Infineon Technologies IRF5210PBF

SKU: IRF5210PBF-11

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Manufacturer Part :
IRF5210PBF
Manufacturer :
Infineon Technologies
Package :
TO-220-3
RoHS :
ROHS3 Compliant
IRF5210PBF Datasheet :

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Description

Specification

Processor

Manufacturer

Infineon Technologies

Termination

Through Hole

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

TO-220-3

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tube

Published

1998

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Case Connection

DRAIN

Number of Terminations

3

ECCN Code

EAR99

Resistance

60mOhm

Voltage - Rated DC

-100V

Peak Reflow Temperature (Cel)

250

Current Rating

-40A

Time@Peak Reflow Temperature-Max (s)

30

Lead Pitch

2.54mm

Number of Elements

1

Number of Channels

1

Power Dissipation-Max

200W Tc

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Power Dissipation

200W

Contact Plating

Tin

Factory Lead Time

12 Weeks

Threshold Voltage

-4V

FET Type

P-Channel

Rds On (Max) @ Id, Vgs

60m Ω @ 24A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

2700pF @ 25V

Current - Continuous Drain (Id) @ 25°C

40A Tc

Gate Charge (Qg) (Max) @ Vgs

180nC @ 10V

Rise Time

86ns

Drain to Source Voltage (Vdss)

100V

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±20V

Fall Time (Typ)

81 ns

Turn-Off Delay Time

79 ns

Continuous Drain Current (ID)

-40A

JEDEC-95 Code

TO-220AB

Gate to Source Voltage (Vgs)

20V

Turn On Delay Time

17 ns

Drain to Source Breakdown Voltage

-100V

Dual Supply Voltage

-100V

Avalanche Energy Rating (Eas)

780 mJ

Recovery Time

260 ns

Max Junction Temperature (Tj)

175°C

Nominal Vgs

-4 V

Height

19.8mm

Length

10.5156mm

Width

4.69mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Transistor Application

SWITCHING

Lead Free

Lead Free

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