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| Manufacturer |
ON Semiconductor |
|---|---|
| Element Configuration |
Single |
| Mounting Type |
Through Hole |
| Package / Case |
4-Square, GBPC-W |
| Number of Pins |
4 |
| Supplier Device Package |
GBPC-W |
| Weight |
17.21g |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Bulk |
| Part Status |
Active |
| Published |
2013 |
| Max Operating Temperature |
150°C |
| Min Operating Temperature |
'-55°C |
| Capacitance |
180pF |
| Voltage - Rated DC |
400V |
| Max Power Dissipation |
83.3W |
| Current Rating |
25A |
| Base Part Number |
GBPC2504 |
| Number of Elements |
1 |
| Mount |
Through Hole |
| Factory Lead Time |
2 Weeks |
| Output Current |
25A |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 12.5A |
| Forward Current |
25A |
| Max Reverse Leakage Current |
5μA |
| Max Surge Current |
300A |
| Current - Average Rectified (Io) |
25A |
| Forward Voltage |
1.1V |
| Peak Reverse Current |
5μA |
| Current - Reverse Leakage @ Vr |
5μA @ 400V |
| Diode Type |
Single Phase |
| Voltage - Peak Reverse (Max) |
400V |
| Height |
11.23mm |
| Length |
29mm |
| Width |
29mm |
| Radiation Hardening |
No |
| REACH SVHC |
No SVHC |
| RoHS Status |
ROHS3 Compliant |
| Power Dissipation |
83.3W |
| Lead Free |
Lead Free |
In stock
| Manufacturer |
Diodes Incorporated |
|---|---|
| Pbfree Code |
no |
| Mount |
Surface Mount |
| Mounting Type |
Surface Mount |
| Package / Case |
4-SMD, Gull Wing |
| Number of Pins |
4 |
| Weight |
299.00242mg |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-65°C~150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2006 |
| Current Rating |
1.5A |
| Factory Lead Time |
9 Weeks |
| Part Status |
Active |
| Number of Terminations |
4 |
| Termination |
SMD/SMT |
| Terminal Finish |
Matte Tin (Sn) |
| Additional Feature |
UL RECOGNIZED |
| Capacitance |
25pF |
| Voltage - Rated DC |
600V |
| Terminal Position |
DUAL |
| Peak Reflow Temperature (Cel) |
260 |
| JESD-609 Code |
e3 |
| Average Rectified Current |
1.5A |
| Number of Phases |
1 |
| Number of Elements |
1 |
| Element Configuration |
Single |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 600V |
| Output Current |
1.5A |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 1.5A |
| Forward Current |
1.5A |
| Max Surge Current |
50A |
| Forward Voltage |
1.1V |
| Base Part Number |
DF1506 |
| Pin Count |
4 |
| Peak Reverse Current |
10μA |
| Reverse Voltage (DC) |
420V |
| Height |
3.4mm |
| Length |
8.51mm |
| Width |
6.5mm |
| Radiation Hardening |
No |
| RoHS Status |
ROHS3 Compliant |
| Lead Free |
Lead Free |
In stock
| Manufacturer |
Diodes Incorporated |
|---|---|
| Pbfree Code |
no |
| Mount |
Surface Mount, Through Hole |
| Mounting Type |
Through Hole |
| Package / Case |
4-SIP, GBU |
| Number of Pins |
4 |
| Weight |
3.404012g |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Tube |
| Published |
2006 |
| Base Part Number |
GBU406 |
| Factory Lead Time |
9 Weeks |
| Part Status |
Active |
| Number of Terminations |
4 |
| Termination |
Through Hole |
| ECCN Code |
EAR99 |
| Terminal Finish |
Matte Tin (Sn) |
| Additional Feature |
UL RECOGNIZED |
| Peak Reflow Temperature (Cel) |
260 |
| JESD-609 Code |
e3 |
| Pin Count |
4 |
| Number of Phases |
1 |
| Peak Reverse Current |
5μA |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
5μA @ 600V |
| Voltage - Forward (Vf) (Max) @ If |
1V @ 2A |
| Case Connection |
ISOLATED |
| Forward Current |
4A |
| Max Surge Current |
150A |
| Output Current-Max |
4A |
| Forward Voltage |
1V |
| Average Rectified Current |
4A |
| Number of Elements |
1 |
| Element Configuration |
Single |
| Reverse Voltage (DC) |
420V |
| Height |
18.8mm |
| Length |
22.3mm |
| Width |
3.56mm |
| Radiation Hardening |
No |
| RoHS Status |
ROHS3 Compliant |
| Lead Free |
Lead Free |
In stock
| Manufacturer |
Diodes Incorporated |
|---|---|
| Series |
SBR® |
| Mount |
Surface Mount |
| Mounting Type |
Surface Mount |
| Package / Case |
4-UDFN |
| Number of Pins |
4 |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2010 |
| JESD-609 Code |
e4 |
| Pbfree Code |
yes |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Terminal Position |
DUAL |
| Peak Reflow Temperature (Cel) |
260 |
| Contact Plating |
Gold |
| Factory Lead Time |
13 Weeks |
| Number of Phases |
1 |
| Number of Elements |
4 |
| Element Configuration |
Single |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
25μA @ 100V |
| Voltage - Forward (Vf) (Max) @ If |
630mV @ 500mA |
| Forward Current |
500mA |
| Output Current-Max |
0.5A |
| Forward Voltage |
730mV |
| Peak Reverse Current |
25μA |
| Pin Count |
4 |
| Height |
580μm |
| Length |
3mm |
| Width |
3mm |
| Radiation Hardening |
No |
| RoHS Status |
ROHS3 Compliant |
| Power Dissipation-Max |
0.56W |
| Lead Free |
Lead Free |
In stock
| Manufacturer |
ON Semiconductor |
|---|---|
| Pbfree Code |
yes |
| Mounting Type |
Surface Mount |
| Package / Case |
4-SMD, Gull Wing |
| Weight |
484mg |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2017 |
| Peak Reflow Temperature (Cel) |
260 |
| JESD-609 Code |
e3 |
| Part Status |
Active |
| Number of Terminations |
4 |
| Termination |
SMD/SMT |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| HTS Code |
8541.10.00.80 |
| Terminal Position |
DUAL |
| Mount |
Through Hole |
| Factory Lead Time |
13 Weeks |
| Output Current-Max |
2A |
| Number of Elements |
4 |
| Configuration |
BRIDGE, 4 ELEMENTS |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
3μA @ 50V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 2A |
| Forward Current |
2A |
| Max Surge Current |
85A |
| Forward Voltage |
1.1V |
| Number of Phases |
1 |
| Reach Compliance Code |
not_compliant |
| Peak Reverse Current |
3μA |
| Reverse Voltage (DC) |
35V |
| Height |
2.6mm |
| Length |
8.51mm |
| Width |
6.5mm |
| JESD-30 Code |
R-PDSO-G4 |
| RoHS Status |
ROHS3 Compliant |
In stock
| Manufacturer |
ON Semiconductor |
|---|---|
| Element Configuration |
Single |
| Mounting Type |
Through Hole |
| Package / Case |
4-EDIP (0.300, 7.62mm) |
| Number of Pins |
4 |
| Supplier Device Package |
4-DIP |
| Weight |
640mg |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Tube |
| Published |
2010 |
| Part Status |
Active |
| Tolerance |
5% |
| Max Operating Temperature |
150°C |
| Min Operating Temperature |
'-55°C |
| Voltage - Rated |
10V |
| Capacitance |
1.6nF |
| Voltage - Rated DC |
800V |
| Max Power Dissipation |
3.1W |
| Current Rating |
1.5A |
| Base Part Number |
DF08 |
| Number of Elements |
1 |
| Mount |
Through Hole |
| Factory Lead Time |
13 Weeks |
| Output Current |
1.5A |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 1A |
| Forward Current |
1.5A |
| Max Reverse Leakage Current |
5μA |
| Max Surge Current |
50A |
| Current - Average Rectified (Io) |
1.5A |
| Forward Voltage |
1.1V |
| Average Rectified Current |
1.5A |
| Peak Reverse Current |
5μA |
| Current - Reverse Leakage @ Vr |
5μA @ 800V |
| Diode Type |
Single Phase |
| Voltage - Peak Reverse (Max) |
800V |
| Height |
3.3mm |
| Length |
8.51mm |
| Width |
508μm |
| Thickness |
558.8μm |
| Radiation Hardening |
No |
| REACH SVHC |
No SVHC |
| RoHS Status |
ROHS3 Compliant |
| Power Dissipation |
3.1W |
| Lead Free |
Lead Free |
In stock
| Manufacturer |
ON Semiconductor |
|---|---|
| Number of Elements |
1 |
| Mount |
Through Hole |
| Mounting Type |
Surface Mount |
| Package / Case |
4-SMD, Gull Wing |
| Number of Pins |
4 |
| Supplier Device Package |
4-SDIP |
| Weight |
484mg |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2011 |
| Part Status |
Active |
| Tolerance |
10% |
| Max Operating Temperature |
150°C |
| Min Operating Temperature |
'-55°C |
| Voltage - Rated |
16V |
| Capacitance |
1μF |
| Voltage - Rated DC |
800V |
| Max Power Dissipation |
3.1W |
| Current Rating |
1.5A |
| Base Part Number |
DF08 |
| Case Code (Metric) |
2012 |
| Case Code (Imperial) |
805 |
| Contact Plating |
Tin |
| Factory Lead Time |
13 Weeks |
| Output Current |
1.5A |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 1A |
| Forward Current |
1.5A |
| Max Surge Current |
50A |
| Breakdown Voltage |
800V |
| Current - Average Rectified (Io) |
1.5A |
| Forward Voltage |
1.1V |
| Average Rectified Current |
1.5A |
| Peak Reverse Current |
5μA |
| Diode Type |
Single Phase |
| Element Configuration |
Single |
| Voltage - Peak Reverse (Max) |
800V |
| Reverse Voltage (DC) |
560V |
| Height |
3.3mm |
| Length |
8.5mm |
| Width |
6.5mm |
| Thickness |
1.3462mm |
| Radiation Hardening |
No |
| REACH SVHC |
No SVHC |
| RoHS Status |
ROHS3 Compliant |
| Lead Free |
Lead Free |
| Current - Reverse Leakage @ Vr |
10μA @ 800V |
| Ratings |
AEC-Q200 |
In stock
| Manufacturer |
ON Semiconductor |
|---|---|
| Packaging |
Tube |
| Mount |
Through Hole |
| Mounting Type |
Through Hole |
| Package / Case |
4-SIP, TS-6P |
| Number of Pins |
4 |
| Weight |
7g |
| Diode Element Material |
SILICON |
| ECCN Code |
EAR99 |
| Factory Lead Time |
11 Weeks |
| Published |
2016 |
| JESD-609 Code |
e3 |
| Pbfree Code |
yes |
| Part Status |
Active |
| Number of Terminations |
4 |
| Operating Temperature |
'-55°C~150°C TJ |
| Terminal Finish |
Tin (Sn) |
| Max Surge Current |
250A |
| Forward Voltage |
1.1V |
| Element Configuration |
Single |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 400V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 20A |
| Case Connection |
ISOLATED |
| Forward Current |
20A |
| Additional Feature |
UL RECOGNIZED |
| Number of Elements |
1 |
| Number of Phases |
1 |
| Peak Reverse Current |
10μA |
| Radiation Hardening |
No |
| RoHS Status |
ROHS3 Compliant |
In stock
| Manufacturer |
ON Semiconductor |
|---|---|
| Terminal Finish |
Tin (Sn) |
| Mounting Type |
Through Hole |
| Package / Case |
4-SIP, TS-6P |
| Number of Pins |
4 |
| Weight |
7g |
| Diode Element Material |
SILICON |
| Packaging |
Tube |
| Published |
2016 |
| Operating Temperature |
'-55°C~150°C TJ |
| JESD-609 Code |
e3 |
| Pbfree Code |
yes |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Mount |
Through Hole |
| Factory Lead Time |
11 Weeks |
| Forward Voltage |
1.1V |
| Number of Phases |
1 |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 50V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 25A |
| Case Connection |
ISOLATED |
| Forward Current |
25A |
| Max Surge Current |
300A |
| Number of Elements |
1 |
| Additional Feature |
UL RECOGNIZED |
| Peak Reverse Current |
10μA |
| Reverse Voltage (DC) |
35V |
| Radiation Hardening |
No |
| Element Configuration |
Single |
| RoHS Status |
ROHS3 Compliant |
In stock
| Manufacturer |
ON Semiconductor |
|---|---|
| Terminal Finish |
Tin (Sn) |
| Mounting Type |
Through Hole |
| Package / Case |
4-SIP, TS-6P |
| Number of Pins |
4 |
| Weight |
7g |
| Diode Element Material |
SILICON |
| Packaging |
Tube |
| Published |
2016 |
| Operating Temperature |
'-55°C~150°C TJ |
| JESD-609 Code |
e3 |
| Pbfree Code |
yes |
| Part Status |
Active |
| Number of Terminations |
4 |
| ECCN Code |
EAR99 |
| Mount |
Through Hole |
| Factory Lead Time |
11 Weeks |
| Forward Voltage |
1.1V |
| Number of Phases |
1 |
| Diode Type |
Single Phase |
| Current - Reverse Leakage @ Vr |
10μA @ 200V |
| Voltage - Forward (Vf) (Max) @ If |
1.1V @ 25A |
| Case Connection |
ISOLATED |
| Forward Current |
25A |
| Max Surge Current |
300A |
| Number of Elements |
1 |
| Additional Feature |
UL RECOGNIZED |
| Peak Reverse Current |
10μA |
| Reverse Voltage (DC) |
140V |
| Radiation Hardening |
No |
| Element Configuration |
Single |
| RoHS Status |
ROHS3 Compliant |
In stock
| Manufacturer |
ON Semiconductor |
|---|---|
| Contact Plating |
Tin |
| Mount |
Surface Mount |
| Mounting Type |
Surface Mount |
| Package / Case |
TO-269AA, 4-BESOP |
| Number of Pins |
4 |
| Supplier Device Package |
4-SOIC |
| Weight |
228mg |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2011 |
| Tolerance |
20% |
| Element Configuration |
Single |
| Factory Lead Time |
10 Weeks |
| Max Operating Temperature |
150°C |
| Min Operating Temperature |
'-55°C |
| Voltage - Rated |
4V |
| Capacitance |
2.2μF |
| Voltage - Rated DC |
600V |
| Current Rating |
500mA |
| Base Part Number |
MB6 |
| Case Code (Metric) |
2012 |
| Case Code (Imperial) |
805 |
| Lead Pitch |
5.0038mm |
| Number of Elements |
1 |
| Part Status |
Active |
| Diode Type |
Single Phase |
| Reverse Voltage |
600V |
| Output Current |
500mA |
| Voltage - Forward (Vf) (Max) @ If |
1V @ 500mA |
| Forward Current |
500mA |
| Lead/Base Style |
Straight |
| Max Reverse Leakage Current |
5μA |
| Max Surge Current |
35A |
| Current - Average Rectified (Io) |
500mA |
| Forward Voltage |
1V |
| Average Rectified Current |
500mA |
| Peak Reverse Current |
5μA |
| Current - Reverse Leakage @ Vr |
5μA @ 600V |
| Power Dissipation |
1.4W |
| Voltage - Peak Reverse (Max) |
600V |
| Max Junction Temperature (Tj) |
150°C |
| Height |
2.9mm |
| Height Seated (Max) |
8.001mm |
| Length |
1.6002mm |
| Width |
4.2mm |
| Thickness |
558.8μm |
| Radiation Hardening |
No |
In stock
| Manufacturer |
ON Semiconductor |
|---|---|
| JESD-30 Code |
S-XDSO-N6 |
| Package / Case |
8-UDFN Exposed Pad |
| Surface Mount |
YES |
| Number of Pins |
8 |
| Transistor Element Material |
SILICON |
| Operating Temperature |
'-55°C~125°C TJ |
| Packaging |
Tape & Reel (TR) |
| Published |
2011 |
| Pbfree Code |
yes |
| Part Status |
Active |
| JESD-609 Code |
e3 |
| Number of Terminations |
6 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin (Sn) |
| Terminal Form |
NO LEAD |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Pin Count |
8 |
| Mounting Type |
Surface Mount |
| Factory Lead Time |
11 Weeks |
| Continuous Drain Current (ID) |
2.2A |
| Peak Reverse Current |
1mA |
| Current - Reverse Leakage @ Vr |
40μA @ 20V |
| Operating Mode |
ENHANCEMENT MODE |
| Power Dissipation |
1.2W |
| Voltage - Forward (Vf) (Max) @ If |
450mV @ 2A |
| Case Connection |
DRAIN |
| Transistor Application |
SWITCHING |
| Current - Average Rectified (Io) |
3.2A |
| Polarity/Channel Type |
N-CHANNEL |
| Element Configuration |
Dual |
| Number of Elements |
2 |
| Gate to Source Voltage (Vgs) |
10V |
| Drain Current-Max (Abs) (ID) |
1.16A |
| Drain to Source Resistance |
17mOhm |
| Height |
500μm |
| Length |
4mm |
| Width |
4mm |
| RoHS Status |
ROHS3 Compliant |
| Diode Type |
Single Phase |
| Lead Free |
Lead Free |
In stock
| Manufacturer |
Vishay Semiconductor Diodes Division |
|---|---|
| JESD-609 Code |
e3 |
| Contact Plating |
Tin |
| Mount |
Through Hole |
| Mounting Type |
Through Hole |
| Package / Case |
4-SIP, GBU |
| Number of Pins |
4 |
| Diode Element Material |
SILICON |
| Operating Temperature |
'-55°C~150°C TJ |
| Packaging |
Bulk |
| Element Configuration |
Single |
| Factory Lead Time |
8 Weeks |
| Pbfree Code |
yes |
| Part Status |
Active |
| Number of Terminations |
4 |
| Additional Feature |
UL RECOGNIZED |
| Base Part Number |
GBU8M |
| Pin Count |
4 |
| Number of Elements |
1 |
| Published |
2011 |
| Diode Type |
Single Phase |
| Number of Phases |
1 |
| Peak Reverse Current |
5μA |
| Case Connection |
ISOLATED |
| Forward Current |
8A |
| Max Reverse Leakage Current |
5μA |
| Max Surge Current |
200A |
| Output Current-Max |
3.9A |
| Current - Average Rectified (Io) |
3.9A |
| Forward Voltage |
1V |
| Average Rectified Current |
8A |
| Current - Reverse Leakage @ Vr |
5μA @ 1000V |
| Voltage - Forward (Vf) (Max) @ If |
1V @ 8A |
| Height |
18.8mm |
| Length |
22.3mm |
| Width |
3.56mm |
| Radiation Hardening |
No |
| RoHS Status |
ROHS3 Compliant |
| Lead Free |
Lead Free |
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