NXP USA Inc. PMBFJ309,215

SKU: PMBFJ309,215-9

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Manufacturer Part :
PMBFJ309,215
Manufacturer :
NXP USA Inc.
Package :
YES
RoHS :
-
PMBFJ309,215 Datasheet :

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2-3 Days

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Description

Specification

Processor

Manufacturer

NXP USA Inc.

Pbfree Code

Not For New Designs

Mounting Type

TO-236-3, SC-59, SOT-23-3

Package / Case

YES

Weight

SILICON

Minimum Operating Temperature

1

Transistor Polarity

150°C TJ

Operating Temperature

Tape & Reel (TR)

Packaging

2001

Current Rating

NOT SPECIFIED

Series

e3

Part Status

1 (Unlimited)

Moisture Sensitivity Level (MSL)

3

Type

Tin (Sn)

Terminal Finish

LOW NOISE

Additional Feature

8541.21.00.75

Technology

DUAL

Terminal Position

GULL WING

Terminal Form

260

Mount

Surface Mount

Factory Lead Time

8 Weeks

Continuous Drain Current (ID)

TO-236AB

Base Part Number

3

JESD-30 Code

Not Qualified

Qualification Status

SINGLE

Element Configuration

DEPLETION MODE

Power Dissipation

250mW

Power - Max

N-Channel

FET Type

AMPLIFIER

Halogen Free

5pF @ 10V

Drain to Source Breakdown Voltage

25V

DS Breakdown Voltage-Min

JUNCTION

Time@Peak Reflow Temperature-Max (s)

MBFJ309

FET Technology

0.25W

Power Dissipation-Max (Abs)

2.5 pF

Feedback Cap-Max (Crss)

VERY HIGH FREQUENCY B

Highest Frequency Band

12mA @ 10V

Current - Drain (Idss) @ Vds (Vgs=0)

1V @ 1μA

Voltage - Cutoff (VGS off) @ Id

25V

Voltage - Breakdown (V(BR)GSS)

50Ohm

Reference Standard

R-PDSO-G3

REACH SVHC

ROHS3 Compliant

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