |
e3 |
| Time@Peak Reflow Temperature-Max (s) |
40 |
| Input Capacitance (Ciss) (Max) @ Vds |
8pF @ 10V VGS |
| Drain-source On Resistance-Max |
125Ohm |
| JESD-30 Code |
R-PDSO-G3 |
| Qualification Status |
Not Qualified |
| Configuration |
SINGLE |
| Operating Mode |
DEPLETION MODE |
| Power - Max |
300mW |
| FET Type |
P-Channel |
| Transistor Application |
SWITCHING |
| Base Part Number |
MBFJ175 |
| Pin Count |
3 |
| DS Breakdown Voltage-Min |
30V |
| FET Technology |
JUNCTION |
| Power Dissipation-Max (Abs) |
0.3W |
| Current - Drain (Idss) @ Vds (Vgs=0) |
7mA @ 15V |
| Voltage - Cutoff (VGS off) @ Id |
3V @ 10nA |
| Voltage - Breakdown (V(BR)GSS) |
30V |
| Resistance - RDS(On) |
125Ohm |
| RoHS Status |
ROHS3 Compliant |