Taiwan Semiconductor Corporation TSM2308CX RFG

SKU: TSM2308CX RFG-11

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Manufacturer Part :
TSM2308CX RFG
Manufacturer :
Taiwan Semiconductor Corporation
Package :
TO-236-3, SC-59, SOT-23-3
RoHS :
ROHS3 Compliant
TSM2308CX RFG Datasheet :

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Description

Specification

Processor

Manufacturer

Taiwan Semiconductor Corporation

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Package / Case

TO-236-3, SC-59, SOT-23-3

Current - Continuous Drain (Id) @ 25℃

3A Ta

Drive Voltage (Max Rds On, Min Rds On)

4.5V 10V

Power Dissipation (Max)

1.25W Ta

Operating Temperature

-55°C~150°C TJ

Packaging

Digi-Reel®

JESD-609 Code

e3

Part Status

Not For New Designs

Mounting Type

Surface Mount

Peak Reflow Temperature (Cel)

260

Terminal Finish

Tin (Sn)

Time@Peak Reflow Temperature-Max (s)

30

FET Type

N-Channel

Rds On (Max) @ Id, Vgs

156m Ω @ 3A, 10V

Vgs(th) (Max) @ Id

2.5V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

511pF @ 15V

Gate Charge (Qg) (Max) @ Vgs

4.3nC @ 4.5V

Drain to Source Voltage (Vdss)

60V

Vgs (Max)

±20V

RoHS Status

ROHS3 Compliant

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