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Manufacturer |
Toshiba Semiconductor and Storage |
---|---|
Packaging |
Tape & Reel (TR) |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Number of Pins |
3 |
Weight |
7.994566mg |
Transistor Element Material |
SILICON |
Terminal Form |
GULL WING |
Factory Lead Time |
52 Weeks |
Published |
2009 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
3 |
Max Power Dissipation |
100mW |
Terminal Position |
DUAL |
Operating Temperature |
125°C TJ |
Element Configuration |
Single |
Current - Drain (Idss) @ Vds (Vgs=0) |
300μA @ 10V |
Voltage - Cutoff (VGS off) @ Id |
400mV @ 100nA |
Transistor Application |
SWITCHING |
Input Capacitance (Ciss) (Max) @ Vds |
8.2pF @ 10V |
Drain to Source Voltage (Vdss) |
10V |
Continuous Drain Current (ID) |
750μA |
Gate to Source Voltage (Vgs) |
-30V |
FET Technology |
JUNCTION |
Operating Mode |
DEPLETION MODE |
FET Type |
N-Channel |
Voltage - Breakdown (V(BR)GSS) |
50V |
Current Drain (Id) - Max |
6.5mA |
Height |
1.1mm |
Length |
2.9mm |
Width |
1.5mm |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
In stock
Manufacturer |
Linearin |
---|---|
Package / Case |
SOT-23-3 |
Mounting Style |
SMD/SMT |
Drain-Source Current at Vgs=0 |
20 mA |
Gate-Source Cutoff Voltage |
– 2 V |
Id - Continuous Drain Current |
2 mA |
Maximum Operating Temperature |
+ 150 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
400 mW |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
40 V |
Vgs - Gate-Source Breakdown Voltage |
– 40 V |
Technology |
Si |
Configuration |
Single |
In stock
Manufacturer |
Linearin |
---|---|
Package / Case |
SOT-23-3 |
Mounting Style |
SMD/SMT |
Drain-Source Current at Vgs=0 |
30 mA |
Gate-Source Cutoff Voltage |
– 2 V |
Id - Continuous Drain Current |
2 mA |
Maximum Operating Temperature |
+ 150 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
400 mW |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
40 V |
Vgs - Gate-Source Breakdown Voltage |
– 40 V |
Series |
LSK170 |
Technology |
Si |
Configuration |
Single |
In stock
Manufacturer |
Linearin |
---|---|
Mounting Type |
Surface Mount |
Package / Case |
TO-236-3, SC-59, SOT-23-3 |
Supplier Device Package |
SOT-23-3 |
Package |
Strip |
Product Status |
Active |
Operating Temperature |
-55°C ~ 135°C (TJ) |
Series |
LSK170X-1 |
Power - Max |
400 mW |
FET Type |
N-Channel |
Input Capacitance (Ciss) (Max) @ Vds |
20pF @ 15V |
Current - Drain (Idss) @ Vds (Vgs=0) |
20 mA @ 10 V |
Voltage - Cutoff (VGS off) @ Id |
200 mV @ 1 nA |
Voltage - Breakdown (V(BR)GSS) |
40 V |
In stock
Manufacturer |
Linearin |
---|---|
Package / Case |
TO-71-6 |
Mounting Style |
Through Hole |
Drain-Source Current at Vgs=0 |
6.5 mA |
Gate-Source Cutoff Voltage |
6 mV |
Id - Continuous Drain Current |
2 mA |
Maximum Operating Temperature |
+ 150 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
400 mW |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
40 V |
Vgs - Gate-Source Breakdown Voltage |
– 40 V |
Series |
LSK389 |
Technology |
Si |
Configuration |
Dual |
In stock
Manufacturer |
Linearin |
---|---|
Package / Case |
SOT-23-6 |
Mounting Style |
SMD/SMT |
Drain-Source Current at Vgs=0 |
5 mA |
Gate-Source Cutoff Voltage |
8 mV |
Id - Continuous Drain Current |
2 mA |
Maximum Operating Temperature |
+ 150 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
500 mW |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
60 V |
Vgs - Gate-Source Breakdown Voltage |
– 60 V |
Technology |
Si |
Configuration |
Dual |
In stock
Manufacturer |
Microchip |
---|---|
Mfr |
Microchip Technology |
Contact Plating |
Tin |
Mounting Type |
Surface Mount |
Package / Case |
TO-18-3 |
Surface Mount |
YES |
Supplier Device Package |
3-UB (3.09×2.45) |
Number of Terminals |
3 |
Transistor Element Material |
SILICON |
Mounting Style |
Through Hole |
Base Product Number |
2N4858 |
Base/Housing Material |
Polyamide 46 |
Body Orientation |
Straight |
Brand |
Microchip Technology |
Factory Pack Quantity:Factory Pack Quantity |
1 |
Ihs Manufacturer |
MICROSEMI CORP |
Pbfree Code |
No |
Contact Material |
Phosphor Bronze |
Mounting |
Surface Mount |
Operating Temperature-Max |
175 °C |
Package |
Bulk |
Package Body Material |
CERAMIC, METAL-SEALED COFIRED |
Package Description |
SMALL OUTLINE, R-CDSO-N3 |
Package Shape |
RECTANGULAR |
Package Style |
SMALL OUTLINE |
Part Life Cycle Code |
Active |
Product Status |
Active |
Reflow Temperature-Max (s) |
NOT SPECIFIED |
Risk Rank |
5.09 |
Rohs Code |
No |
Termination Method |
Solder |
Operating Temperature |
-40 to 105 °C |
JESD-609 Code |
e0 |
Manufacturer Part Number |
2N4858UB |
ECCN Code |
EAR99 |
Configuration |
SINGLE |
Operating Mode |
DEPLETION MODE |
HTS Code |
8541.21.00.95 |
Subcategory |
Transistors |
Pitch |
2.5400 mm |
Technology |
Si |
Terminal Position |
DUAL |
Terminal Form |
NO LEAD |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
compliant |
Pin Count |
3 |
JESD-30 Code |
R-CDSO-N3 |
Qualification Status |
Not Qualified |
Contact Gender |
Socket |
Housing Color |
Red |
Number of Elements |
1 |
Type |
JFET |
Terminal Finish |
TIN LEAD |
Power - Max |
360 mW |
FET Type |
N-Channel |
Input Capacitance (Ciss) (Max) @ Vds |
18pF @ 10V (VGS) |
Drain to Source Voltage (Vdss) |
40 V |
Polarity/Channel Type |
N-CHANNEL |
Product Type |
JFETs |
Drain-source On Resistance-Max |
60 Ω |
DS Breakdown Voltage-Min |
40 V |
FET Technology |
JUNCTION |
Feedback Cap-Max (Crss) |
8 pF |
Current - Drain (Idss) @ Vds (Vgs=0) |
8 mA @ 15 V |
Voltage - Cutoff (VGS off) @ Id |
4 V @ 500 pA |
Voltage - Breakdown (V(BR)GSS) |
40 V |
Resistance - RDS(On) |
60 Ohms |
Product Category |
JFET |
Product Length |
19.8 mm |
In stock
Manufacturer |
Microchip |
---|---|
Package Body Material |
METAL |
Manufacturer Part Number |
2N5114 |
Ihs Manufacturer |
MICROSEMI CORP |
Factory Pack Quantity:Factory Pack Quantity |
1 |
Brand |
Microchip Technology |
Base Product Number |
2N5114 |
Transistor Element Material |
SILICON |
Package |
Bulk |
Number of Terminals |
3 |
Supplier Device Package |
TO-18 (TO-206AA) |
Number of Pins |
3 |
Surface Mount |
NO |
Package / Case |
TO-18-3 |
Mounting Type |
Through Hole |
Operating Temperature-Max |
200 °C |
Type |
JFET |
Mounting Style |
Through Hole |
Package Description |
TO-18, 3 PIN |
Package Shape |
ROUND |
Package Style |
CYLINDRICAL |
Part Life Cycle Code |
Active |
Part Package Code |
BCY |
Product Status |
Active |
Reflow Temperature-Max (s) |
NOT SPECIFIED |
Risk Rank |
5.08 |
Rohs Code |
No |
Operating Temperature |
-65°C ~ 200°C (TJ) |
Packaging |
Bulk |
Series |
Military, MIL-PRF-19500 |
JESD-609 Code |
e0 |
Pbfree Code |
No |
ECCN Code |
EAR99 |
Mfr |
Microchip Technology |
Mount |
Through Hole |
Power - Max |
500 mW |
Pin Count |
3 |
Operating Mode |
DEPLETION MODE |
Element Configuration |
Single |
Configuration |
SINGLE |
Number of Elements |
1 |
Qualification Status |
Not Qualified |
JESD-30 Code |
O-MBCY-W3 |
Reach Compliance Code |
unknown |
Max Operating Temperature |
200 °C |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Terminal Form |
WIRE |
Terminal Position |
BOTTOM |
Technology |
Si |
Subcategory |
Transistors |
HTS Code |
8541.21.00.95 |
FET Type |
P-Channel |
FET Technology |
JUNCTION |
Terminal Finish |
TIN LEAD |
Drain-source On Resistance-Max |
75 Ω |
Min Operating Temperature |
-65 °C |
Drain to Source Voltage (Vdss) |
30 V |
Polarity/Channel Type |
P-CHANNEL |
Product Type |
JFETs |
JEDEC-95 Code |
TO-206AA |
Gate to Source Voltage (Vgs) |
30 V |
Input Capacitance (Ciss) (Max) @ Vds |
25pF @ 15V |
Resistance - RDS(On) |
75 Ohms |
DS Breakdown Voltage-Min |
30 V |
Power Dissipation-Max (Abs) |
0.5 W |
Feedback Cap-Max (Crss) |
7 pF |
Current - Drain (Idss) @ Vds (Vgs=0) |
90 mA @ 18 V |
Voltage - Cutoff (VGS off) @ Id |
10 V @ 1 nA |
Voltage - Breakdown (V(BR)GSS) |
30 V |
Product Category |
JFET |
In stock
Manufacturer |
Qorvo |
---|---|
Package / Case |
TO-247-3 |
Mounting Style |
SMD/SMT |
Id - Continuous Drain Current |
47 A |
Maximum Operating Temperature |
+ 175 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
242 W |
Rds On - Drain-Source Resistance |
33 mOhms |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
750 V |
Series |
UJ4C |
Technology |
SiC |
In stock
Manufacturer |
Qorvo |
---|---|
Package / Case |
TO-247-3 |
Mounting Style |
Through Hole |
Id - Continuous Drain Current |
28 A |
Maximum Operating Temperature |
+ 175 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
155 W |
Rds On - Drain-Source Resistance |
74 mOhms |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
750 V |
Series |
UJ4C |
Technology |
SiC |
Configuration |
Single |
In stock
Manufacturer |
Qorvo |
---|---|
Package / Case |
D2PAK-7L |
Mounting Style |
SMD/SMT |
Id - Continuous Drain Current |
104 A |
Maximum Operating Temperature |
+ 175 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
357 W |
Rds On - Drain-Source Resistance |
11 mOhms |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
750 V |
Technology |
SiC |
In stock
Manufacturer |
Qorvo |
---|---|
Package / Case |
D2PAK-7L |
Mounting Style |
SMD/SMT |
Id - Continuous Drain Current |
72 A |
Maximum Operating Temperature |
+ 175 C |
Minimum Operating Temperature |
– 55 C |
Pd - Power Dissipation |
259 W |
Rds On - Drain-Source Resistance |
18 mOhms |
Transistor Polarity |
N-Channel |
Vds - Drain-Source Breakdown Voltage |
750 V |
Technology |
SiC |
In stock
Manufacturer |
Texas Instruments |
---|---|
Package Style |
CYLINDRICAL |
Number of Terminals |
3 |
Transistor Element Material |
SILICON |
Ihs Manufacturer |
MICROSEMI CORP |
Manufacturer Part Number |
2N4860 |
Operating Temperature-Max |
200 °C |
Package Body Material |
METAL |
Package Description |
TO-18, 3 PIN |
ECCN Code |
EAR99 |
Surface Mount |
NO |
Part Life Cycle Code |
Active |
Part Package Code |
BCY |
Reflow Temperature-Max (s) |
NOT SPECIFIED |
Risk Rank |
5.05 |
Rohs Code |
No |
JESD-609 Code |
e0 |
Pbfree Code |
No |
Package Shape |
ROUND |
Terminal Finish |
TIN LEAD |
Number of Elements |
1 |
Configuration |
SINGLE |
Terminal Form |
WIRE |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Reach Compliance Code |
unknown |
Pin Count |
3 |
Reference Standard |
MIL-19500/385 |
JESD-30 Code |
O-MBCY-W3 |
Qualification Status |
Not Qualified |
HTS Code |
8541.21.00.95 |
Terminal Position |
BOTTOM |
Operating Mode |
DEPLETION MODE |
Polarity/Channel Type |
N-CHANNEL |
JEDEC-95 Code |
TO-206AA |
Drain-source On Resistance-Max |
40 Ω |
DS Breakdown Voltage-Min |
30 V |
FET Technology |
JUNCTION |
Power Dissipation-Max (Abs) |
1.8 W |
Feedback Cap-Max (Crss) |
8 pF |
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