Infineon Technologies BSS139H6327XTSA1

SKU: BSS139H6327XTSA1-11

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Manufacturer Part :
BSS139H6327XTSA1
Manufacturer :
Infineon Technologies
Package :
TO-236-3, SC-59, SOT-23-3
RoHS :
ROHS3 Compliant
BSS139H6327XTSA1 Datasheet :

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Description

Specification

Processor

Manufacturer

Infineon Technologies

JESD-609 Code

e3

Contact Plating

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~150°C TJ

Packaging

Tape & Reel (TR)

Published

2006

Configuration

SINGLE WITH BUILT-IN DIODE

Factory Lead Time

10 Weeks

Pbfree Code

yes

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Termination

SMD/SMT

ECCN Code

EAR99

Terminal Position

DUAL

Terminal Form

GULL WING

Pin Count

3

Number of Elements

1

Series

SIPMOS®

Number of Channels

1

Vgs (Max)

±20V

Continuous Drain Current (ID)

40mA

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

14 Ω @ 100μA, 10V

Vgs(th) (Max) @ Id

1V @ 56μA

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

76pF @ 25V

Current - Continuous Drain (Id) @ 25°C

100mA Ta

Gate Charge (Qg) (Max) @ Vgs

3.5nC @ 5V

Rise Time

5.4ns

Drive Voltage (Max Rds On,Min Rds On)

0V 10V

Power Dissipation-Max

360mW Ta

Power Dissipation

360mW

Threshold Voltage

-1.4V

Gate to Source Voltage (Vgs)

20V

Max Dual Supply Voltage

250V

Dual Supply Voltage

250V

FET Feature

Depletion Mode

Nominal Vgs

-1.4 V

Width

3.05mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

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