Infineon Technologies BSR316PL6327HTSA1

SKU: BSR316PL6327HTSA1-11

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Manufacturer Part :
BSR316PL6327HTSA1
Manufacturer :
Infineon Technologies
Package :
TO-236-3, SC-59, SOT-23-3
RoHS :
ROHS3 Compliant
BSR316PL6327HTSA1 Datasheet :

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Description

Specification

Processor

Manufacturer

Infineon Technologies

Operating Temperature

-55°C~150°C TJ

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

360mA Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Number of Elements

1

ECCN Code

EAR99

Power Dissipation (Max)

500mW Ta

Packaging

Tape & Reel (TR)

Published

2015

Series

SIPMOS®

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Mount

Surface Mount

Contact Plating

Tin

Rds On (Max) @ Id, Vgs

1.8 Ω @ 360mA, 10V

Terminal Form

GULL WING

Time@Peak Reflow Temperature-Max (s)

40

Pin Count

3

Qualification Status

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

ENHANCEMENT MODE

Power Dissipation

500mW

FET Type

P-Channel

Vgs(th) (Max) @ Id

1V @ 170μA

Input Capacitance (Ciss) (Max) @ Vds

165pF @ 25V

Terminal Position

DUAL

Gate Charge (Qg) (Max) @ Vgs

7nC @ 10V

Rise Time

6ns

Drain to Source Voltage (Vdss)

100V

Vgs (Max)

±20V

Continuous Drain Current (ID)

360mA

Gate to Source Voltage (Vgs)

20V

Feedback Cap-Max (Crss)

20 pF

Peak Reflow Temperature (Cel)

260

RoHS Status

ROHS3 Compliant

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