Infineon Technologies IRFS3207TRLPBF

SKU: IRFS3207TRLPBF-11

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Manufacturer Part :
IRFS3207TRLPBF
Manufacturer :
Infineon Technologies
Package :
RoHS :
ROHS3 Compliant
IRFS3207TRLPBF Datasheet :

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Description

Specification

Processor

Manufacturer

Infineon Technologies

ECCN Code

EAR99

Mount

Surface Mount

Mounting Type

Surface Mount

Number of Pins

3

Transistor Element Material

SILICON

Operating Temperature

-55°C~175°C TJ

Packaging

Tape & Reel (TR)

Published

2006

Series

HEXFET®

JESD-609 Code

e3

Part Status

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Power Dissipation

300W

Factory Lead Time

12 Weeks

Resistance

4.5MOhm

Voltage - Rated DC

75V

Terminal Form

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

180A

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

R-PSSO-G2

Number of Elements

1

Power Dissipation-Max

300W Tc

Element Configuration

Single

Operating Mode

ENHANCEMENT MODE

Number of Terminations

2

Case Connection

DRAIN

Continuous Drain Current (ID)

180A

Threshold Voltage

4V

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

4.5m Ω @ 75A, 10V

Vgs(th) (Max) @ Id

4V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

7600pF @ 50V

Current - Continuous Drain (Id) @ 25°C

170A Tc

Gate Charge (Qg) (Max) @ Vgs

260nC @ 10V

Rise Time

120ns

Drive Voltage (Max Rds On,Min Rds On)

10V

Vgs (Max)

±20V

Fall Time (Typ)

74 ns

Turn-Off Delay Time

68 ns

Turn On Delay Time

29 ns

FET Type

N-Channel

Gate to Source Voltage (Vgs)

20V

Drain Current-Max (Abs) (ID)

75A

Drain to Source Breakdown Voltage

75V

Pulsed Drain Current-Max (IDM)

720A

Nominal Vgs

4 V

Height

4.826mm

Length

10.668mm

Width

9.65mm

Radiation Hardening

No

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Lead Free

Lead Free

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