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Manufacturer |
ON Semiconductor |
---|---|
Operating Mode |
ENHANCEMENT MODE |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Weight |
130mg |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2008 |
Series |
PowerTrench® |
Pbfree Code |
yes |
Part Status |
Active |
JESD-609 Code |
e4 |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Resistance |
9.3MOhm |
Voltage - Rated DC |
-30V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Current Rating |
-13A |
Number of Elements |
1 |
Power Dissipation-Max |
2.5W Ta |
Element Configuration |
Single |
Contact Plating |
Tin |
Factory Lead Time |
18 Weeks |
Turn-Off Delay Time |
210 ns |
Continuous Drain Current (ID) |
-13A |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
9.3m Ω @ 13A, 10V |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
3845pF @ 15V |
Current - Continuous Drain (Id) @ 25°C |
13A Ta |
Gate Charge (Qg) (Max) @ Vgs |
96nC @ 10V |
Rise Time |
15ns |
Drain to Source Voltage (Vdss) |
30V |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±25V |
Fall Time (Typ) |
92 ns |
Turn On Delay Time |
13 ns |
Power Dissipation |
2.5W |
Threshold Voltage |
-1.9V |
Gate to Source Voltage (Vgs) |
25V |
Drain to Source Breakdown Voltage |
-30V |
Nominal Vgs |
-1.9 V |
Feedback Cap-Max (Crss) |
745 pF |
Height |
1.5mm |
Length |
5mm |
Width |
4mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
FET Type |
P-Channel |
Lead Free |
Lead Free |
In stock
Manufacturer |
Infineon Technologies |
---|---|
Part Status |
Active |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
4 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Cut Tape (CT) |
Published |
2012 |
Series |
SIPMOS® |
JESD-609 Code |
e3 |
Element Configuration |
Single |
Factory Lead Time |
10 Weeks |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
4 |
ECCN Code |
EAR99 |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
4 |
Number of Elements |
1 |
Voltage |
600V |
Power Dissipation-Max |
1.8W Ta |
Pbfree Code |
yes |
Current |
12A |
Fall Time (Typ) |
182 ns |
Turn-Off Delay Time |
28 ns |
Turn On Delay Time |
5.4 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
45 Ω @ 120mA, 10V |
Vgs(th) (Max) @ Id |
1V @ 94μA |
Halogen Free |
Halogen Free |
Input Capacitance (Ciss) (Max) @ Vds |
146pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
120mA Ta |
Gate Charge (Qg) (Max) @ Vgs |
4.9nC @ 5V |
Rise Time |
5.6ns |
Drive Voltage (Max Rds On,Min Rds On) |
0V 10V |
Vgs (Max) |
±20V |
Power Dissipation |
1.8W |
Case Connection |
DRAIN |
Continuous Drain Current (ID) |
120mA |
Gate to Source Voltage (Vgs) |
20V |
Max Dual Supply Voltage |
600V |
Drain to Source Breakdown Voltage |
600V |
Recovery Time |
130 ns |
FET Feature |
Depletion Mode |
Height |
1.5mm |
Length |
6.5mm |
Width |
3.5mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
In stock
Manufacturer |
Infineon Technologies |
---|---|
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Cut Tape (CT) |
Published |
2012 |
Series |
OptiMOS™ |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Power Dissipation-Max |
500mW Ta |
Factory Lead Time |
10 Weeks |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin (Sn) |
Additional Feature |
LOGIC LEVEL COMPATIBLE |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
3 |
Number of Elements |
1 |
Number of Channels |
1 |
Part Status |
Active |
Element Configuration |
Single |
Fall Time (Typ) |
22 ns |
Turn-Off Delay Time |
7.4 ns |
Turn On Delay Time |
2.3 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
6 Ω @ 190mA, 10V |
Vgs(th) (Max) @ Id |
1.8V @ 13μA |
Halogen Free |
Halogen Free |
Input Capacitance (Ciss) (Max) @ Vds |
20.9pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
190mA Ta |
Gate Charge (Qg) (Max) @ Vgs |
0.9nC @ 10V |
Rise Time |
3.2ns |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
500mW |
Continuous Drain Current (ID) |
190mA |
Gate to Source Voltage (Vgs) |
20V |
Max Dual Supply Voltage |
100V |
Drain-source On Resistance-Max |
6Ohm |
Drain to Source Breakdown Voltage |
100V |
Max Junction Temperature (Tj) |
150°C |
Height |
1.1mm |
Length |
2.9mm |
Width |
1.3mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
In stock
Manufacturer |
Infineon Technologies |
---|---|
Case Connection |
DRAIN |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
TO-220-3 |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tube |
Published |
1997 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Number of Terminations |
3 |
Termination |
Through Hole |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Resistance |
100mOhm |
Voltage - Rated DC |
-55V |
Peak Reflow Temperature (Cel) |
250 |
Current Rating |
-19A |
Time@Peak Reflow Temperature-Max (s) |
30 |
Lead Pitch |
2.54mm |
Number of Elements |
1 |
Power Dissipation-Max |
68W Tc |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
56W |
Contact Plating |
Tin |
Factory Lead Time |
12 Weeks |
Threshold Voltage |
-4V |
JEDEC-95 Code |
TO-220AB |
Rds On (Max) @ Id, Vgs |
100m Ω @ 10A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
620pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
19A Tc |
Gate Charge (Qg) (Max) @ Vgs |
35nC @ 10V |
Rise Time |
55ns |
Drain to Source Voltage (Vdss) |
55V |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
41 ns |
Turn-Off Delay Time |
30 ns |
Continuous Drain Current (ID) |
-19A |
FET Type |
P-Channel |
Turn On Delay Time |
13 ns |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
-55V |
Pulsed Drain Current-Max (IDM) |
68A |
Dual Supply Voltage |
-55V |
Recovery Time |
82 ns |
Nominal Vgs |
-4 V |
Height |
8.77mm |
Length |
10.5156mm |
Width |
4.69mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Transistor Application |
SWITCHING |
Lead Free |
Lead Free |
In stock
Manufacturer |
Infineon Technologies |
---|---|
ECCN Code |
EAR99 |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
TO-261-4, TO-261AA |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
1997 |
Series |
HEXFET® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Element Configuration |
Single |
Factory Lead Time |
12 Weeks |
Resistance |
40mOhm |
Terminal Finish |
Matte Tin (Sn) |
Additional Feature |
LOGIC LEVEL COMPATIBLE |
Voltage - Rated DC |
55V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Current Rating |
3.8A |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
R-PDSO-G4 |
Number of Elements |
1 |
Number of Channels |
1 |
Power Dissipation-Max |
1W Ta |
Number of Terminations |
4 |
Operating Mode |
ENHANCEMENT MODE |
Continuous Drain Current (ID) |
3.8A |
Threshold Voltage |
2V |
Turn On Delay Time |
6.2 ns |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
40m Ω @ 3.8A, 10V |
Vgs(th) (Max) @ Id |
2V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
870pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
3.8A Ta |
Gate Charge (Qg) (Max) @ Vgs |
48nC @ 10V |
Rise Time |
12ns |
Drive Voltage (Max Rds On,Min Rds On) |
4V 10V |
Vgs (Max) |
±16V |
Fall Time (Typ) |
22 ns |
Turn-Off Delay Time |
35 ns |
Power Dissipation |
2.1W |
Case Connection |
DRAIN |
Gate to Source Voltage (Vgs) |
16V |
Drain Current-Max (Abs) (ID) |
5.2A |
Drain to Source Breakdown Voltage |
55V |
Dual Supply Voltage |
55V |
Recovery Time |
88 ns |
Max Junction Temperature (Tj) |
150°C |
Nominal Vgs |
2 V |
Height |
1.8mm |
Length |
6.6802mm |
Width |
6.7mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
In stock
Manufacturer |
Nexperia USA Inc. |
---|---|
Published |
2005 |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Surface Mount |
YES |
Number of Pins |
3 |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
HTS Code |
8541.21.00.75 |
Factory Lead Time |
4 Weeks |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin (Sn) |
Additional Feature |
LOGIC LEVEL COMPATIBLE |
Packaging |
Tape & Reel (TR) |
Terminal Position |
DUAL |
Rds On (Max) @ Id, Vgs |
1.6 Ω @ 500mA, 10V |
Vgs(th) (Max) @ Id |
2.4V @ 250μA |
Number of Elements |
1 |
Configuration |
SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max |
350mW Ta |
Operating Mode |
ENHANCEMENT MODE |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Terminal Form |
GULL WING |
Pin Count |
3 |
Input Capacitance (Ciss) (Max) @ Vds |
50pF @ 10V |
Current - Continuous Drain (Id) @ 25°C |
360mA Ta |
Gate Charge (Qg) (Max) @ Vgs |
0.8nC @ 4.5V |
Drain to Source Voltage (Vdss) |
60V |
Drive Voltage (Max Rds On,Min Rds On) |
10V |
Vgs (Max) |
±20V |
DS Breakdown Voltage-Min |
60V |
RoHS Status |
ROHS3 Compliant |
In stock
Manufacturer |
ON Semiconductor |
---|---|
Element Configuration |
Single |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Weight |
130mg |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2003 |
Series |
PowerTrench® |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Pbfree Code |
yes |
Number of Terminations |
8 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Resistance |
19MOhm |
Terminal Finish |
Tin (Sn) |
Voltage - Rated DC |
100V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Current Rating |
7.5A |
Number of Elements |
1 |
Power Dissipation-Max |
2.5W Ta |
Mount |
Surface Mount |
Factory Lead Time |
12 Weeks |
Turn-Off Delay Time |
37 ns |
Continuous Drain Current (ID) |
7.5A |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
23m Ω @ 7.5A, 10V |
Vgs(th) (Max) @ Id |
4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
2015pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
7.5A Ta |
Gate Charge (Qg) (Max) @ Vgs |
37nC @ 10V |
Rise Time |
20ns |
Drive Voltage (Max Rds On,Min Rds On) |
6V 10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
27 ns |
Power Dissipation |
2.5W |
Operating Mode |
ENHANCEMENT MODE |
Threshold Voltage |
4V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
100V |
Dual Supply Voltage |
100V |
Nominal Vgs |
4 V |
Height |
1.5mm |
Length |
5mm |
Width |
4mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Turn On Delay Time |
14 ns |
Lead Free |
Lead Free |
In stock
Manufacturer |
ON Semiconductor |
---|---|
Pbfree Code |
yes |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Weight |
130mg |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2001 |
Series |
PowerTrench® |
Operating Mode |
ENHANCEMENT MODE |
Factory Lead Time |
18 Weeks |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Resistance |
21.8MOhm |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Base Part Number |
FDS6675 |
Number of Elements |
1 |
Power Dissipation-Max |
2.5W Ta |
Element Configuration |
Single |
JESD-609 Code |
e4 |
Power Dissipation |
2.5W |
Turn-Off Delay Time |
120 ns |
Continuous Drain Current (ID) |
11A |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
13m Ω @ 11A, 10V |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
2470pF @ 15V |
Current - Continuous Drain (Id) @ 25°C |
11A Ta |
Gate Charge (Qg) (Max) @ Vgs |
62nC @ 10V |
Rise Time |
7.8ns |
Drain to Source Voltage (Vdss) |
30V |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±25V |
Fall Time (Typ) |
60 ns |
Turn On Delay Time |
3 ns |
FET Type |
P-Channel |
Threshold Voltage |
-2V |
Gate to Source Voltage (Vgs) |
25V |
Drain to Source Breakdown Voltage |
-30V |
Dual Supply Voltage |
-30V |
Nominal Vgs |
-2 V |
Feedback Cap-Max (Crss) |
500 pF |
Height |
1.5mm |
Length |
5mm |
Width |
4mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
In stock
Manufacturer |
ON Semiconductor |
---|---|
Part Status |
Active |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Weight |
130mg |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2005 |
Series |
PowerTrench® |
JESD-609 Code |
e4 |
Element Configuration |
Single |
Pbfree Code |
yes |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Resistance |
4.6MOhm |
Voltage - Rated DC |
-30V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Current Rating |
-20A |
Number of Elements |
1 |
Number of Channels |
1 |
Power Dissipation-Max |
2.5W Ta |
Contact Plating |
Tin |
Factory Lead Time |
18 Weeks |
Turn-Off Delay Time |
660 ns |
Power Dissipation |
2.5W |
FET Type |
P-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
4.6m Ω @ 20A, 10V |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
7540pF @ 15V |
Current - Continuous Drain (Id) @ 25°C |
20A Ta |
Gate Charge (Qg) (Max) @ Vgs |
260nC @ 10V |
Rise Time |
9ns |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±25V |
Fall Time (Typ) |
380 ns |
Continuous Drain Current (ID) |
-20A |
Threshold Voltage |
-1.8V |
Operating Mode |
ENHANCEMENT MODE |
Gate to Source Voltage (Vgs) |
25V |
Drain to Source Breakdown Voltage |
-30V |
Dual Supply Voltage |
30V |
Max Junction Temperature (Tj) |
150°C |
Nominal Vgs |
1.8 V |
Height |
1.75mm |
Length |
5mm |
Width |
4mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Turn On Delay Time |
20 ns |
Lead Free |
Lead Free |
In stock
Manufacturer |
ON Semiconductor |
---|---|
Pbfree Code |
yes |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Weight |
130mg |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2007 |
Series |
PowerTrench® |
Power Dissipation-Max |
2.5W Ta |
Factory Lead Time |
18 Weeks |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Resistance |
12.5MOhm |
Additional Feature |
LOGIC LEVEL COMPATIBLE |
Voltage - Rated DC |
30V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Current Rating |
11A |
Number of Elements |
1 |
JESD-609 Code |
e4 |
Element Configuration |
Single |
Fall Time (Typ) |
9 ns |
Turn-Off Delay Time |
28 ns |
Turn On Delay Time |
9 ns |
FET Type |
N-Channel |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
12.5m Ω @ 11A, 10V |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
1205pF @ 15V |
Current - Continuous Drain (Id) @ 25°C |
11A Ta |
Gate Charge (Qg) (Max) @ Vgs |
16nC @ 5V |
Rise Time |
5ns |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±20V |
Operating Mode |
ENHANCEMENT MODE |
Power Dissipation |
2.5W |
Continuous Drain Current (ID) |
11A |
Threshold Voltage |
1.9V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
30V |
Dual Supply Voltage |
30V |
Height |
1.5mm |
Length |
5mm |
Width |
4mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
In stock
Manufacturer |
ON Semiconductor |
---|---|
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Number of Pins |
3 |
Weight |
30mg |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Power Dissipation |
360mW |
Part Status |
Active |
Number of Terminations |
3 |
ECCN Code |
EAR99 |
Resistance |
5Ohm |
Voltage - Rated DC |
-60V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Current Rating |
-180mA |
Number of Elements |
1 |
Number of Channels |
1 |
Power Dissipation-Max |
360mW Ta |
Element Configuration |
Single |
Operating Mode |
ENHANCEMENT MODE |
Contact Plating |
Tin |
Factory Lead Time |
8 Weeks |
Continuous Drain Current (ID) |
180mA |
FET Type |
P-Channel |
Rds On (Max) @ Id, Vgs |
5 Ω @ 500mA, 10V |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
79pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
180mA Ta |
Gate Charge (Qg) (Max) @ Vgs |
2.5nC @ 10V |
Rise Time |
6.3ns |
Drain to Source Voltage (Vdss) |
60V |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
6.3 ns |
Turn-Off Delay Time |
20 ns |
Threshold Voltage |
-1.7V |
Gate to Source Voltage (Vgs) |
20V |
Turn On Delay Time |
5 ns |
Drain to Source Breakdown Voltage |
-60V |
Dual Supply Voltage |
-60V |
Max Junction Temperature (Tj) |
150°C |
Nominal Vgs |
-1.7 V |
Feedback Cap-Max (Crss) |
5 pF |
Height |
1.2mm |
Length |
2.92mm |
Width |
3.05mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Transistor Application |
SWITCHING |
Lead Free |
Lead Free |
In stock
Manufacturer |
ON Semiconductor |
---|---|
Operating Mode |
ENHANCEMENT MODE |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Number of Pins |
8 |
Weight |
130mg |
Transistor Element Material |
SILICON |
Operating Temperature |
-55°C~175°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
Series |
PowerTrench® |
Pbfree Code |
yes |
Part Status |
Active |
JESD-609 Code |
e3 |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
8 |
Termination |
SMD/SMT |
ECCN Code |
EAR99 |
Voltage - Rated DC |
-60V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Current Rating |
-3.3A |
Number of Elements |
1 |
Power Dissipation-Max |
2.5W Ta |
Element Configuration |
Single |
Contact Plating |
Tin |
Factory Lead Time |
11 Weeks |
Continuous Drain Current (ID) |
-3A |
Threshold Voltage |
-1.6V |
Transistor Application |
SWITCHING |
Rds On (Max) @ Id, Vgs |
150m Ω @ 3A, 10V |
Vgs(th) (Max) @ Id |
3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds |
732pF @ 30V |
Current - Continuous Drain (Id) @ 25°C |
3A Ta |
Gate Charge (Qg) (Max) @ Vgs |
22nC @ 10V |
Rise Time |
11ns |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
Vgs (Max) |
±20V |
Fall Time (Typ) |
10 ns |
Turn-Off Delay Time |
10 ns |
Turn On Delay Time |
8 ns |
Power Dissipation |
2.5W |
Gate to Source Voltage (Vgs) |
20V |
Drain Current-Max (Abs) (ID) |
3A |
Drain to Source Breakdown Voltage |
-60V |
Dual Supply Voltage |
60V |
Nominal Vgs |
-1.6 V |
Height |
1.5mm |
Length |
5mm |
Width |
4mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
FET Type |
P-Channel |
Lead Free |
Lead Free |
In stock
Manufacturer |
ON Semiconductor |
---|---|
JESD-609 Code |
e3 |
Contact Plating |
Tin |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Surface Mount |
YES |
Number of Pins |
3 |
Operating Temperature |
-55°C~150°C TJ |
Packaging |
Tape & Reel (TR) |
Power Dissipation |
1.5W |
Factory Lead Time |
4 Weeks |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN Code |
EAR99 |
Pin Count |
3 |
Number of Channels |
1 |
Power Dissipation-Max |
900mW Ta |
Element Configuration |
Single |
Published |
2007 |
Turn On Delay Time |
5 ns |
Vgs (Max) |
±20V |
Fall Time (Typ) |
2 ns |
Vgs(th) (Max) @ Id |
2.5V @ 250μA |
Halogen Free |
Halogen Free |
Input Capacitance (Ciss) (Max) @ Vds |
182pF @ 25V |
Current - Continuous Drain (Id) @ 25°C |
1.7A Ta |
Gate Charge (Qg) (Max) @ Vgs |
5.1nC @ 10V |
Rise Time |
7ns |
Drive Voltage (Max Rds On,Min Rds On) |
4.5V 10V |
FET Type |
N-Channel |
Rds On (Max) @ Id, Vgs |
155m Ω @ 1A, 10V |
Turn-Off Delay Time |
13 ns |
Continuous Drain Current (ID) |
2.2A |
Threshold Voltage |
2.5V |
Gate to Source Voltage (Vgs) |
20V |
Drain to Source Breakdown Voltage |
60V |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
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