NXP USA Inc. J109,126

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Description

Specification

Processor

Manufacturer	NXP USA Inc.
Number of Terminations	3
Surface Mount	NO
Transistor Element Material	SILICON
Operating Temperature	150°C TJ
Packaging	Tape & Box (TB)
Published	1996
JESD-609 Code	e3
Part Status	Obsolete
Base Part Number	J109
Mounting Type	Through Hole
ECCN Code	EAR99
Terminal Finish	Matte Tin (Sn)
HTS Code	8541.21.00.95
Terminal Position	BOTTOM
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Reach Compliance Code	unknown
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Pin Count	3
DS Breakdown Voltage-Min	25V
FET Technology	JUNCTION
Configuration	SINGLE
Operating Mode	DEPLETION MODE
Power - Max	400mW
FET Type	N-Channel
Transistor Application	SWITCHING
Input Capacitance (Ciss) (Max) @ Vds	30pF @ 10V VGS
Drain-source On Resistance-Max	12Ohm
JESD-30 Code	O-PBCY-T3
Qualification Status	Not Qualified
Power Dissipation-Max (Abs)	0.4W
Feedback Cap-Max (Crss)	15 pF
Source Url Status Check Date	2013-06-14 00:00:00
Current - Drain (Idss) @ Vds (Vgs=0)	80mA @ 15V
Voltage - Cutoff (VGS off) @ Id	2V @ 1μA
Voltage - Breakdown (V(BR)GSS)	25V
Resistance - RDS(On)	12Ohm
RoHS Status	ROHS3 Compliant

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