Infineon Technologies BSP298H6327XUSA1

SKU: BSP298H6327XUSA1-11

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Manufacturer Part :
BSP298H6327XUSA1
Manufacturer :
Infineon Technologies
Package :
TO-261-4, TO-261AA
RoHS :
ROHS3 Compliant
BSP298H6327XUSA1 Datasheet :

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Description

Specification

Processor

Manufacturer

Infineon Technologies

Operating Temperature

-55°C~150°C TJ

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Number of Pins

3

Supplier Device Package

PG-SOT223-4

Current - Continuous Drain (Id) @ 25℃

500mA Ta

Drive Voltage (Max Rds On, Min Rds On)

10V

Number of Elements

1

Power Dissipation (Max)

1.8W Ta

Turn On Delay Time

10 ns

Turn Off Delay Time

30 ns

Packaging

Cut Tape (CT)

Published

2008

Series

SIPMOS®

Part Status

Last Time Buy

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Termination

SMD/SMT

Max Operating Temperature

150°C

Min Operating Temperature

-55°C

Element Configuration

Single

Power Dissipation

1.8W

Contact Plating

Tin

Factory Lead Time

10 Weeks

Max Dual Supply Voltage

400V

Rds On (Max) @ Id, Vgs

3Ohm @ 500mA, 10V

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

400pF @ 25V

Rise Time

25ns

Drain to Source Voltage (Vdss)

400V

Vgs (Max)

±20V

Fall Time (Typ)

20 ns

Continuous Drain Current (ID)

500mA

Threshold Voltage

3V

Gate to Source Voltage (Vgs)

20V

Drain to Source Breakdown Voltage

400V

Dual Supply Voltage

400V

FET Type

N-Channel

Input Capacitance

400pF

Drain to Source Resistance

2.2Ohm

Rds On Max

3 Ω

Nominal Vgs

3 V

Height

1.6mm

Length

6.5mm

Width

6.7mm

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Vgs(th) (Max) @ Id

4V @ 1mA

Lead Free

Lead Free

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